MOSFET P-CH 30V SOT883
| Parameter Name | Attribute value |
| Brand Name | Nexperia |
| Maker | Nexperia |
| Parts packaging code | DFN |
| package instruction | DFN1006-3, 3 PIN |
| Contacts | 3 |
| Manufacturer packaging code | SOT883 |
| Reach Compliance Code | compliant |
| Samacsys Description | MOSFET 30V P-Channel Trench MOSFET |
| Shell connection | DRAIN |
| Configuration | SINGLE WITH BUILT-IN DIODE |
| Minimum drain-source breakdown voltage | 30 V |
| Maximum drain current (ID) | 1 A |
| Maximum drain-source on-resistance | 0.51 Ω |
| FET technology | METAL-OXIDE SEMICONDUCTOR |
| JESD-30 code | R-PBCC-N3 |
| Humidity sensitivity level | 1 |
| Number of components | 1 |
| Number of terminals | 3 |
| Operating mode | ENHANCEMENT MODE |
| Package body material | PLASTIC/EPOXY |
| Package shape | RECTANGULAR |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | 260 |
| Polarity/channel type | P-CHANNEL |
| Guideline | IEC-60134 |
| surface mount | YES |
| Terminal form | NO LEAD |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 30 |
| transistor applications | SWITCHING |
| Transistor component materials | SILICON |
| PMZ320UPEYL | 934068611315 | |
|---|---|---|
| Description | MOSFET P-CH 30V SOT883 | MOSFET P-CH 30V SOT883 |
| Maker | Nexperia | Nexperia |
| package instruction | DFN1006-3, 3 PIN | DFN1006-3, 3 PIN |
| Reach Compliance Code | compliant | compliant |
| Shell connection | DRAIN | DRAIN |
| Configuration | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
| Minimum drain-source breakdown voltage | 30 V | 30 V |
| Maximum drain current (ID) | 1 A | 1 A |
| Maximum drain-source on-resistance | 0.51 Ω | 0.51 Ω |
| FET technology | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
| JESD-30 code | R-PBCC-N3 | R-PBCC-N3 |
| Humidity sensitivity level | 1 | 1 |
| Number of components | 1 | 1 |
| Number of terminals | 3 | 3 |
| Operating mode | ENHANCEMENT MODE | ENHANCEMENT MODE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | 260 | NOT SPECIFIED |
| Polarity/channel type | P-CHANNEL | P-CHANNEL |
| Guideline | IEC-60134 | IEC-60134 |
| surface mount | YES | YES |
| Terminal form | NO LEAD | NO LEAD |
| Terminal location | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | 30 | NOT SPECIFIED |
| transistor applications | SWITCHING | SWITCHING |
| Transistor component materials | SILICON | SILICON |
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