TLP5774
Photocouplers
GaAℓAs Infrared LED & Photo IC
TLP5774
1. Applications
•
•
•
•
•
Photovoltaic (PV) Power Conditioning Systems
AC Servos
Compact Motor Drivers
Industrial Sewing Machines
Industrial Inverters
2. General
The TLP5774 consists of a GaAℓAs infrared light-emitting diode and an integrated high-gain, high-speed
photodetector and is housed in the 6-pin SO6L package.
The TLP5774 is 50 % smaller than the 8-pin DIP package and meets the reinforced insulation class requirements
of international safety standards.
Therefore the mounting area can be reduced in equipment requiring the safety standard certification.
The TLP5774 has an internal faraday shield that provides a guaranteed common-mode transient immunity of
±35
kV/µs.
In particular, this photocoupler guarantees operation with a low threshold input current. It allows bufferless
direct drive from a microcomputer. In addition, the TLP5774 has rail to rail output, and this enables stable
operation and better switching performance in system.
3. Features
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
Buffer logic type (totem pole output)
Output peak current:
±4.0
A (max)
Operating temperature: -40 to 110
Supply current: 3 mA (max)
Supply voltage: 10 to 30 V
Threshold input current: 2 mA (max)
Propagation delay time: 150 ns (max)
Common-mode transient immunity:
±35
kV/µs (min)
Isolation voltage: 5000 Vrms (min)
UL-approved: UL1577, File No.E67349
cUL-approved: CSA Component Acceptance Service No.5A File No.E67349
VDE-approved: EN60747-5-5, EN60065 or EN60950-1 (Note 1)
: EN62368-1 (Pending) (Note 1)
CQC-approved: GB4943.1, GB8898 Thailand Factory
Note 1: When a VDE approved type is needed, please designate the Option (D4)
(D4).
(10) Safety standards
Start of commercial production
©2016-2018
Toshiba Electronic Devices & Storage Corporation
1
2016-02
2018-03-06
Rev.5.0
TLP5774
4. Packaging (Note)
TLP5774
TLP5774(LF4)
11-4N1A
11-4N101A
Note:
Lead-formed product: (LF4)
5. Pin Assignment
1: Anode
2: N.C.
3: Cathode
4: GND
5: V
O
(Output)
6: V
CC
6. Internal Circuit
Note:
A 1-µF bypass capacitor must be connected between pin 6 and pin 4.
©2016-2018
Toshiba Electronic Devices & Storage Corporation
2
2018-03-06
Rev.5.0
TLP5774
7. Principle of Operation
7.1. Truth Table
Input
H
L
LED
ON
OFF
M1
ON
OFF
M2
OFF
ON
Output
H
L
7.2. Mechanical Parameters
Characteristics
Height
Creepage distances
Clearance distances
Internal isolation thickness
Size
2.3 (max)
8.0 (min)
8.0 (min)
0.4 (min)
Unit
mm
8. Absolute Maximum Ratings (Note) (Unless otherwise specified, T
a
= 25
)
Characteristics
LED
Input forward current
Input forward current derating
Peak transient input forward
current
Peak transient input forward
current derating
Input reverse voltage
Input power dissipation
Input power dissipation
derating
Detector Peak high-level output current
Peak low-level output current
Output voltage
Supply voltage
Output power dissipation
Output power dissipation
derating
Common Operating temperature
Storage temperature
Lead soldering temperature
Isolation voltage
(10 s)
(AC, 60 s, R.H.
≤
60 %)
(T
a
≥
85
)
(T
a
≥
85
)
(T
a
= -40 to 110
)
(T
a
= -40 to 110
)
(T
a
≥
85
)
(T
a
≥
105
)
Symbol
I
F
∆I
F
/∆T
a
I
FPT
∆I
FPT
/∆T
a
V
R
P
D
∆P
D
/∆T
a
I
OPH
I
OPL
V
O
V
CC
P
O
∆P
O
/∆T
a
T
opr
T
stg
T
sol
BV
S
(Note 3)
(Note 4)
(Note 2)
(Note 2)
(Note 1)
Note
Rating
8
-0.4
1
-25
5
20
-0.5
-4.0
+4.0
35
35
500
-12.5
-40 to 110
-55 to 125
260
5000
Vrms
mW
mW/
V
Unit
mA
mA/
A
mA/
V
mW
mW/
A
Note:
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability
Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e.
reliability test report and estimated failure rate, etc).
Note 1: Pulse width (PW)
≤
1
µs,
300 pps
Note 2: Exponential waveform. Pulse width
≤
2
µs,
f
≤
15 kHz
Note 3:
≥
2 mm below seating plane.
Note 4: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6
are shorted together.
©2016-2018
Toshiba Electronic Devices & Storage Corporation
3
2018-03-06
Rev.5.0
TLP5774
9. Recommended Operating Conditions (Note)
Characteristics
Input on-state current
Input off-state voltage
Supply voltage
Peak high-level output current
Peak low-level output current
Operating frequency
Symbol
I
F(ON)
V
F(OFF)
V
CC
I
OPH
I
OPL
f
(Note 3)
(Note 2)
Note
(Note 1)
Min
3
0
10
Typ.
Max
6
0.8
30
-4.0
+4.0
50
kHz
A
Unit
mA
V
The recommended operating conditions are given as a design guide necessary to obtain the intended
performance of the device. Each parameter is an independent value. When creating a system design using
this device, the electrical characteristics specified in this data sheet should also be considered.
Note: A ceramic capacitor (1
µF)
should be connected between pin 6 (V
CC
) and pin 4 (GND) to stabilize the operation
of a high-gain linear amplifier. Otherwise, this photocoupler may not switch properly. The bypass capacitor
should be placed within 1 cm of each pin.
Note 1: The rise and fall times of the input on-current should be less than 0.5
µs.
Note 2: Denotes the operating range, not the recommended operating condition.
Note 3: Exponential waveform. I
OPH
≥
-4.0 A (≤ 90 ns), I
OPL
≤
4.0 A (≤ 90 ns), T
a
= 110
Note:
10. Electrical Characteristics (Note) (Unless otherwise specified, T
a
= -40 to 110
)
Characteristics
Input forward voltage
Input forward voltage
temperature coefficient
Input reverse current
Input capacitance
Peak high-level output current
Symbol
V
F
∆V
F
/∆T
a
I
R
C
t
I
OPH
(Note 1)
Fig.
13.1.1
Note
Test
Circuit
Test Condition
I
F
= 8 mA, T
a
= 25
I
F
= 8 mA
V
R
= 5 V, T
a
= 25
V = 0 V, f = 1 MHz, T
a
= 25
I
F
= 5 mA, V
CC
= 30 V,
V
6-5
= -3.5 V
I
F
= 5 mA, V
CC
= 10 V,
V
6-5
= -7 V
Peak low-level output current
I
OPL
(Note 1)
Fig.
13.1.2
I
F
= 0 mA, V
CC
= 30 V,
V
5-4
= 2.5 V
I
F
= 0 mA, V
CC
= 10 V,
V
5-4
= 7 V
High-level output voltage
Low-level output voltage
High-level supply current
Low-level supply current
Threshold input current (L/H)
Threshold input voltage (H/L)
Supply voltage
UVLO threshold voltage
UVLO hysteresis
V
OH
V
OL
I
CCH
I
CCL
I
FLH
V
FHL
V
CC
V
UVLO+
V
UVLO-
UVLO
HYS
Fig.
13.1.3
Fig.
13.1.4
Fig.
13.1.5
Fig.
13.1.6
I
F
= 2 mA, V
CC
= 10 V,
I
O
= -100 mA
V
F
= 0.8 V, V
CC
= 10 V,
I
O
= 100 mA
I
F
= 5 mA, V
CC
= 30 V,
V
O
= Open
I
F
= 0 mA, V
CC
= 30 V,
V
O
= Open
V
CC
= 10 V, V
O
> 1 V
V
CC
= 10 V, V
O
< 1 V
I
F
= 5 mA, V
O
> 2.5 V
I
F
= 5 mA, V
O
< 2.5 V
Min
1.5
1.2
3.0
9.7
0.8
10
7.5
7.5
Typ.
1.65
-1.8
60
1.8
1.7
8.6
8.3
0.3
Max
1.9
10
-1.2
-3.0
0.2
3
3
2
30
9.5
9.5
V
mA
V
Unit
V
mV/
µA
pF
A
Note:
Note:
All typical values are at T
a
= 25
.
This device is designed for low power consumption, making it more sensitive to ESD than its predecessors.
Extra care should be taken in the design of circuitry and pc board implementation to avoid ESD problems.
Note 1: I
O
application time
≤
50
µs;
single pulse.
©2016-2018
Toshiba Electronic Devices & Storage Corporation
4
2018-03-06
Rev.5.0
TLP5774
11. Isolation Characteristics (Unless otherwise specified, T
a
= 25
)
Characteristics
Total capacitance (input to output)
Isolation resistance
Isolation voltage
Symbol
C
S
R
S
BV
S
Note
Test Conditions
Min
1
×
10
12
5000
Typ.
1.0
10
14
Max
Unit
pF
Ω
Vrms
(Note 1) V
S
= 0 V, f = 1 MHz
(Note 1) V
S
= 500 V, R.H.
≤
60 %
(Note 1) AC, 60 s
Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6
are shorted together.
12. Switching Characteristics (Note) (Unless otherwise specified, T
a
= -40 to 110
)
Characteristics
Propagation delay time
(L/H)
Propagation delay time
(H/L)
Rise time
Fall time
Pulse width distortion
Propagation delay skew
(device to device)
Common-mode transient
immunity at output high
Common-mode transient
immunity at output low
Symbol
t
pLH
t
pHL
t
r
t
f
|t
pHL
-t
pLH
|
t
psk
CM
H
(Note 1)
(Note 1)
(Note 1)
(Note 1),
(Note 2)
(Note 3)
Fig.
13.1.8
Note
(Note 1)
Test
Circuit
Fig.
13.1.7
Test Condition
I
F
= 0
→
5 mA, V
CC
= 30 V,
R
g
= 10
Ω,
C
g
= 25 nF
I
F
= 5
→
0 mA, V
CC
= 30 V,
R
g
= 10
Ω,
C
g
= 25 nF
I
F
= 0
→
5 mA, V
CC
= 30 V,
R
g
= 10
Ω,
C
g
= 25 nF
I
F
= 5
→
0 mA, V
CC
= 30 V,
R
g
= 10
Ω,
C
g
= 25 nF
I
F
= 0
←→
5 mA, V
CC
= 30 V,
R
g
= 10
Ω,
C
g
= 25 nF
V
CM
= 1000 V
p-p
, I
F
= 5 mA,
V
CC
= 30 V, T
a
= 25
,
V
O(min)
= 26 V
V
CM
= 1000 V
p-p
, I
F
= 0 mA,
V
CC
= 30 V, T
a
= 25
,
V
O(max)
= 1 V
Min
50
50
-80
±35
Typ.
15
8
±40
Max
150
150
50
80
kV/µs
Unit
ns
CM
L
(Note 4)
±35
±40
Note: All typical values are at T
a
= 25
.
Note 1: Input signal (f = 25 kHz, duty = 50 %, t
r
= t
f
= 5 ns or less).
C
L
is approximately 15 pF which includes probe and stray wiring capacitance.
Note 2: The propagation delay skew, t
psk
, is equal to the magnitude of the worst-case difference in t
pHL
and/or t
pLH
that will be seen between units at the same given conditions (supply voltage, input current, temperature, etc).
Note 3: CM
H
is the maximum rate of fall of the common mode voltage that can be sustained with the output voltage in
the logic high state (V
O
> 26 V).
Note 4: CM
L
is the maximum rate of rise of the common mode voltage that can be sustained with the output voltage
in the logic low state (V
O
< 1 V).
©2016-2018
Toshiba Electronic Devices & Storage Corporation
5
2018-03-06
Rev.5.0
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