AM29LV160BT-70REI datasheet, PDF

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AM29LV160BT-70REI: Description1M X 16 FLASH 3V PROM, 70 ns, PDSO48; Categorystorage; File Size906KB，54 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM29LV160BT-70REI Overview

1M X 16 FLASH 3V PROM, 70 ns, PDSO48

AM29LV160BT-70REI Parametric

Parameter Name	Attribute value
Number of functions	1
Number of terminals	48
Maximum operating temperature	70 Cel
Minimum operating temperature	0.0 Cel
Maximum supply/operating voltage	3.6 V
Minimum supply/operating voltage	3 V
Rated supply voltage	3.3 V
maximum access time	70 ns
Processing package description	MO-142DD, TSOP-48
state	TRANSFERRED
Craftsmanship	CMOS
packaging shape	Rectangle
Package Size	SMALL OUTLINE, THIN PROFILE
surface mount	Yes
Terminal form	GULL WING
Terminal spacing	0.5000 mm
Terminal location	pair
Packaging Materials	Plastic/Epoxy
Temperature level	COMMERCIAL
memory width	16
organize	1M × 16
storage density	1.68E7 deg
operating mode	ASYNCHRONOUS
Number of digits	1.05E6 words
Number of digits	1M
Spare memory width	8
Memory IC type	FLASH 3V programmable read-only memory
serial parallel	parallel

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Am29LV160B

Data Sheet

RETIRED

PRODUCT

This product has been retired and is not recommended for designs. For new and current designs,

S29AL016D

supersedes

Am29LV160B

and is the factory-recommended migration path. Please refer to

the

S29AL016D

datasheet for specifications and ordering information. Availability of this document is

retained for reference and historical purposes only.

June 2005

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that

originally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appro-

priate, and changes will be noted in a revision summary.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number

21358

Revision

Amendment

Issue Date

June 6, 2005

TABLE OF CONTENTS

Distinctive Characteristics . . . . . . . . . . . . . . . . . . . 1

General Description . . . . . . . . . . . . . . . . . . . . . . . . 2

Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 5

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 6

Special Handling Instructions ................................................... 7

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 9

Standard Products .................................................................... 9

Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10

Table 1. Am29LV160B Device Bus Operations .............................. 10

Figure 6. Toggle Bit Algorithm........................................................ 28

DQ3: Sector Erase Timer ....................................................... 29

Table 10. Write Operation Status................................................... 29

Absolute Maximum Ratings . . . . . . . . . . . . . . . . 30

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 30

Commercial (C) Devices ......................................................... 30

Industrial (I) Devices ............................................................... 30

Extended (E) Devices ............................................................. 30

Supply Voltages .............................................................. 30

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 32

CMOS Compatible .................................................................. 32

Zero Power Flash ................................................................... 33

Figure 9. I

CC1

Current vs. Time (Showing Active and Automatic Sleep

Currents) ........................................................................................ 33

Figure 10. Typical I

CC1

vs. Frequency ........................................... 33

Word/Byte Configuration ........................................................ 10

Requirements for Reading Array Data ................................... 10

Writing Commands/Command Sequences ............................ 10

Program and Erase Operation Status .................................... 11

Standby Mode ........................................................................ 11

Automatic Sleep Mode ........................................................... 11

RESET#: Hardware Reset Pin ............................................... 12

Output Disable Mode .............................................................. 12

Table 2. Sector Address Tables (Am29LV160BT).......................... 13

Table 3. Sector Address Tables (Am29LV160BB).......................... 14

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Figure 11. Test Setup..................................................................... 34

Table 11. Test Specifications ......................................................... 34

Key to Switching Waveforms . . . . . . . . . . . . . . . 34

Figure 12. Input Waveforms and Measurement Levels ................. 34

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35

Read Operations .................................................................... 35

Figure 13. Read Operations Timings ............................................. 35

Autoselect Mode ..................................................................... 15

Table 4. Am29LV160B Autoselect Codes (High Voltage Method).. 15

Hardware Reset (RESET#) .................................................... 36

Figure 14. RESET# Timings .......................................................... 36

Sector Protection/Unprotection ............................................... 15

Temporary Sector Unprotect .................................................. 16

Figure 1. Temporary Sector Unprotect Operation........................... 16

In-System Sector Protect/Unprotect Algorithms 17

Word/Byte Configuration (BYTE#) ........................................ 37

Figure 15. BYTE# Timings for Read Operations............................ 37

Figure 16. BYTE# Timings for Write Operations............................ 37

Erase/Program Operations ..................................................... 38

Figure 17. Program Operation Timings..........................................

Figure 18. Chip/Sector Erase Operation Timings ..........................

Figure 19. Data# Polling Timings (During Embedded Algorithms).

Figure 20. Toggle Bit Timings (During Embedded Algorithms)......

Figure 21. DQ2 vs. DQ6 for Erase and Erase

Suspend Operations ......................................................................

Common Flash Memory Interface (CFI) . . . . . . . 18

Table 5. CFI Query Identification String .......................................... 18

Table 6. System Interface String..................................................... 19

Table 7. Device Geometry Definition .............................................. 19

Table 8. Primary Vendor-Specific Extended Query ........................ 20

Hardware Data Protection ...................................................... 20

Low V

Write Inhibit .............................................................. 20

Write Pulse “Glitch” Protection ............................................... 20

Logical Inhibit .......................................................................... 20

Power-Up Write Inhibit ............................................................ 20

Command Definitions . . . . . . . . . . . . . . . . . . . . . . 21

Reading Array Data ................................................................ 21

Reset Command ..................................................................... 21

Autoselect Command Sequence ............................................ 21

Word/Byte Program Command Sequence ............................. 21

Unlock Bypass Command Sequence ..................................... 22

Figure 3. Program Operation .......................................................... 22

Temporary Sector Unprotect .................................................. 42

Figure 22. Sector Protect/Unprotect Timing Diagram .................... 43

Alternate CE# Controlled Erase/Program Operations ............ 44

Figure 23. Alternate CE# Controlled Write Operation Timings ...... 45

Chip Erase Command Sequence ........................................... 22

Sector Erase Command Sequence ........................................ 23

Erase Suspend/Erase Resume Commands ........................... 23

Figure 4. Erase Operation............................................................... 24

Table 9. Am29LV160B Command Definitions................................. 25

Write Operation Status . . . . . . . . . . . . . . . . . . . . . 26

DQ7: Data# Polling ................................................................. 26

Figure 5. Data# Polling Algorithm ................................................... 26

RY/BY#: Ready/Busy# ........................................................... 27

DQ6: Toggle Bit I .................................................................... 27

DQ2: Toggle Bit II ................................................................... 27

Reading Toggle Bits DQ6/DQ2 .............................................. 27

Erase and Programming Performance . . . . . . . 46

Latchup Characteristics . . . . . . . . . . . . . . . . . . . 46

TSOP and SO Pin Capacitance . . . . . . . . . . . . . . 46

Data Retention . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 47

TS 048—48-Pin Standard TSOP (measured in millimeters) .. 47

TSR048—48-Pin Reverse TSOP (measured in millimeters) .. 49

FBC048—48-Ball Fine-Pitch Ball Grid Array (FBGA) 8 x 9 mm

(measured in millimeters) ....................................................... 50

SO 044—44-Pin Small Outline Package (measured in millime-

ters) ........................................................................................ 51

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 52

Revision F (January 1998) ...................................................... 52

Revision F+1 ........................................................................... 52

Revision F+2 ........................................................................... 52

Revision G (January 1999) ..................................................... 52

Revision G+1 (February 1999) ............................................... 52

Revision H (November 23, 1999) ........................................... 52

Revision H+1 (February 22, 2000) ......................................... 53

Am29LV160B

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