Memory IC
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Microchip |
Reach Compliance Code | unknow |
Data retention time - minimum | 100 |
Durability | 100000 Write/Erase Cycles |
I2C control byte | 10110CCC |
JESD-30 code | R-PDIP-T8 |
JESD-609 code | e0 |
memory density | 16384 bi |
Memory IC Type | EEPROM |
memory width | 8 |
Number of terminals | 8 |
word count | 2048 words |
character code | 2000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | DIP |
Encapsulate equivalent code | DIP8,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Serial bus type | I2C |
Maximum standby current | 0.000005 A |
Maximum slew rate | 0.005 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | TIN LEAD |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
write protect | SOFTWARE |