PLCC-68, Reel
Parameter Name | Attribute value |
Brand Name | Integrated Device Technology |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | PLCC |
package instruction | PLASTIC, LCC-68 |
Contacts | 68 |
Manufacturer packaging code | PL68 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Maximum access time | 20 ns |
I/O type | COMMON |
JESD-30 code | S-PQCC-J68 |
JESD-609 code | e0 |
length | 24.2062 mm |
memory density | 131072 bit |
Memory IC Type | DUAL-PORT SRAM |
memory width | 8 |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of ports | 2 |
Number of terminals | 68 |
word count | 16384 words |
character code | 16000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 16KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | QCCJ |
Encapsulate equivalent code | LDCC68,1.0SQ |
Package shape | SQUARE |
Package form | CHIP CARRIER |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 3.3 V |
Certification status | Not Qualified |
Maximum seat height | 4.57 mm |
Maximum standby current | 0.005 A |
Minimum standby current | 2 V |
Maximum slew rate | 0.2 mA |
Maximum supply voltage (Vsup) | 3.6 V |
Minimum supply voltage (Vsup) | 3 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn85Pb15) |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 24.2062 mm |
Base Number Matches | 1 |