Dual-Port SRAM, 16KX9, 35ns, CMOS, PQCC68, 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, GREEN, PLASTIC, LCC-68
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | LCC |
| package instruction | QCCJ, LDCC68,1.0SQ |
| Contacts | 68 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 35 ns |
| I/O type | COMMON |
| JESD-30 code | S-PQCC-J68 |
| JESD-609 code | e3 |
| length | 24.2062 mm |
| memory density | 147456 bit |
| Memory IC Type | DUAL-PORT SRAM |
| memory width | 9 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 68 |
| word count | 16384 words |
| character code | 16000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 16KX9 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC68,1.0SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 4.57 mm |
| Maximum standby current | 0.015 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.25 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) - annealed |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 24.2062 mm |
| Base Number Matches | 1 |
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