Only Reflow Soldering
Water Repellent Chip Multilayer Ceramic Capacitors for Automotive
GGM1885C2A1R8CA16_ (0603, C0G:EIA, 1.8pF, DC100V)
_: packaging code
1.Scope
Reference Sheet
This product specification is applied to Water Repellent Chip Multilayer Ceramic Capacitors used for Automotive Electronic equipment.
This product is applied for Only Reflow Soldering.
2.MURATA Part NO. System
(Ex.)
GGM
18
(1)L/W
Dimensions
8
(2)T
Dimensions
5C
(3)Temperature
Characteristics
2A
(4)Rated
Voltage
1R8
(5)Nominal
Capacitance
C
(6)Capacitance
Tolerance
A16
(7)Murata’s Control
Code
D
(8)Packaging Code
3. Type & Dimensions
(1)-1 L
1.6±0.1
(1)-2 W
0.8±0.1
(2) T
0.8±0.1
e
0.2 to 0.5
(Unit:mm)
g
0.5 min.
4.Rated value
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
Temp. coeff
Temp. Range
or Cap. Change
(Ref.Temp.)
(4)
Rated
Voltage
(6)
(5) Nominal
Capacitance
Capacitance
Tolerance
Specifications and Test
Methods
(Operating
Temp. Range)
0±30 ppm/°C
25 to 125 °C
(25 °C)
DC 100 V
1.8 pF
±0.25 pF
-55 to 125 °C
5.Package
mark
D
J
(8) Packaging
f180mm
Reel
PAPER W8P4
f330mm
Reel
PAPER W8P4
Packaging Unit
4000 pcs./Reel
10000 pcs./Reel
Product specifications in this catalog are as of Nov.2,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
GGM1885C2A1R8CA16-01
1
■AEC-Q200
Murata Standard Specification and Test Methods
Specification.
No
AEC-Q200 Test Item
Pre-and Post-Stress
1
Electrical Test
The measured and observed characteristics should satisfy the
specifications in the following table.
-
Solder the capacitor on the test substrate(glass epoxy board).
Set the capacitor for 1000+/-12 hours at 150+/-3℃.
Set for 24+/-2 hours at room temperature, then measure.
Within +/-10.0%
W.V.: 25V min.: 0.03 max.
W.V.: 16V/10V : 0.05 max.
・
Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10
℃
for 1 hour and then sit
for 24+/-2 hours at room temperature. Perform the initial measurement.
2 High Temperature
Exposure (Storage)
Temperature
Compensating Type
AEC-Q200 Test Method
High Dielectric Type
Appearance No marking defects
Capacitance Within +/-2.5% or +/-0.25pF
Change
Q or D.F.
(Whichever is larger)
30pF min. : Q≧1000
30pF max.: Q
≧400+20C
C: Nominal Capacitance(pF)
I.R.
25℃
3 Temperature Cycling
More than 10000MΩ or 500Ω・F
(Whichever is smaller)
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance No marking defects
Capacitance Within +/-2.5% or +/-0.25pF
Change
Q or D.F.
(Whichever is larger)
30pF min. : Q≧1000
30pF max.: Q
≧400+20C
C: Nominal Capacitance(pF)
I.R.
25℃
4 Destructive
Physical Analysis
5 Moisture Resistance
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance No marking defects
Capacitance Within +/-3.0% or +/-0.30pF
Change
Q or D.F.
(Whichever is larger)
30pF min. : Q≧350
10pF and over, 30pF and below:
Q≧275+5C/2
10pF max.: Q
≧200+10C
C: Nominal Capacitance(pF)
I.R.
25℃
More than 10000MΩ or 500Ω・F
(Whichever is smaller)
W.V.: 35V min.: 0.03 max.
W.V.: 25V max. : 0.05 max.
Within +/-12.5%
More than 10000MΩ or 500Ω・F
(Whichever is smaller)
No defects or abnormalities
W.V.: 25V min.: 0.03 max.
W.V.: 16V/10V : 0.05 max.
Within +/-10.0%
Solder the capacitor on the test substrate(glass epoxy board).
Perform 1000 cycles test according to the four heat treatments listed
in the following table.
Set for 24+/-2 hours at room temperature, then measure.
Step
Temp.
(C)
Time
(min)
1
Min.Operating Temp.+0/-3
15+/-3
2
3
4
Room
Room
Temp. Max.Operating Temp. +3/-0 Temp.
1
15+/-3
1
・
Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10
℃
for 1 hour and then sit
for 24+/-2 hours at room temperature. Perform the initial measurement.
Per EIA-469.
Solder the capacitor on the test substrate(glass epoxy board).
Apply the 24 hours heat (25℃ to 65℃) and humidity (80%RH to 98%RH)
treatment shown below, 10 consecutive times.
Set for 24+/-2 hours at room temperature, then measure.
Temperature
(℃)
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-5
-10
Humidity
90½98%
Humidity
80½98%
Humidity
90½98%
Humidity
80½98% Humidity
90½98%
+10
- 2℃
Initial measuremt
One cycle 24hours
0
1 2
3
4 5
6
7
8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Hours
・
Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10
℃
for 1 hour and then sit
for 24+/-2 hours at room temperature. Perform the initial measurement.
6 Biased Humidity
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance No marking defects
Capacitance Within +/-3.0% or +/-0.30pF
Change
Q or D.F.
(Whichever is larger)
30pF and over: Q≧200
30pF and below: Q≧100+10C/3
C: Nominal Capacitance(pF)
I.R.
25℃
More than 1000MΩ or 50Ω
・F
(Whichever is smaller)
W.V.: 35V min.: 0.035 max.
W.V.: 25V max. : 0.05 max.
・
Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10
℃
for 1 hour and then sit
for 24+/-2 hours at room temperature. Perform the initial measurement.
Within +/-12.5%
Solder the capacitor on the test substrate(glass epoxy board).
Apply the rated voltage and 1.3+0.2/-0Vdc (add 6.8kΩ resister)
at 85+/-3℃ and 80%RH to 85%RH humidity for 1000+/-12 hours.
The charge/discharge current is less than 50mA.
Remove and set for 24+/-2 hours at room temperature, then measure.
JEMCGS-04257B
2
■AEC-Q200
Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specification.
Temperature
High Dielectric Type
Compensating Type
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
Capacitance
Change
Q or D.F.
No marking defects
Within +/-3.0% or +/-0.30pF
(Whichever is larger)
30pF min. : Q≧350
10pF and over, 30pF and below:
Q≧275+5C/2
10pF max.: Q
≧200+10C
C: Nominal Capacitance(pF)
I.R.
25℃
8 External Visual
9 Physical Dimension
10 Resistance to Appearance
Solvents
Capacitance
Q or D.F.
I.R.
25℃
11 Mechanical
Shock
Capacitance
Q or D.F.
I.R.
25℃
12 Vibration
Appearance
Capacitance
Q or D.F.
I.R.
25℃
13 Resistance to
Soldering Heat
Appearance
Capacitance
Q or D.F.
I.R.
25℃
Within the specified initial value.
Within the specified initial value.
More than 10000MΩ or 500Ω・F
(Whichever is smaller)
No marking defects
Within the specified initial value.
Within the specified initial value.
More than 10000MΩ or 500Ω・F
(Whichever is smaller)
The measured and observed characteristics should satisfy the
specifications in the following table.
No marking defects
Within the specified initial value.
Within the specified initial value.
More than 10000MΩ or 500Ω・F
(Whichever is smaller)
Solder the capacitor on the test substrate(glass epoxy board).
The capacitor should be subjected to a simple harmonic motion having
a total amplitude of 1.5mm, the frequency being varied uniformly
between the approximate limits of 10Hz and 2000Hz.
The frequency range, from 10Hz to 2000Hz and return to 10Hz,
should be traversed in approximately 20 minutes.
This motion should be applied for 12 cycles in each 3 mutually
perpendicular directions (total of 36 times).
Immerse the capacitor in Sn-3.0Ag-0.5Cu solder solution or an eutectic
solder solution at 260+/-5℃ for 10+/-1 seconds.
Set for 24+/-2 hours at room temperature, then measure.
・Initial
measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10
℃
for 1 hour and then sit
for 24+/-2 hours at room temperature. Perform the initial measurement.
Appearance
Within the specified initial value.
Within the specified initial value.
More than 10000MΩ or 500Ω・F
(Whichever is smaller)
No marking defects
Solder the capacitor on the test substrate(glass epoxy board).
Three shocks in each direction should be applied along 3 mutually
perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
duration :0.5ms, peak value:1500g and velocity change: 4.7m/s.
More than 1000MΩ or 50Ω
・F
(Whichever is smaller)
No defects or abnormalities
Within the specified dimensions
No marking defects
Visual inspection
Using Measuring instrument of dimension.
Per MIL-STD-202 Method 215
Solvent 1 : 1 part (by volume) of isopropyl alcohol
3 parts (by volume) of mineral spirits
Solvent 2 : Terpene defluxer
Solvent 3 : 42 parts (by volume) of water
1 part (by volume) of propylene glycol monomethyl ether
1 part (by volume) of monoethanolamine
・Initial
measurement for high dielectric constant type.
* GGM155R71H 562 to 223: 0.05 max. Apply the test voltage at the maximum operating temperature +/-3°C
W.V.: 35V min.: 0.035 max.*
W.V.: 25V max. : 0.05 max.
for 1 hour and then let sit for 24+/-2hours at room temperature,
then measure.
Within +/-12.5%
AEC-Q200 Test Method
Solder the capacitor on the test substrate(glass epoxy board).
Apply 200% of the rated voltage for 1000+/-12 hours at
maximum operating temperature +/-3℃.
The charge/discharge current is less than 50mA.
Set for 24+/-2 hours at room temperature, then measure.
7 Operational Life
JEMCGS-04257B
3
■AEC-Q200
Murata Standard Specification and Test Methods
Specification.
No
AEC-Q200 Test Item
Temperature
High Dielectric Type
Compensating Type
The measured and observed characteristics should satisfy the
specifications in the following table.
Appearance
Capacitance
Change
Q or D.F.
No marking defects
Within +/-2.5% or +/-0.25pF
(Whichever is larger)
30pF min. : Q≧1000
30pF max.: Q
≧400+20C
C: Nominal Capacitance(pF)
・Initial
measurement for high dielectric constant type
I.R.
25℃
More than 10000MΩ or 500Ω・F
(Whichever is smaller)
Perform a heat treatment at 150+0/-10
℃
for 1 hour and then sit
for 24+/-2 hours at room temperature. Perform the initial measurement.
W.V.: 25V min.: 0.03 max.
W.V.: 16V/10V : 0.05 max.
Within +/-10.0%
Step
Temp.(℃）
Time
(min）
1
Min. Operating Temp.+0/-3
15+/-3
2
Max. Operating Temp.+3/-0
15+/-3
AEC-Q200 Test Method
Solder the capacitor on the test substrate(glass epoxy board).
Perform the 300 cycles according to the two heat treatments listed
in the following table(Maximum transfer time is 20 seconds).
Set for 24+/-2 hours at room temperature, then measure.
14 Thermal Shock
15 ESD
Appearance
Capacitance
Q or D.F.
I.R.
25℃
No marking defects
Within the specified initial value.
Within the specified initial value.
More than 10000MΩ or 500Ω・F
(Whichever is smaller)
95% of the terminations is to be soldered evenly and continuously.
Per AEC-Q200-002
16 Solderability
(a) Preheat at 155℃ for 4 hours. After preheating,
immerse the capacitor in a solution of rosin ethanol 25(mass)%.
Immerse in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃ or
an eutectic solder solution at 235+/-5℃ for 5+0/-0.5 seconds.
(b) should be placed into steam aging for 8 hours+/-15 minutes.
After preheating, immerse the capacitor in a solution of rosin
ethanol
25(mass)%.
Immerse
in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃
or
an eutectic solder solution at 235+/-5℃ for 5+0/-0.5 seconds.
(c) should be placed into steam aging for 8 hours+/-15 minutes.
After
preheating, immerse the capacitor in a solution of rosin
ethanol
25(mass)%.
Immerse
in Sn-3.0Ag-0.5Cu solder solution or
an eutectic solder solution for 120+/-5 seconds at 260+/-5℃.
17 Electrical
Chatacteri-
zation
Appearance
Capacitance
Q or D.F.
No defects or abnormalities
Shown in Rated value.
30pF min. : Q≧1000
30pF max.: Q
≧400+20C
C: Nominal Capacitance(pF)
W.V.: 25V min.: 0.025 max.
W.V.: 16V/10V : 0.035 max.
Visual inspection.
The capacitance/Q/D.F. should be measured at 25℃ at the
frequency and voltage shown in the table.
Char.
Item
Frequency
Voltage
ΔC
(1000 pF and below)
1.0+/-0.1MHz
0.5Vrms to 5.0Vrms
ΔC
(more than 1000pF)
R7(C≦10μF)
1.0+/-0.1kHz
1.0+/-0.2Vrms
I.R. 25℃
More than 100000MΩ or 1000Ω・F
(Whichever is smaller)
More than 10000MΩ or 500Ω・F
(Whichever is smaller)
More than 1000MΩ or 10Ω・F
(Whichever is smaller)
The insulation resistance should be measured with a DC voltage not
exceeding the rated voltage at 25℃ and 125℃ within 2 minutes
of charging.
The charge/discharge current is less than 50mA.
I.R. 125℃
More than 10000MΩ or 100Ω・F
(Whichever is smaller)
Dielectric
Strength
No failure
No failure should be observed when 250% of the rated voltage is
applied between the terminations for 1 second to 5 seconds.
The charge/discharge current is less than 50mA.
JEMCGS-04257B
4
■AEC-Q200
Murata Standard Specification and Test Methods
Specification.
No
AEC-Q200 Test Item
Appearance
Capacitance
Change
Q or D.F.
Temperature
Compensating Type
No marking defects
Within +/-5.0% or +/-0.5pF
(Whichever is larger)
Within the specified initial value.
Within +/-10.0%
AEC-Q200 Test Method
High Dielectric Type
Solder the capacitor on the test substrate(glass epoxy board)
shown in Fig1.
Then apply a force in the direction shown in Fig 2 for 60 seconds.
The soldering should be done by the reflow method and should be
conducted with care so
½ﾝﾃﾞﾝ½
soldering is uniform and free of defects
that the
such as heat shock.
Series
GGM15
45
GGM18
GGM21
GGM31
GGM32
a
0.5
45
0.6
0.8
2.0
2.0
b
1.5
支持台
2.2
3.0
4.4
4.4
c
0.6
0.9
1.3
1.7
2.6
(in mm)
18 Board Flex
I.R.
25℃
More than 10000MΩ or 500Ω・F
(Whichever is smaller)
Land
b
f4.5
20
50 min.
Pressurizing
speed:1.0mm/s
Pressurize
a
100
40
R4
c
c
Capacitance meter
Fig.
19 Terminal
Strength
Capacitance
Q or D.F.
Within specified tolerance
Within the specified initial value.
Appearance
No marking defects
t : 1.6mm
(GGM15:0.8mm)
45
45
Fig.2
Flexure：2
(High Dielectric Type)
Flexure：3
(Temperature
Compensating Type)
Solder the capacitor on the test substrate(glass epoxy board)
shown in Fig3.
Then apply 18N* force in parallel with the test jig for 60 seconds.
The soldering should be done either with an iron or using the reflow
method and should be conducted with care so that the soldering is
uniform and free of defects such as heat shock
*2N(GGM15)
I.R.
25℃
More than 10000MΩ or 500Ω・F
(Whichever is smaller)
Series
GGM15
GGM18
GGM21
GGM31
GGM32
a
0.4
1.0
1.2
2.2
2.2
b
1.5
3.0
4.0
5.0
5.0
c
0.5
1.2
1.65
2.0
2.9
c
(in mm)
b
a
ﾗﾝﾄﾞ
b
f4.5
t: 1.6mm
(GGM15: 0.8mm)
Solder resist
c
Fig.3
Copper foil
a
20 Beam Load Test
Destruction value should be exceed following one.
< Chip L dimension : 2.5mm max. >
Chip thickness > 0.5mm rank : 20N
Chip thickness = 0.5mm rank : 8N
Iron Board
Place the capacitor in the beam load fixture as Fig 4.
Apply a force.
< Chip Length : 2.5mm max. >
< Chip L dimension : 3.2mm min. >
Chip thickness < 1.25mm rank : 15N
Chip
thickness
≧1.25mm
rank : 54.5N
< Chip Length : 3.2mm min. >
L
0.6L
Fig.4
Speed supplied the Stress Load : 0.5mm/s
JEMCGS-04257B
5
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