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BR25L160F-W

Description
SPI BUS 16Kbit (2,048 x 8bit) EEPROM
Categorystorage    storage   
File Size316KB,6 Pages
ManufacturerROHM Semiconductor
Websitehttps://www.rohm.com/
Environmental Compliance
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BR25L160F-W Overview

SPI BUS 16Kbit (2,048 x 8bit) EEPROM

BR25L160F-W Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerROHM Semiconductor
Parts packaging codeSOIC
package instructionLSOP, SOP8,.25
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
Maximum clock frequency (fCLK)5 MHz
Data retention time - minimum40
Durability1000000 Write/Erase Cycles
JESD-30 codeR-PDSO-G8
JESD-609 codee2
length5 mm
memory density16384 bit
Memory IC TypeEEPROM
memory width8
Number of functions1
Number of terminals8
word count2048 words
character code2000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2KX8
Package body materialPLASTIC/EPOXY
encapsulated codeLSOP
Encapsulate equivalent codeSOP8,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, LOW PROFILE
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)260
power supply2/5 V
Certification statusNot Qualified
Maximum seat height1.6 mm
Serial bus typeSPI
Maximum standby current0.000002 A
Maximum slew rate0.003 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)1.8 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Copper (Sn/Cu)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperature10
width4.4 mm
Maximum write cycle time (tWC)5 ms
write protectHARDWARE/SOFTWARE
Base Number Matches1

BR25L160F-W Related Products

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Description SPI BUS 16Kbit (2,048 x 8bit) EEPROM SPI BUS 16Kbit (2,048 x 8bit) EEPROM SPI BUS 16Kbit (2,048 x 8bit) EEPROM SPI BUS 16Kbit (2,048 x 8bit) EEPROM
Is it lead-free? Lead free Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to conform to
Maker ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor ROHM Semiconductor
Parts packaging code SOIC SOIC SOIC SOIC
package instruction LSOP, SOP8,.25 SOP, SOP8,.25 LSSOP, TSSOP8,.25 LSSOP, TSSOP8,.25
Contacts 8 8 8 8
Reach Compliance Code compliant compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99
Maximum clock frequency (fCLK) 5 MHz 5 MHz 5 MHz 5 MHz
Data retention time - minimum 40 40 40 40
Durability 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
JESD-609 code e2 e2 e2 e2
length 5 mm 4.9 mm 4.4 mm 4.4 mm
memory density 16384 bit 16384 bit 16384 bit 16384 bit
Memory IC Type EEPROM EEPROM EEPROM EEPROM
memory width 8 8 8 8
Number of functions 1 1 1 1
Number of terminals 8 8 8 8
word count 2048 words 2048 words 2048 words 2048 words
character code 2000 2000 2000 2000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
organize 2KX8 2KX8 2KX8 2KX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LSOP SOP LSSOP LSSOP
Encapsulate equivalent code SOP8,.25 SOP8,.25 TSSOP8,.25 TSSOP8,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, LOW PROFILE SMALL OUTLINE SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Parallel/Serial SERIAL SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) 260 260 260 260
power supply 2/5 V 2/5 V 2/5 V 2/5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Serial bus type SPI SPI SPI SPI
Maximum standby current 0.000002 A 0.000002 A 0.000002 A 0.000002 A
Maximum slew rate 0.003 mA 0.003 mA 0.003 mA 0.003 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Copper (Sn/Cu) Tin/Copper (Sn/Cu) Tin/Copper (Sn/Cu) Tin/Copper (Sn/Cu)
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm 0.65 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 10 NOT SPECIFIED 10 10
width 4.4 mm 3.9 mm 3 mm 3 mm
Maximum write cycle time (tWC) 5 ms 5 ms 5 ms 5 ms
write protect HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Maximum seat height 1.6 mm - 1.25 mm 1.25 mm
Base Number Matches 1 - 1 1

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