GS81302DT07E-450 datasheet, PDF

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GS81302DT07E-450: DescriptionSRAM 1.8 or 1.5V 16M x 8 144M; Categorystorage storage; File Size1MB，30 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/

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GS81302DT07E-450 Overview

SRAM 1.8 or 1.5V 16M x 8 144M

GS81302DT07E-450 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	GSI Technology
Parts packaging code	BGA
package instruction	LBGA,
Contacts	165
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Factory Lead Time	12 weeks
Maximum access time	0.45 ns
Other features	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165
length	17 mm
memory density	134217728 bit
Memory IC Type	QDR SRAM
memory width	8
Number of functions	1
Number of terminals	165
word count	16777216 words
character code	16000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16MX8
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.5 mm
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15 mm

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GS81302DT07/10/19/37E-450/400/350/333/300

165-Bump BGA

Commercial Temp

Industrial Temp

Features

• 2.0 clock Latency

• Simultaneous Read and Write SigmaQuad™ Interface

• JEDEC-standard pinout and package

• Dual Double Data Rate interface

• Byte Write controls sampled at data-in time

• Burst of 4 Read and Write

• Dual-Range On-Die Termination (ODT) on Data (D), Byte

Write (BW), and Clock (K, K) inputs

• 1.8 V +100/–100 mV core power supply

• 1.5 V or 1.8 V HSTL Interface

• Pipelined read operation

• Fully coherent read and write pipelines

• ZQ pin for programmable output drive strength

• Data Valid Pin (QVLD) Support

• IEEE 1149.1 JTAG-compliant Boundary Scan

• 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package

• RoHS-compliant 165-bump BGA package available

144Mb SigmaQuad-II+

Burst of 4 SRAM

450 MHz–300 MHz

1.8 V V

1.8 V and 1.5 V I/O

SigmaQuad™ Family Overview

for

-450

The GS81302DT07/10/19/37E are built in compliance with

the SigmaQuad-II+ SRAM pinout standard for Separate I/O

synchronous SRAMs. They are 150,994,944-bit (144Mb)

SRAMs. The GS81302DT07/10/19/37E SigmaQuad SRAMs

Parameter Synopsis

-400

-350

2.86 ns

0.45 ns

-333

3.0 ns

0.45 ns

-300

3.3 ns

0.45 ns

tKHKH

tKHQV

2.2 ns

2.5 ns

0.45 ns

Rev: 1.00b 8/2017

1/30

sig

n—

sco

inu

are just one element in a family of low power, low voltage

HSTL I/O SRAMs designed to operate at the speeds needed to

implement economical high performance networking systems.

Clocking and Addressing Schemes

The GS81302DT07/10/19/37E SigmaQuad-II+ SRAMs are

synchronous devices. They employ two input register clock

inputs, K and K. K and K are independent single-ended clock

inputs, not differential inputs to a single differential clock input

buffer.

Each internal read and write operation in a SigmaQuad-II+ B4

RAM is four times wider than the device I/O bus. An input

data bus de-multiplexer is used to accumulate incoming data

before it is simultaneously written to the memory array. An

output data multiplexer is used to capture the data produced

from a single memory array read and then route it to the

appropriate output drivers as needed. Therefore the address

field of a SigmaQuad-II+ B4 RAM is always two address pins

less than the advertised index depth (e.g., the 16M x 8 has a

4M addressable index).

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

GS81302DT07E-450 Related Products

	GS81302DT07E-450	GS81302DT07GE-350
Description	SRAM 1.8 or 1.5V 16M x 8 144M	SRAM 1.8 or 1.5V 16M x 8 144M
Is it lead-free?	Contains lead	Lead free
Is it Rohs certified?	incompatible	conform to
Maker	GSI Technology	GSI Technology
Parts packaging code	BGA	BGA
package instruction	LBGA,	LBGA,
Contacts	165	165
Reach Compliance Code	compliant	compliant
ECCN code	3A991.B.2.B	3A991.B.2.B
Factory Lead Time	12 weeks	12 weeks
Maximum access time	0.45 ns	0.45 ns
Other features	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 code	R-PBGA-B165	R-PBGA-B165
length	17 mm	17 mm
memory density	134217728 bit	134217728 bit
Memory IC Type	QDR SRAM	QDR SRAM
memory width	8	8
Number of functions	1	1
Number of terminals	165	165
word count	16777216 words	16777216 words
character code	16000000	16000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	16MX8	16MX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	LBGA
Package shape	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	260
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.5 mm	1.5 mm
Maximum supply voltage (Vsup)	1.9 V	1.9 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	BALL	BALL
Terminal pitch	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	15 mm	15 mm

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