SRAM 1.8 or 1.5V 512K x 36 18M
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | GSI Technology |
| Parts packaging code | BGA |
| package instruction | LBGA, |
| Contacts | 165 |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.2.B |
| Factory Lead Time | 8 weeks |
| Maximum access time | 0.45 ns |
| Other features | PIPELINED ARCHITECTURE |
| JESD-30 code | R-PBGA-B165 |
| JESD-609 code | e1 |
| length | 15 mm |
| memory density | 18874368 bit |
| Memory IC Type | DDR SRAM |
| memory width | 36 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 165 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512KX36 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | LBGA |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, LOW PROFILE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| Certification status | Not Qualified |
| Maximum seat height | 1.4 mm |
| Maximum supply voltage (Vsup) | 1.9 V |
| Minimum supply voltage (Vsup) | 1.7 V |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal form | BALL |
| Terminal pitch | 1 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 13 mm |
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