EEWORLDEEWORLDEEWORLD

Part Number

Search

WCR2010-9M53FI

Description
Thick Film Resistors - SMD
CategoryPassive components   
File Size569KB,3 Pages
ManufacturerTT Electronics
Download Datasheet Parametric View All

WCR2010-9M53FI Overview

Thick Film Resistors - SMD

WCR2010-9M53FI Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerTT Electronics
Product CategoryThick Film Resistors - SMD
TechnologyThick Film
Mounting StylePCB Mount
General Purpose Surface
Resistors
Mounted Resistors
General Purpose Surface
Mounted Resistors
General Purpose Surface
WCR Series
Mounted Resistors
Excellent reliability
WCR Series
Excellent reliability
WCR Series
Wrap around terminations
Wide range of sizes and ohmic values
Inner electrode protection
Excellent reliability
Wrap
range of sizes and ohmic values
Wide
around terminations
Inner electrode protection
Wrap around terminations
Inner electrode protection
AEC-Q200 grade available
Wide range of sizes and ohmic values
Welwyn Components
Welwyn Components
Electrical Data
Electrical
rating @ 70°C
Data
Power
All parts are Pb-free and comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3)
0201
0402
0603
0805
1206
1210
2010
2512
0.1
0.125
0.25
0.5
1.0
0.05
0.25
0.063
watts
Resistance range
ohms 10R to 1M0 1R0 to 1M0
1R0 to 10M
0603
0805
1206
2010
2512
1210
0402
0201
150
25
50
75
Limiting element votage
volts
200
0.1
0.125
0.25
0.5
1.0
0.05
0.063
Power ratingTCR*
@ 70°C
watts
100 0.25
200
250
ppm/°C
Resistance range
ohms 10R to 1M0 1R0 to 1M0
1R0 to 10M
1
Resistance Tolerance
%
150
25
50
75
Limiting element votage
volts
200
E24 or E96
Standard values
100
200
250
TCR*
ppm/°C
-55 to 155
Ambient temperature range
°C
1
Resistance Tolerance Jumper Chip Rating %
Zero-ohm
amps
1.5
2
0.5
1
E24 or E96
Standard values
<50
Zero-ohm Jumper Chip Resistance milliohms
-55 to 155
Ambient temperature range
°C
* Notes – TCR for low values 1R to 10R: -400 to +600ppm/ºC, 11R to 100R: ±200ppm/ºC
Zero-ohm Jumper Chip Rating
amps
1.5
2
0.5
1
TCR for high values 3M3 to 10M: ±300ppm/º
<50
Zero-ohm Jumper Chip Resistance milliohms
Physical Data
Dimensions (mm)
Physical Data
L
Style
* Notes – TCR for low values 1R to 10R: -400 to +600ppm/ºC, 11R to 100R: ±200ppm/ºC
TCR for high values 3M3 to 10M: ±300ppm/º
The chips have a high alumina substrate (96% minimum) with
a ruthenium oxide resistance element and silver palladium,
Figure
Construction
and tin plated terminations. A glazed protection coat
1
nickel
The chips have a high alumina substrate (96% minimum) with
is applied to the resistive element (See Fig.1)
a ruthenium oxide resistance element and silver palladium,
Terminations
nickel and tin plated terminations. A glazed protection coat
Solderability
The terminations meet the requirements of
is applied to the resistive element (See Fig.1)
IEC 115-1, Clause 4.17.3.2.
Terminations
Strength
The terminations meet requirements of
Solderability
The terminations meet the requirements of
IEC 68.2.21.
IEC 115-1, Clause 4.17.3.2.
Strength
The terminations meet requirements of
IEC 68.2.21.
General Note
T
C
A
W
0.6 ± 0.03
0.23 ± 0.03
0.12 ± 0.05
0.15 ± 0.05
0.3 ± 0.03
0201
Dimensions (mm)
1.0 ± 0.1
0.35 ± 0.05
0.2 ± 0.1
0.25 ± 0.1
0.5 ± 0.05
0402
L
T
C
1.6 ± 0.15
0.5 ± 0.15
0.25 ±A
0.2
0.25 ± 0.2
W
Style
0.8 ± 0.15
0603
C
A
0.6 ± 0.03
0.23 ± 0.03
0.12 ± 0.05
0.15 ± 0.05
2.0 ± ± 0.03 1.25+ 0.2 -0.1 0.5 + 0.15 -0.10
0.4 ± 0.2
0.4 ± 0.2
0.3 0.2
0201
0805
1.0 ± 0.1
0.35 -0.15
0.2 ± -0.1
0.25 ± 0.1
L
3.2 +0.1±-0.25 1.6 + 0.1 ± 0.05 0.55 +0.150.1 0.5 + 0.2-0.25 0.5+ 0.2 -0.25
0.5 0.05
0402
1206
W
A T
1.6 ± 0.15 3.2 0.8 ± 0.15
0.50.15
± 0.15 0.550.25 ± 0.2
0.25 ± 0.2
+ 0.1 -0.2
+0.15 -0.1
0.5 ± 0.25
0.5 ± 0.2
0603
2.6 ±
1210
A
Wrap-around terminations
2.0 ± 0.2
0.4 0.15
0.4 ± 0.2
5.0 ± 0.15 -0.1 0.5 + 0.15 -0.10 0.56 ± ± 0.2
0.60 ± 0.25
0.60 ± 0.25
1.25+ 0.2
0805
2.5 ± 0.15
2010
(3 faces)
L
3.2 +0.1 -0.25 1.6 + 0.1 -0.15 0.55 +0.15 -0.1 0.56+ 0.2-0.25 0.60 ±0.2 -0.25 1.2 ± 0.85
0.5 ± 0.15
0.5+ 0.25
6.3 ± 0.15
1206
3.2 ± 0.15
W
2512
A
3.2 + 0.1 -0.2
0.55 +0.15 -0.1
0.5 ± 0.25
0.5 ± 0.2
2.6 ± 0.15
1210
Wrap-around terminations
5.0 ± 0.15
0.56 ± 0.15
0.60 ± 0.25
0.60 ± 0.25
2.5 ± 0.15
2010
Figure 1
(3 faces)
Construction
± 0.15
6.3 ± 0.15
0.56 ± 0.15
0.60 ± 0.25
1.2 ± 0.85
3.2
2512
C
T
Tin Plating
Epoxy Melamine
Protection
Nickel Barrier
Glass Dielectric
Silver
Dipped Conductor
Resistance Element
Palladium
Epoxy Melamine
Protection
Glass Dielectric
Silver
Resistance Element
Palladium
96% min Alumina Substrate
96% min Alumina Substrate
Tin Plating
Nickel Barrier
Dipped Conductor
Welwyn Components reserves the right to make changes in product specification without notice or liability.
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
General
Note
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
General
Note
Welwyn Components
the right to make changes in
changes
specification
specification without notice or liability.
Telephone: +44 (0) 1670 make
product
in product
without notice or
Email:
TT Electronics reserves
reserves the right to 822181 · Facsimile: +44 (0) 1670 829465 ·
liability.
info@welwyn-tt.com · Website: www.welwyn-tt.com
All information is subject to Welwyn’s own data and is considered accurate at time of going to print.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
Iss 07.03
A subsidiary of
TT electronics plc
www.ttelectronics.com/resistors
Iss 07.03
06.18
A subsidiary of
TT electronics plc
© Welwyn Components Limited
· Bedlington, Northumberland NE22 7AA, UK
© TT Electronics plc
Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com
RISC-V core chip trial
I recently applied for a CH32v103 development board from the wch manufacturer. The chip is based on the riscv core. I plan to try it out in the next two days. The development environment can built by ...
老木匠 Domestic Chip Exchange
Two-way BUCK
[color=#333333][font=微软雅黑]Hello masters, I am a newbie in power supply[/url][/font][/color][color=#4183c4][font=微软雅黑][url=http://bbs.elecfans.com/zhuti_power_1.html]circuit[/url][/font][/color][color=...
cpfpost Power technology
Passive RFID tag structure and principle
This article takes Microchip MCRF355 and MCRF360 passive tags as examples to introduce the structure, process and communication principle of passive tags in detail. Passive RFID tags do not have batte...
JasonYoo RF/Wirelessly
MSP430 Classic Textbook Recommendations
MSP430 Series MCU Principles and Engineering Design Practice / edited by Wang Zhaobin [et al.]Introduction: This book uses the MSP430F261x series of microcontrollers as a platform to explain in detail...
灞波儿奔 Microcontroller MCU
GaN Technology Then and Now
Gallium nitride (GaN) transistors were first introduced in the 1990s and are now widely used in commercial and defense applications, but engineering applications can be very different. Not convinced? ...
兰博 RF/Wirelessly
It is reported online that Zhang Rujing said that "the United States has little power to restrict China", and the organizer responded
On August 8, Jinshajiang Capital issued a statement by CITIC Securities and Jinshajiang Capital on media reports of Zhang Rujing’s remarks. The following is the full text of the statement:   Recently,...
eric_wang Domestic Chip Exchange

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号