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MMBZ5225BT-7-F

Description
Zener Diodes 150MW 3.0V
CategoryDiscrete semiconductor    diode   
File Size88KB,4 Pages
ManufacturerDiodes Incorporated
Environmental Compliance
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MMBZ5225BT-7-F Overview

Zener Diodes 150MW 3.0V

MMBZ5225BT-7-F Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerDiodes Incorporated
package instructionR-PDSO-G3
Contacts3
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time19 weeks
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance30 Ω
JESD-30 codeR-PDSO-G3
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals3
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation0.15 W
Certification statusNot Qualified
Nominal reference voltage3 V
surface mountYES
technologyZENER
Terminal surfaceMatte Tin (Sn)
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature40
Maximum voltage tolerance5%
Working test current20 mA
MMBZ5221BT - MMBZ5259BT
150mW SURFACE MOUNT ZENER DIODE
Please click here to visit our online spice models database.
Features
Ultra-Small Surface Mount Package
Planar Die Construction
General Purpose
Ideally Suited for Automated Assembly Processes
Lead Free/RoHS Compliant (Note 2)
"Green" Device (Note 3 and 4)
Mechanical Data
Case: SOT-523
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Polarity: See Diagram
Marking Information: See Page 4
Ordering Information: See Page 4
Weight: 0.002 grams (approximate)
Top View
Device Schematic
Maximum Ratings
Zener Current
Forward Voltage
@T
A
= 25°C unless otherwise specified
Symbol
(See Table on page 2)
@ I
F
= 10mA
V
F
Value
0.9
Unit
V
Characteristic
Thermal Characteristics
Characteristic
Power Dissipation
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
Notes:
1.
2.
3.
4.
Symbol
(Note 1)
(Note 1)
P
D
R
θ
JA
T
J,
T
STG
Value
150
833
-65 to +150
Unit
mW
°C/W
°C
Device mounted on FR-4 PC board with recommended pad layout at http://www.diodes.com/datasheets/ap02001.pdf.
No purposefully added lead.
Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
MMBZ5221BT - MMBZ5259BT
Document number: DS30267 Rev. 11 - 2
1 of 4
www.diodes.com
June 2008
© Diodes Incorporated
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