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HEF4073BTD-T

Description
Logic Gates TRPL 3INPUT AND GATE
Categorylogic    logic   
File Size24KB,4 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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HEF4073BTD-T Overview

Logic Gates TRPL 3INPUT AND GATE

HEF4073BTD-T Parametric

Parameter NameAttribute value
Source Url Status Check Date2013-06-14 00:00:00
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSOIC
package instructionPLASTIC, SOT-108-1, SO-14
Contacts14
Reach Compliance Codeunknown
series4000/14000/40000
JESD-30 codeR-PDSO-G14
JESD-609 codee4
length8.65 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeAND GATE
MaximumI(ol)0.00036 A
Number of functions3
Number of entries3
Number of terminals14
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP14,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE
method of packingTAPE AND REEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5/15 V
Prop。Delay @ Nom-Sup110 ns
propagation delay (tpd)110 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height1.75 mm
Maximum supply voltage (Vsup)15 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width3.9 mm
INTEGRATED CIRCUITS
DATA SHEET
For a complete data sheet, please also download:
The IC04 LOCMOS HE4000B Logic
Family Specifications HEF, HEC
The IC04 LOCMOS HE4000B Logic
Package Outlines/Information HEF, HEC
HEF4073B
gates
Triple 3-input AND gate
Product specification
File under Integrated Circuits, IC04
January 1995

HEF4073BTD-T Related Products

HEF4073BTD-T HEF4073BPN HEF4073BTD
Description Logic Gates TRPL 3INPUT AND GATE Logic Gates TRPL 3INPUT AND GATE Logic Gates TRPL 3INPUT AND GATE
Is it Rohs certified? conform to conform to conform to
Maker NXP NXP NXP
Parts packaging code SOIC DIP SOIC
package instruction PLASTIC, SOT-108-1, SO-14 PLASTIC, SOT-27-1, DIP-14 PLASTIC, SOT-108-1, SO-14
Contacts 14 14 14
Reach Compliance Code unknown unknown unknown
series 4000/14000/40000 4000/14000/40000 4000/14000/40000
JESD-30 code R-PDSO-G14 R-PDIP-T14 R-PDSO-G14
JESD-609 code e4 e4 e4
length 8.65 mm 19.025 mm 8.65 mm
Load capacitance (CL) 50 pF 50 pF 50 pF
Logic integrated circuit type AND GATE AND GATE AND GATE
MaximumI(ol) 0.00036 A 0.00036 A 0.00036 A
Number of functions 3 3 3
Number of entries 3 3 3
Number of terminals 14 14 14
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP DIP SOP
Encapsulate equivalent code SOP14,.25 DIP14,.3 SOP14,.25
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5/15 V 5/15 V 5/15 V
Prop。Delay @ Nom-Sup 110 ns 110 ns 110 ns
propagation delay (tpd) 110 ns 110 ns 110 ns
Certification status Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO
Maximum seat height 1.75 mm 4.2 mm 1.75 mm
Maximum supply voltage (Vsup) 15 V 15 V 15 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount YES NO YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING THROUGH-HOLE GULL WING
Terminal pitch 1.27 mm 2.54 mm 1.27 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 3.9 mm 7.62 mm 3.9 mm
Source Url Status Check Date 2013-06-14 00:00:00 2013-06-14 00:00:00 -

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