|
MAX4581EGE-T |
MAX4581EGE |
MAX4583EEE+T |
MAX4582LESE+T |
MAX4583CEE+T |
MAX4581LESE+T |
MAX4583ETE+ |
Description |
Multiplexer Switch ICs |
Multiplexer Switch ICs 8:1 Low Voltage Analog MUX |
IC SWITCH TRIPLE SPDT 16QSOP |
IC MULTIPLEXER DUAL 4X1 16SOIC |
IC SWITCH TRIPLE SPDT 16QSOP |
IC MULTIPLEXER 8X1 16SOIC |
SPDT, 3 Func, 2 Channel, BICMOS, PQCC16 |
Is it lead-free? |
- |
Contains lead |
Lead free |
Lead free |
Lead free |
Lead free |
- |
Is it Rohs certified? |
- |
incompatible |
conform to |
conform to |
conform to |
conform to |
conform to |
Maker |
- |
Maxim |
Maxim |
Maxim |
Maxim |
Maxim |
Maxim |
Parts packaging code |
- |
QFN |
SOIC |
SOIC |
SOIC |
- |
- |
package instruction |
- |
VQCCN, LCC16,.2SQ,32 |
SSOP, SSOP16,.25 |
0.150 INCH, MS-012, SOIC-16 |
SSOP, SSOP16,.25 |
, |
QCCN, LCC16,.12SQ,20 |
Contacts |
- |
16 |
16 |
16 |
16 |
- |
- |
Reach Compliance Code |
- |
not_compliant |
compliant |
compliant |
compliant |
compliant |
compliant |
ECCN code |
- |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
- |
- |
Factory Lead Time |
- |
1 week |
6 weeks |
6 weeks |
6 weeks |
6 weeks |
- |
Analog Integrated Circuits - Other Types |
- |
SINGLE-ENDED MULTIPLEXER |
- |
DIFFERENTIAL MULTIPLEXER |
SPDT |
SINGLE-ENDED MULTIPLEXER |
SPDT |
JESD-30 code |
- |
S-XQCC-N16 |
- |
R-PDSO-G16 |
R-PDSO-G16 |
- |
S-PQCC-N16 |
Number of channels |
- |
8 |
- |
4 |
1 |
- |
2 |
Number of functions |
- |
1 |
- |
1 |
3 |
- |
3 |
Number of terminals |
- |
16 |
- |
16 |
16 |
- |
16 |
Maximum on-state resistance (Ron) |
- |
80 Ω |
- |
80 Ω |
80 Ω |
- |
550 Ω |
Maximum operating temperature |
- |
85 °C |
- |
85 °C |
70 °C |
- |
85 °C |
Package body material |
- |
UNSPECIFIED |
- |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
- |
PLASTIC/EPOXY |
encapsulated code |
- |
VQCCN |
- |
SOP |
SSOP |
- |
QCCN |
Encapsulate equivalent code |
- |
LCC16,.2SQ,32 |
- |
SOP16,.25 |
SSOP16,.25 |
- |
LCC16,.12SQ,20 |
Package shape |
- |
SQUARE |
- |
RECTANGULAR |
RECTANGULAR |
- |
SQUARE |
Package form |
- |
CHIP CARRIER, VERY THIN PROFILE |
- |
SMALL OUTLINE |
SMALL OUTLINE, SHRINK PITCH |
- |
CHIP CARRIER |
Peak Reflow Temperature (Celsius) |
- |
240 |
- |
260 |
260 |
NOT SPECIFIED |
- |
power supply |
- |
3/5/+-5 V |
- |
2/12.6 V |
3/5/+-5 V |
- |
3/5/+-5 V |
Certification status |
- |
Not Qualified |
- |
Not Qualified |
Not Qualified |
- |
Not Qualified |
Maximum supply current (Isup) |
- |
0.01 mA |
- |
0.01 mA |
0.01 mA |
- |
0.01 mA |
surface mount |
- |
YES |
- |
YES |
YES |
- |
YES |
Maximum connection time |
- |
200 ns |
- |
200 ns |
200 ns |
- |
300 ns |
switch |
- |
BREAK-BEFORE-MAKE |
- |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
- |
BREAK-BEFORE-MAKE |
technology |
- |
CMOS |
- |
CMOS |
CMOS |
- |
BICMOS |
Temperature level |
- |
INDUSTRIAL |
- |
INDUSTRIAL |
COMMERCIAL |
- |
INDUSTRIAL |
Terminal form |
- |
NO LEAD |
- |
GULL WING |
GULL WING |
- |
NO LEAD |
Terminal pitch |
- |
0.8 mm |
- |
1.27 mm |
0.635 mm |
- |
0.5 mm |
Terminal location |
- |
QUAD |
- |
DUAL |
DUAL |
- |
QUAD |
Maximum time at peak reflow temperature |
- |
20 |
- |
NOT SPECIFIED |
30 |
NOT SPECIFIED |
- |