FIFO 2Kx18 / 4Kx9 FIFO 2.5V TERASYNC
Parameter Name | Attribute value |
Brand Name | Integrated Device Technology |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | PBGA |
package instruction | BGA-144 |
Contacts | 144 |
Manufacturer packaging code | BB144 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Maximum access time | 3.6 ns |
Other features | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE |
Spare memory width | 9 |
Maximum clock frequency (fCLK) | 83 MHz |
period time | 5 ns |
JESD-30 code | S-PBGA-B144 |
JESD-609 code | e0 |
length | 13 mm |
memory density | 36864 bit |
Memory IC Type | OTHER FIFO |
memory width | 18 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 144 |
word count | 2048 words |
character code | 2000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2KX18 |
Exportable | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Encapsulate equivalent code | BGA144,12X12,40 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 2.5 V |
Certification status | Not Qualified |
Maximum seat height | 1.97 mm |
Maximum standby current | 0.05 A |
Maximum slew rate | 0.06 mA |
Maximum supply voltage (Vsup) | 2.625 V |
Minimum supply voltage (Vsup) | 2.375 V |
Nominal supply voltage (Vsup) | 2.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn63Pb37) |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 20 |
width | 13 mm |
Base Number Matches | 1 |