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74LVC02ADB-T

Description
Logic Gates 3.3V QUAD 2-INPUT NOR GATE
Categorylogic    logic   
File Size163KB,15 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74LVC02ADB-T Overview

Logic Gates 3.3V QUAD 2-INPUT NOR GATE

74LVC02ADB-T Parametric

Parameter NameAttribute value
Source Url Status Check Date2013-06-14 00:00:00
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSSOP
package instruction5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14
Contacts14
Reach Compliance Codeunknown
seriesLVC/LCX/Z
JESD-30 codeR-PDSO-G14
JESD-609 codee4
length6.2 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeNOR GATE
Humidity sensitivity level1
Number of functions4
Number of entries2
Number of terminals14
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
propagation delay (tpd)10.1 ns
Certification statusNot Qualified
Maximum seat height2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)1.65 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width5.3 mm
Base Number Matches1
74LVC02A
Quad 2-input NOR gate
Rev. 8 — 16 November 2011
Product data sheet
1. General description
The 74LVC02A provides four 2-input NOR gates.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these
devices as translators in mixed 3.3 V and 5 V applications.
2. Features and benefits
5 V tolerant inputs for interfacing with 5 V logic
Wide supply voltage range from 1.2 V to 3.6 V
CMOS low power consumption
Direct interface with TTL levels
Complies with JEDEC standard:
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A (2.3 V to 2.7 V)
JESD8-C/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-B exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Specified from
40 C
to +85
C
and
40 C
to +125
C
3. Ordering information
Table 1.
Ordering information
Package
Temperature range
74LVC02AD
74LVC02ADB
74LVC02APW
74LVC02ABQ
40 C
to +125
C
40 C
to +125
C
40 C
to +125
C
40 C
to +125
C
Name
SO14
SSOP14
TSSOP14
Description
plastic small outline package; 14 leads;
body width 3.9 mm
plastic shrink small outline package; 14 leads;
body width 5.3 mm
plastic thin shrink small outline package; 14 leads;
body width 4.4 mm
Version
SOT108-1
SOT337-1
SOT402-1
SOT762-1
Type number
DHVQFN14 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 14 terminals;
body 2.5
3
0.85 mm

74LVC02ADB-T Related Products

74LVC02ADB-T 74LVC02ADB 74LVC02APW 74LVC02ABQ-G 74LVC02AD
Description Logic Gates 3.3V QUAD 2-INPUT NOR GATE Logic Gates 3.3V QUAD 2-INPUT NOR GATE Logic Gates 3.3V QUAD 2-INPUT NOR GATE Logic Gates QUAD 2-INPUT NOR Logic Gates 3.3V QUAD 2-INPUT NOR GATE
Is it Rohs certified? conform to conform to conform to - conform to
Maker NXP NXP NXP - NXP
Parts packaging code SSOP SSOP TSSOP - SOIC
package instruction 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 - 3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
Contacts 14 14 14 - 14
Reach Compliance Code unknown unknown unknown - unknown
series LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z - LVC/LCX/Z
JESD-30 code R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 - R-PDSO-G14
JESD-609 code e4 e4 e4 - e4
length 6.2 mm 6.2 mm 5 mm - 8.65 mm
Load capacitance (CL) 50 pF 50 pF 50 pF - 50 pF
Logic integrated circuit type NOR GATE NOR GATE NOR GATE - NOR GATE
Humidity sensitivity level 1 1 1 - 1
Number of functions 4 4 4 - 4
Number of entries 2 2 2 - 2
Number of terminals 14 14 14 - 14
Maximum operating temperature 125 °C 125 °C 125 °C - 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C - -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
encapsulated code SSOP SSOP TSSOP - SOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR - RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 260 260 - 260
propagation delay (tpd) 10.1 ns 10.1 ns 10.1 ns - 10.1 ns
Certification status Not Qualified Not Qualified Not Qualified - Not Qualified
Maximum seat height 2 mm 2 mm 1.1 mm - 1.75 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V - 3.6 V
Minimum supply voltage (Vsup) 1.65 V 1.65 V 1.65 V - 1.65 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V - 3.3 V
surface mount YES YES YES - YES
technology CMOS CMOS CMOS - CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE - AUTOMOTIVE
Terminal surface NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) - NICKEL PALLADIUM GOLD
Terminal form GULL WING GULL WING GULL WING - GULL WING
Terminal pitch 0.65 mm 0.65 mm 0.65 mm - 1.27 mm
Terminal location DUAL DUAL DUAL - DUAL
Maximum time at peak reflow temperature 30 30 30 - 30
width 5.3 mm 5.3 mm 4.4 mm - 3.9 mm
Base Number Matches 1 1 1 - 1
Is it lead-free? - Lead free Lead free - Lead free
MaximumI(ol) - 0.024 A 0.024 A - 0.024 A
Encapsulate equivalent code - SSOP14,.3 TSSOP14,.25 - SOP14,.25
method of packing - TUBE TUBE - TUBE
power supply - 3.3 V 3.3 V - 3.3 V
Prop。Delay @ Nom-Sup - 5.5 ns 5.5 ns - 5.5 ns
Schmitt trigger - NO NO - NO

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