SRAM 512Kx8 ASYNCHRONOUS 3.3V CMOS SRAM
| Parameter Name | Attribute value |
| Brand Name | Integrated Device Technology |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | SOJ |
| package instruction | SOJ, SOJ36,.44 |
| Contacts | 36 |
| Manufacturer packaging code | PBG36 |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.2.A |
| Samacsys Description | SOIC 400 MIL J-BEND |
| Maximum access time | 15 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-J36 |
| JESD-609 code | e3 |
| length | 23.495 mm |
| memory density | 4194304 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 8 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of terminals | 36 |
| word count | 524288 words |
| character code | 512000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 512KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOJ |
| Encapsulate equivalent code | SOJ36,.44 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 3.3 V |
| Certification status | Not Qualified |
| Maximum seat height | 3.683 mm |
| Maximum standby current | 0.01 A |
| Minimum standby current | 3 V |
| Maximum slew rate | 0.145 mA |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) - annealed |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10.16 mm |
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