MC14410P datasheet, PDF - EEWORLD Datasheet

MC14410P: DescriptionCMOS LSI (LOW-POWER COMPLEMENTARY MOS); CategoryWireless rf/communication Telecom circuit; File Size191KB，4 Pages; ManufacturerMotorola ( NXP ); Websitehttps://www.nxp.com

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MC14410P Overview

CMOS LSI (LOW-POWER COMPLEMENTARY MOS)

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Motorola ( NXP )
Parts packaging code	DIP
package instruction	DIP,
Contacts	16
Reach Compliance Code	unknow
JESD-30 code	R-PDIP-T16
JESD-609 code	e0
length	19.175 mm
Number of functions	1
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	4.44 mm
Maximum slew rate	3.5 mA
surface mount	NO
Telecom integrated circuit types	TELECOM CIRCUIT
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

	MC14410P	MC14410	MC14410L
Description	CMOS LSI (LOW-POWER COMPLEMENTARY MOS)	CMOS LSI (LOW-POWER COMPLEMENTARY MOS)	CMOS LSI (LOW-POWER COMPLEMENTARY MOS)
Is it Rohs certified?	incompatible	-	incompatible
Maker	Motorola ( NXP )	-	Motorola ( NXP )
package instruction	DIP,	-	DIP, DIP16,.3
Reach Compliance Code	unknow	-	unknow
JESD-30 code	R-PDIP-T16	-	R-GDIP-T16
JESD-609 code	e0	-	e0
length	19.175 mm	-	19.3 mm
Number of functions	1	-	1
Number of terminals	16	-	16
Maximum operating temperature	85 °C	-	85 °C
Minimum operating temperature	-40 °C	-	-40 °C
Package body material	PLASTIC/EPOXY	-	CERAMIC, GLASS-SEALED
encapsulated code	DIP	-	DIP
Package shape	RECTANGULAR	-	RECTANGULAR
Package form	IN-LINE	-	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED
Certification status	Not Qualified	-	Not Qualified
Maximum seat height	4.44 mm	-	4.19 mm
surface mount	NO	-	NO
Telecom integrated circuit types	TELECOM CIRCUIT	-	TELECOM CIRCUIT
Temperature level	INDUSTRIAL	-	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	-	TIN LEAD
Terminal form	THROUGH-HOLE	-	THROUGH-HOLE
Terminal pitch	2.54 mm	-	2.54 mm
Terminal location	DUAL	-	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED
width	7.62 mm	-	7.62 mm

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