CMOS LSI (LOW-POWER COMPLEMENTARY MOS)
MC14410 | MC14410P | MC14410L | |
---|---|---|---|
Description | CMOS LSI (LOW-POWER COMPLEMENTARY MOS) | CMOS LSI (LOW-POWER COMPLEMENTARY MOS) | CMOS LSI (LOW-POWER COMPLEMENTARY MOS) |
Is it Rohs certified? | - | incompatible | incompatible |
Maker | - | Motorola ( NXP ) | Motorola ( NXP ) |
package instruction | - | DIP, | DIP, DIP16,.3 |
Reach Compliance Code | - | unknow | unknow |
JESD-30 code | - | R-PDIP-T16 | R-GDIP-T16 |
JESD-609 code | - | e0 | e0 |
length | - | 19.175 mm | 19.3 mm |
Number of functions | - | 1 | 1 |
Number of terminals | - | 16 | 16 |
Maximum operating temperature | - | 85 °C | 85 °C |
Minimum operating temperature | - | -40 °C | -40 °C |
Package body material | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
encapsulated code | - | DIP | DIP |
Package shape | - | RECTANGULAR | RECTANGULAR |
Package form | - | IN-LINE | IN-LINE |
Peak Reflow Temperature (Celsius) | - | NOT SPECIFIED | NOT SPECIFIED |
Certification status | - | Not Qualified | Not Qualified |
Maximum seat height | - | 4.44 mm | 4.19 mm |
surface mount | - | NO | NO |
Telecom integrated circuit types | - | TELECOM CIRCUIT | TELECOM CIRCUIT |
Temperature level | - | INDUSTRIAL | INDUSTRIAL |
Terminal surface | - | Tin/Lead (Sn/Pb) | TIN LEAD |
Terminal form | - | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | - | 2.54 mm | 2.54 mm |
Terminal location | - | DUAL | DUAL |
Maximum time at peak reflow temperature | - | NOT SPECIFIED | NOT SPECIFIED |
width | - | 7.62 mm | 7.62 mm |