Power Dividers
Description
DLI introduces its new high frequency surface mountable
and wire bondable Wilkinson Power Dividers. These Power
Dividers incorporate DLI’s low loss high permittivity
ceramics which provide small size and temperature stability
along with integrated resistors. The compact size, broad
band performance and ease of integration make these
power dividers ideal anywhere board space is of a premium
and quality signal splitting or combining is required.
Features
•
Broad Band 2 to 18 GHz Frequency Coverage
•
Low Excess Insertion Loss
•
High Isolation
•
Excellent Phase and Amplitude Balance
•
Well matched on All Ports
•
No External Resistors Required
•
Compact Solder Surface Mount Package
Specifications
Part
Number
PDW06038
PDW06041
PDW05758
PDW06011
PDW06089
PDW06401
PDW06398
PDW06399
PDW06400
PDW06407
Frequency
Range
(GHz)
Amplitude
Balance
Max. (dB)
Phase
Balance
Max.
(degrees)
Excess
Insertion
Loss
Typ. (dB)
Return
Loss
Typ. (dB)
Isolation
Typ. (dB)
Input
Power as a
Splitter
Max. (W)
2
Mounting
Configuration
2 to 10
2 to 10
6 to 18
6 to 18
6 to 18
2 to 10
5 to 7
9 to 11
11 to 13
2 to 18
±0.25
±0.25
±0.25
±0.25
±0.5
±0.25
±0.25
±0.25
±0.25
±0.25
±3.0
±3.0
±3.0
±3.0
±3.0
±5.0
±5.0
±5.0
±5.0
±5.0
0.8
0.8
0.7
0.7
1.0
0.5
0.25
0.25
0.5
2.5
20
20
20
20
14
25
20
20
25
18
20
20
25
25
14
20
18
15
20
20
5
5
5
5
TBD
TBD
TBD
TBD
TBD
TBD
SMT
Chip & Wire
SMT
Chip & Wire
SMT
SMT
SMT
SMT
SMT
SMT
2-Way
2-Way
2-Way
2-Way
4-Way
2-Way
2-Way
2-Way
2-Way
2-Way
1) Electrical Specifications at 25ºC; Over Temperature Performance TBD.
2) Load VSWR not to Exceed 1.2:1; Base Temperature not to Exceed 85ºC.
Phone: +1.315.655.8710 | Email: DLISales@knowles.com | www.dilabs.com
10083-6/16
Power Dividers
Soldering Information
DLI solderable components are compatible with both
SnPb and 100% Sn mounting methods. Unless otherwise
specified, component termination metal is Ni/Au. Gold
layer is less than 6 micro-inch to eliminate any Au
embrittlement concern. A detailed application note is
available at dilabs.com.
Use of Silver Loaded Epoxy Adhesives
Use of conductive epoxy in place of solders is not
recommended on our solder surface mountable
components. Isolation must be maintained between the
ground plane and signal traces when mounted on PCB.
Epoxy may bleed out and degrade performance.
Board Layout Design (SMT)
Board layout for each surface mountable device will
require a ground plane with RF I/O traces. Each catalog
part number may require a different PCB pattern
recommendation and the individual datasheet and pattern
recommendation should be reviewed. Devices are designed
for a single ended 50 ohm system unless otherwise stated.
Proper transmission line impedance is required to meet
published electrical specifications.
Published test data of component on Rogers RO4350B
®
10
mil thick material. Components were designed to work with
other board materials when source impedance are matched
to 50Ω. Please contact DLI Applications Engineering with
any questions on use of other RF layer.
See dilabs.com for more detailed application note on board
mounting recommendations.
RoHS
All products are RoHS compliant.
Chip and Wire Information
DLI wire bond devices are designed for silver loaded
epoxy adhesives to ground plane. A wire bond to I/O
pad with thermo compression ball or wedge bonding on
MIL-STD gold thickness (min 50 micro-inch). Device is
also compatible with standard die attach methods but not
compatible with Sn or SnPb solderable methods. Follow
typical microwave wire bonding practices to minimize
added inductance that may adversely impact electrical
performance.
Packaging
Components will be packaged in best standard commercial
practices unless otherwise noted or requested. Packaging
options include bulk and tape and reel.
Handling & Storage
Components should never be handled with fingers;
perspiration and skin oils can inhibit solderability or wire
bond ability and will aggravate cleaning.
Ceramic components should never be handled with metallic
instruments. Metal tweezers should never be used as these
can chip the product and leave abraded metal tracks on
the product surface. Plastic, carbon fiber and plastic coated
metal types are readily available and recommended.
Devices are designed to withstand typical storage
conditions. Devices may be stored between -55°C and
+125°C and in a non-condensing environment.
Taped product should be stored out of direct sunlight, which
might promote deterioration in tape performance.
Product, stored under the conditions recommended above,
in its “as received” packaging, has a minimum shelf life of
2 years.
Knowles (Cazenovia)
2777 Route 20 East, Cazenovia, NY 13035
Phone: +1.315.655.8710 | Email: DLISales@knowles.com | www.dilabs.com
10083-6/16
MicroPython Open Source section
京公网安备 11010802033920号
EEWORLD
