For board-to-FPC
Narrow Pitch Connectors
(0.35mm pitch)
S35
Excellent contact reliability and mating in a super miniature size (width 1.7 mm)
FEATURES
1. Slim: width 1.7mm
2. Low profile construction: mated height 0.6 mm/0.8 mm
3. “TOUGH CONTACT” construction withstands tough
environments despite being slim and low profile.
4. For 0.6mm mated height, thanks to our proprietary “Fine
fitting” construction, high removability with a nice click feel
is maintained while being low profile.
1.7mm
1.5mm
Socket
Header
APPLICATIONS
Wearable devices, smartphones and hearable devices
DETAILED FEATURES
Width 1.7mm slim and two-piece type connector
Proprietary “TOUGH CONTACT” construction for both high
contact reliability and good workability while being slim and
low profile
Mated height 0.6mm
2-point soldering
Socket
Header
Mated height 0.6mm
Smaller compared to A35US; Width: approx. 23% down
<Mating cross section>
Mated
height
0.6mm
S35
1.7mm
（S35）
Approx.
23% down
1.7mm
0.35mm
(pitch)
8.45mm
(34 pins)
1.5mm
0.35mm
(pitch)
7.75mm
(34 pins)
2.2mm
（A35US）
Mated height 0.8mm
Smaller compared to A35S/A4S; Width: approx. 32% down
Mated height 0.8mm
2-point soldering
Socket
Header
<Mating cross section>
Mated
height
0.8mm
S35
1.7mm
（S35）
Approx.
32% down
1.7mm
0.35mm
(pitch)
8.30mm
(34 pins)
1.5mm
0.35mm 7.60mm
(pitch)
(34 pins)
2.5mm
（A35S／A4S）
–1–
ACCTB66E 201803-T
Narrow pitch connectors
S35
(0.35mm pitch)
ORDERING INFORMATION
Mated height: 0.6mm
AXG
1 4 4
1: Socket
2: Header
Number of pins
(2 digits)
Mated height
(Socket/Header)
1: 0.6 mm
4: (Fixed)
Surface treatment (Contact portion / Terminal portion)
(Socket)
4: Base: Ni plating, Surface: Au plating/Base: Ni plating, Surface: Au plating
(Header)
4: Base: Ni plating, Surface: Au plating/Base: Ni plating, Surface: Au plating
Mated height: 0.8mm
AXG
2 2 4
1: Socket
2: Header
Number of pins
(2 digits)
Mated height
(Socket/Header)
2: 0.8 mm
2: (Fixed)
Surface treatment (Contact portion / Terminal portion)
(Socket)
4: Base: Ni plating, Surface: Au plating/Base: Ni plating, Surface: Au plating
(Header)
4: Base: Ni plating, Surface: Au plating/Base: Ni plating, Surface: Au plating
PRODUCT TYPES
Mated height
Number of pins
6
10
12
16
20
24
30
34
40
44
50
54
60
12
24
34
44
Part number
Socket
AXG106144
AXG110144
AXG112144
AXG116144
AXG120144
AXG124144
AXG130144
AXG134144
AXG140144
AXG144144
AXG150144
AXG154144
AXG160144
AXG112224
AXG124224
AXG134224
AXG144224
Header
AXG206144
AXG210144
AXG212144
AXG216144
AXG220144
AXG224144
AXG230144
AXG234144
AXG240144
AXG244144
AXG250144
AXG254144
AXG260144
AXG212224
AXG224224
AXG234224
AXG244224
Inner carton (1-reel)
Packing
Outer carton
0.6mm
15,000 pieces
30,000 pieces
0.8mm
15,000 pieces
30,000 pieces
Notes: 1. Order unit: For volume production: 1-inner carton (1-reel) units. For samples, please contact our sales office.
2. Please contact our sales office for connectors having a number of pins other than those listed above.
–2–
ACCTB66E 201803-T
Narrow pitch connectors
S35
(0.35mm pitch)
SPECIFICATIONS
1. Characteristics
Item
Rated current
Rated voltage
Electrical
characteristics
Dielectric strength
Insulation resistance
Contact resistance
Specifications
Max. 0.3 A/pin contact (Max. 5 A at total pin contacts)
60V AC/DC
150V AC for 1 min.
Min. 1,000MΩ (Initial)
Max. 90mΩ
h = 0.6 mm
20 or less pins: Max. 26.0N, pin contact
Over 22 pins: Max. 1. 300 N/pin contact
×
pin
contacts (Initial stage)
h = 0.8 mm Max. 1. 300 N/pin contact
×
pin contacts
(Initial stage)
Min. 0.215N/pin contact
×
pin contacts
–55 to +85°C
The initial specification must be satisfied electrically
and mechanically.
–55 to +85°C (Products only)
–40 to +50°C (Packaging structure)
Conditions
No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for 1 min.
Using 250V DC megger (applied for 1 min.)
According to the contact resistance measurement method of
JIS C 5402
Mechanical
characteristics
Composite insertion force
Composite removal force
Ambient temperature
No icing. No condensation.
Reflow soldering:
Peak temperature: 260°C or less
(on the surface of the PC board around the connector
terminals)
Soldering iron: 300°C within 5 sec. 350°C within 3 sec.
No icing. No condensation.
Conformed to MIL-STD-202F, method 107G
Order Temperature (°C)
0
1
–55
−3
2
3
85
+3
0
4
0
–55
−3
Time (minutes)
30
Max. 5
30
Max. 5
Soldering heat resistance
Storage temperature
Environmental
characteristics
Thermal shock resistance
(Header and socket mated)
5 cycles,
insulation resistance: Min. 100MΩ,
contact resistance: Max. 90mΩ
Humidity resistance
(Header and socket mated)
Salt water spray resistance
(Header and socket mated)
H
2
S resistance
(Header and socket mated)
Lifetime
characteristics
Unit weight
Insertion and removal life
120 hours,
insulation resistance: Min. 100MΩ,
contact resistance: Max. 90mΩ
24 hours,
insulation resistance: Min. 100MΩ,
contact resistance: Max. 90mΩ
48 hours,
contact resistance: Max. 90mΩ
30 times
34 pins Socket
h = 0.6 mm: 0.01g, h = 0.8 mm: 0.02g
34 pins Header
h = 0.6 mm: 0.01g, h = 0.8 mm: 0.01g
Conformed to IEC60068-2-78
Temperature 40±2°C, Humidity 90 to 95% R.H.
Conformed to IEC60068-2-11
Temperature 35±2°C, Salt water concentration 5±1%
Temperature 40±2°C, Gas concentration 3±1 ppm,
Humidity 75 to 80% R.H.
Repeated insertion and removal cycles of max. 200 times/
hour
2. Material and surface treatment
Part name
Molded portion
Contact and Post
Material
LCP resin (UL94V-0)
Copper alloy
Surface treatment
—
Contact portion: Base: Ni plating, Surface: Au plating
Terminal portion: Base: Ni plating, Surface: Au plating (except the terminal tips)
The socket terminals close to the portion to be soldered have nickel barriers (exposed nickel
portions).
Sockets:
Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips)
Headers:
Base: Ni plating, Surface: Au plating (except the terminal tips)
Soldering terminals
Copper alloy
–3–
ACCTB66E 201803-T
京公网安备 11010802033920号
EEWORLD
