|
74HC4066D |
74HCT4066PW |
74HCT4066DB |
Description |
Analog Switch ICs QUAD BILATERL SWITCH |
Analog Switch ICs QUAD BILATERL SWITCH |
Analog Switch ICs QUAD BILATERAL SWITCH |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
Maker |
NXP |
NXP |
NXP |
Parts packaging code |
SOIC |
TSSOP |
SSOP |
package instruction |
SOP, SOP14,.25 |
4.40 MM, PLASTIC, SOT-402-1, MO-153, TSSOP-14 |
5.30 MM, PLASTIC, SOT-337-1, MO-150, SSOP-14 |
Contacts |
14 |
14 |
14 |
Reach Compliance Code |
unknown |
unknown |
unknown |
Analog Integrated Circuits - Other Types |
SPST |
SPST |
SPST |
JESD-30 code |
R-PDSO-G14 |
R-PDSO-G14 |
R-PDSO-G14 |
length |
8.65 mm |
5 mm |
6.2 mm |
Humidity sensitivity level |
1 |
1 |
1 |
normal position |
NO |
NO |
NO |
Number of channels |
1 |
1 |
1 |
Number of functions |
4 |
4 |
4 |
Number of terminals |
14 |
14 |
14 |
Nominal off-state isolation |
50 dB |
50 dB |
50 dB |
On-state resistance matching specifications |
5 Ω |
5 Ω |
5 Ω |
Maximum on-state resistance (Ron) |
142 Ω |
142 Ω |
142 Ω |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
output |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
SOP |
TSSOP |
SSOP |
Encapsulate equivalent code |
SOP14,.25 |
TSSOP14,.25 |
SSOP14,.3 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
power supply |
2/9 V |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.75 mm |
1.1 mm |
2 mm |
Maximum supply voltage (Vsup) |
10 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
2 V |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
4.5 V |
4.5 V |
4.5 V |
surface mount |
YES |
YES |
YES |
Maximum disconnect time |
45 ns |
53 ns |
53 ns |
Maximum connection time |
30 ns |
36 ns |
36 ns |
switch |
MAKE-BEFORE-BREAK |
MAKE-BEFORE-BREAK |
MAKE-BEFORE-BREAK |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
AUTOMOTIVE |
AUTOMOTIVE |
AUTOMOTIVE |
Terminal surface |
NICKEL/PALLADIUM/GOLD (NI/PD/AU) |
NICKEL PALLADIUM GOLD |
NICKEL PALLADIUM GOLD |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
1.27 mm |
0.65 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
30 |
30 |
30 |
width |
3.9 mm |
4.4 mm |
5.3 mm |
Base Number Matches |
1 |
1 |
1 |
JESD-609 code |
- |
e4 |
e4 |