Microprocessors - MPU POWER QUICC II HIP6W
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | NXP |
Parts packaging code | BGA |
package instruction | 23 X 23 MM, 1.22 MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-256 |
Contacts | 256 |
Reach Compliance Code | unknown |
ECCN code | 3A991 |
Other features | ALSO REQUIRES 3.3V SUPPLY |
Address bus width | 32 |
bit size | 32 |
boundary scan | YES |
maximum clock frequency | 66 MHz |
External data bus width | 32 |
Format | FIXED POINT |
Integrated cache | YES |
JESD-30 code | S-PBGA-B256 |
JESD-609 code | e1 |
length | 23 mm |
low power mode | YES |
Humidity sensitivity level | 3 |
Number of terminals | 256 |
Package body material | PLASTIC/EPOXY |
encapsulated code | BGA |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 245 |
Certification status | Not Qualified |
Maximum seat height | 2.54 mm |
speed | 100 MHz |
Maximum supply voltage | 1.9 V |
Minimum supply voltage | 1.7 V |
Nominal supply voltage | 1.8 V |
surface mount | YES |
technology | CMOS |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 1.27 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | 30 |
width | 23 mm |
uPs/uCs/peripheral integrated circuit type | MICROPROCESSOR, RISC |
Base Number Matches | 1 |