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MC14050BDT

Description
Buffers & Line Drivers 3-18V Hex CMOS
Categorylogic    logic   
File Size149KB,9 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Environmental Compliance
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MC14050BDT Overview

Buffers & Line Drivers 3-18V Hex CMOS

MC14050BDT Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerON Semiconductor
Parts packaging codeTSSOP
package instructionTSSOP, TSSOP16,.25
Contacts16
Reach Compliance Codeunknown
Factory Lead Time1 week
series4000/14000/40000
JESD-30 codeR-PDSO-G16
JESD-609 codee4
length5 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUFFER
Humidity sensitivity level1
Number of functions6
Number of entries1
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP16,.25
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingRAIL
Peak Reflow Temperature (Celsius)260
power supply5/15 V
Prop。Delay @ Nom-Sup140 ns
propagation delay (tpd)140 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)18 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature40
width4.4 mm

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Description Buffers & Line Drivers 3-18V Hex CMOS Buffers & Line Drivers 3-18V Hex CMOS Buffers & Line Drivers 3-18V Hex CMOS Buffers & Line Drivers 3-18V Hex CMOS Buffer Buffers & Line Drivers 3-18V Hex CMOS Buffers & Line Drivers 3-18V Hex CMOS Buffers & Line Drivers 3-18V Hex CMOS Buffers & Line Drivers 3-18V Hex CMOS Buffers & Line Drivers 3-18V Hex CMOS
Is it Rohs certified? conform to incompatible incompatible conform to incompatible incompatible conform to incompatible conform to
Maker ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor ON Semiconductor
Parts packaging code TSSOP SOIC SOIC DIP DIP DIP TSSOP SOIC SOIC
package instruction TSSOP, TSSOP16,.25 PLASTIC, SOIC-16 SOP, SOP16,.25 LEAD FREE, PLASTIC, DIP-16 PLASTIC, DIP-16 PLASTIC, DIP-16 LEAD FREE, PLASTIC, TSSOP-16 PLASTIC, SOIC-16 PLASTIC, EIAJ, SOP-16
Contacts 16 16 16 16 16 16 16 16 16
Reach Compliance Code unknown not_compliant not_compliant unknown not_compliant not_compliant unknown not_compliant unknown
series 4000/14000/40000 4000/14000/40000 4000/14000/40000 4000/14000/40000 4000/14000/40000 4000/14000/40000 4000/14000/40000 4000/14000/40000 4000/14000/40000
JESD-30 code R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDIP-T16 R-PDIP-T16 R-PDIP-T16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16
JESD-609 code e4 e0 e0 e3 e0 e0 e4 e0 e4
length 5 mm 9.9 mm 9.9 mm 19.175 mm 19.175 mm 19.175 mm 5 mm 9.9 mm 10.2 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type BUFFER BUFFER INVERTER INVERTER BUFFER INVERTER BUFFER BUFFER INVERTER
Number of functions 6 6 6 6 6 6 6 6 6
Number of entries 1 1 1 1 1 1 1 1 1
Number of terminals 16 16 16 16 16 16 16 16 16
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP SOP SOP DIP DIP DIP TSSOP SOP SOP
Encapsulate equivalent code TSSOP16,.25 SOP16,.25 SOP16,.25 DIP16,.3 DIP16,.3 DIP16,.3 TSSOP16,.25 SOP16,.25 SOP16,.3
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE
method of packing RAIL TAPE AND REEL TAPE AND REEL RAIL RAIL RAIL TAPE AND REEL RAIL TAPE AND REEL
Peak Reflow Temperature (Celsius) 260 240 240 NOT SPECIFIED NOT SPECIFIED 235 260 240 260
power supply 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V 5/15 V
Prop。Delay @ Nom-Sup 140 ns 140 ns 140 ns 140 ns 140 ns 140 ns 140 ns 140 ns 140 ns
propagation delay (tpd) 140 ns 140 ns 140 ns 140 ns 140 ns 140 ns 140 ns 140 ns 140 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO NO NO NO NO NO
Maximum seat height 1.2 mm 1.75 mm 1.75 mm 4.44 mm 4.44 mm 4.44 mm 1.2 mm 1.75 mm 2.05 mm
Maximum supply voltage (Vsup) 18 V 18 V 18 V 18 V 18 V 18 V 18 V 18 V 18 V
Minimum supply voltage (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V 3 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES NO NO NO YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb) Matte Tin (Sn) - annealed Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 0.65 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature 40 30 30 NOT SPECIFIED NOT SPECIFIED 30 40 30 40
width 4.4 mm 3.9 mm 3.9 mm 7.62 mm 7.62 mm 7.62 mm 4.4 mm 3.9 mm 5.275 mm
Humidity sensitivity level 1 - 1 - - - 1 1 3
Base Number Matches - 1 - 1 1 1 1 1 -

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