|
MC14050BDT |
MC14050BDR2 |
MC14049BDR2 |
MC14049BCPG |
MC14050BCP |
MC14049BCP |
MC14050BDTR2 |
MC14050BD |
MC14049BFEL |
Description |
Buffers & Line Drivers 3-18V Hex CMOS |
Buffers & Line Drivers 3-18V Hex CMOS |
Buffers & Line Drivers 3-18V Hex CMOS |
Buffers & Line Drivers 3-18V Hex CMOS Buffer |
Buffers & Line Drivers 3-18V Hex CMOS |
Buffers & Line Drivers 3-18V Hex CMOS |
Buffers & Line Drivers 3-18V Hex CMOS |
Buffers & Line Drivers 3-18V Hex CMOS |
Buffers & Line Drivers 3-18V Hex CMOS |
Is it Rohs certified? |
conform to |
incompatible |
incompatible |
conform to |
incompatible |
incompatible |
conform to |
incompatible |
conform to |
Maker |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
ON Semiconductor |
Parts packaging code |
TSSOP |
SOIC |
SOIC |
DIP |
DIP |
DIP |
TSSOP |
SOIC |
SOIC |
package instruction |
TSSOP, TSSOP16,.25 |
PLASTIC, SOIC-16 |
SOP, SOP16,.25 |
LEAD FREE, PLASTIC, DIP-16 |
PLASTIC, DIP-16 |
PLASTIC, DIP-16 |
LEAD FREE, PLASTIC, TSSOP-16 |
PLASTIC, SOIC-16 |
PLASTIC, EIAJ, SOP-16 |
Contacts |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
Reach Compliance Code |
unknown |
not_compliant |
not_compliant |
unknown |
not_compliant |
not_compliant |
unknown |
not_compliant |
unknown |
series |
4000/14000/40000 |
4000/14000/40000 |
4000/14000/40000 |
4000/14000/40000 |
4000/14000/40000 |
4000/14000/40000 |
4000/14000/40000 |
4000/14000/40000 |
4000/14000/40000 |
JESD-30 code |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDIP-T16 |
R-PDIP-T16 |
R-PDIP-T16 |
R-PDSO-G16 |
R-PDSO-G16 |
R-PDSO-G16 |
JESD-609 code |
e4 |
e0 |
e0 |
e3 |
e0 |
e0 |
e4 |
e0 |
e4 |
length |
5 mm |
9.9 mm |
9.9 mm |
19.175 mm |
19.175 mm |
19.175 mm |
5 mm |
9.9 mm |
10.2 mm |
Load capacitance (CL) |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
50 pF |
Logic integrated circuit type |
BUFFER |
BUFFER |
INVERTER |
INVERTER |
BUFFER |
INVERTER |
BUFFER |
BUFFER |
INVERTER |
Number of functions |
6 |
6 |
6 |
6 |
6 |
6 |
6 |
6 |
6 |
Number of entries |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
1 |
Number of terminals |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
16 |
Maximum operating temperature |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
125 °C |
Minimum operating temperature |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
-55 °C |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
TSSOP |
SOP |
SOP |
DIP |
DIP |
DIP |
TSSOP |
SOP |
SOP |
Encapsulate equivalent code |
TSSOP16,.25 |
SOP16,.25 |
SOP16,.25 |
DIP16,.3 |
DIP16,.3 |
DIP16,.3 |
TSSOP16,.25 |
SOP16,.25 |
SOP16,.3 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE |
IN-LINE |
IN-LINE |
IN-LINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE |
method of packing |
RAIL |
TAPE AND REEL |
TAPE AND REEL |
RAIL |
RAIL |
RAIL |
TAPE AND REEL |
RAIL |
TAPE AND REEL |
Peak Reflow Temperature (Celsius) |
260 |
240 |
240 |
NOT SPECIFIED |
NOT SPECIFIED |
235 |
260 |
240 |
260 |
power supply |
5/15 V |
5/15 V |
5/15 V |
5/15 V |
5/15 V |
5/15 V |
5/15 V |
5/15 V |
5/15 V |
Prop。Delay @ Nom-Sup |
140 ns |
140 ns |
140 ns |
140 ns |
140 ns |
140 ns |
140 ns |
140 ns |
140 ns |
propagation delay (tpd) |
140 ns |
140 ns |
140 ns |
140 ns |
140 ns |
140 ns |
140 ns |
140 ns |
140 ns |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Schmitt trigger |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
NO |
Maximum seat height |
1.2 mm |
1.75 mm |
1.75 mm |
4.44 mm |
4.44 mm |
4.44 mm |
1.2 mm |
1.75 mm |
2.05 mm |
Maximum supply voltage (Vsup) |
18 V |
18 V |
18 V |
18 V |
18 V |
18 V |
18 V |
18 V |
18 V |
Minimum supply voltage (Vsup) |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
surface mount |
YES |
YES |
YES |
NO |
NO |
NO |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
MILITARY |
Terminal surface |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn/Pb) |
Matte Tin (Sn) - annealed |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Lead (Sn/Pb) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
THROUGH-HOLE |
THROUGH-HOLE |
THROUGH-HOLE |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.65 mm |
1.27 mm |
1.27 mm |
2.54 mm |
2.54 mm |
2.54 mm |
0.65 mm |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
40 |
30 |
30 |
NOT SPECIFIED |
NOT SPECIFIED |
30 |
40 |
30 |
40 |
width |
4.4 mm |
3.9 mm |
3.9 mm |
7.62 mm |
7.62 mm |
7.62 mm |
4.4 mm |
3.9 mm |
5.275 mm |
Humidity sensitivity level |
1 |
- |
1 |
- |
- |
- |
1 |
1 |
3 |
Base Number Matches |
- |
1 |
- |
1 |
1 |
1 |
1 |
1 |
- |