Laser Drivers 3.3V 2.5Gbps SDH/ SONET Laser Driver
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Maxim |
| Parts packaging code | QFN |
| package instruction | HVQCCN, LCC32,.2SQ,20 |
| Contacts | 32 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Interface integrated circuit type | INTERFACE CIRCUIT |
| JESD-30 code | S-XQCC-N32 |
| JESD-609 code | e0 |
| length | 5 mm |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 32 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | HVQCCN |
| Encapsulate equivalent code | LCC32,.2SQ,20 |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 245 |
| power supply | 3.3/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1 mm |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 3.14 V |
| Nominal supply voltage | 3.3 V |
| surface mount | YES |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn85Pb15) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.5 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 5 mm |
| Base Number Matches | 1 |
| MAX3869EGJ | MAX3869E/D | MAX3869EGJ-T | |
|---|---|---|---|
| Description | Laser Drivers 3.3V 2.5Gbps SDH/ SONET Laser Driver | Laser Drivers DICE SALES, DICE12 | Laser Drivers 3.3V 2.5Gbps SDH/ SONET Laser Driver |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Parts packaging code | QFN | DIE | QFN |
| package instruction | HVQCCN, LCC32,.2SQ,20 | DIE-47 | HVQCCN, LCC32,.2SQ,20 |
| Contacts | 32 | 47 | 32 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant |
| Interface integrated circuit type | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
| JESD-30 code | S-XQCC-N32 | R-XUUC-N47 | S-XQCC-N32 |
| JESD-609 code | e0 | e0 | e0 |
| Humidity sensitivity level | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 32 | 47 | 32 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| encapsulated code | HVQCCN | DIE | HVQCCN |
| Package shape | SQUARE | RECTANGULAR | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | UNCASED CHIP | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 245 | 240 | 240 |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage | 3.14 V | 3.14 V | 3.14 V |
| Nominal supply voltage | 3.3 V | 3.3 V | 3.3 V |
| surface mount | YES | YES | YES |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn85Pb15) | TIN LEAD | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | NO LEAD | NO LEAD |
| Terminal location | QUAD | UPPER | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Is it lead-free? | Contains lead | Contains lead | - |
| Maker | Maxim | - | Maxim |
| length | 5 mm | - | 5 mm |
| Encapsulate equivalent code | LCC32,.2SQ,20 | - | LCC32,.2SQ,20 |
| power supply | 3.3/5 V | - | 3.3/5 V |
| Maximum seat height | 1 mm | - | 1 mm |
| Terminal pitch | 0.5 mm | - | 0.5 mm |
| width | 5 mm | - | 5 mm |
| Base Number Matches | 1 | 1 | - |
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