74HC4050PW,112 datasheet, PDF - EEWORLD Datasheet

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74HC4050PW,112: DescriptionBuffers & Line Drivers HEX H/L LEVEL SHFTER; Categorylogic logic; File Size154KB，14 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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74HC4050PW,112 Overview

Buffers & Line Drivers HEX H/L LEVEL SHFTER

74HC4050PW,112 Parametric

Parameter Name	Attribute value
Brand Name	NXP Semiconductor
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	TSSOP
package instruction	TSSOP, TSSOP16,.25
Contacts	16
Manufacturer packaging code	SOT403-1
Reach Compliance Code	compliant
Other features	CMOS-TTL LEVEL TRANSLATOR
series	HC/UH
JESD-30 code	R-PDSO-G16
JESD-609 code	e4
length	5 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	BUFFER
MaximumI(ol)	0.004 A
Humidity sensitivity level	1
Number of functions	6
Number of entries	1
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	TSSOP
Encapsulate equivalent code	TSSOP16,.25
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing	TUBE
Peak Reflow Temperature (Celsius)	260
power supply	2/6 V
Prop。Delay @ Nom-Sup	26 ns
propagation delay (tpd)	26 ns
Certification status	Not Qualified
Schmitt trigger	NO
Maximum seat height	1.1 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30
width	4.4 mm
Base Number Matches	1

74HC4050PW,112 Related Products

	74HC4050PW,112	74HC4050DB,112
Description	Buffers & Line Drivers HEX H/L LEVEL SHFTER	Buffers & Line Drivers HEX H/L LEVEL SHFTER
Brand Name	NXP Semiconductor	NXP Semiconductor
Is it Rohs certified?	conform to	conform to
Maker	NXP	NXP
Parts packaging code	TSSOP	SSOP1
package instruction	TSSOP, TSSOP16,.25	SSOP, SSOP16,.3
Contacts	16	16
Manufacturer packaging code	SOT403-1	SOT338-1
Reach Compliance Code	compliant	compliant
Other features	CMOS-TTL LEVEL TRANSLATOR	CMOS-TTL LEVEL TRANSLATOR
series	HC/UH	HC/UH
JESD-30 code	R-PDSO-G16	R-PDSO-G16
JESD-609 code	e4	e4
length	5 mm	6.2 mm
Load capacitance (CL)	50 pF	50 pF
Logic integrated circuit type	BUFFER	BUFFER
MaximumI(ol)	0.004 A	0.004 A
Humidity sensitivity level	1	1
Number of functions	6	6
Number of entries	1	1
Number of terminals	16	16
Maximum operating temperature	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSSOP	SSOP
Encapsulate equivalent code	TSSOP16,.25	SSOP16,.3
Package shape	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, SHRINK PITCH
method of packing	TUBE	TUBE
Peak Reflow Temperature (Celsius)	260	260
power supply	2/6 V	2/6 V
Prop。Delay @ Nom-Sup	26 ns	26 ns
propagation delay (tpd)	26 ns	26 ns
Certification status	Not Qualified	Not Qualified
Schmitt trigger	NO	NO
Maximum seat height	1.1 mm	2 mm
Maximum supply voltage (Vsup)	6 V	6 V
Minimum supply voltage (Vsup)	2 V	2 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE
Terminal surface	NICKEL PALLADIUM GOLD	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	30	30
width	4.4 mm	5.3 mm
Base Number Matches	1	1

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