0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm
High-Speed Board-to-Board Connections
FX11 Series
Stacking height : 2mm
Stacking height : 2.5mm, 3mm
Dec.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
■Features
1. Low Profile Design
The board-to-board mating height of 2mm, 2.5mm and 3mm suits
smaller, thinner case designs. (Fig.2)
10 Signal : 1 Ground Arrangement
2. Improved Transmission Efficiency Between Boards
Transmission characteristics have been improved through a design
that fixes ground plates to both sides of the header and receptacle.
Housing
m
5m
0.7
Ground Plate
Signal contact
m
5m
0.7
mm
0.5
3. 10 Signal:1 Ground Arrangement
Signal and ground are arranged in a ratio of 10 : 1 with the ground plate connected to
the board Via SMT. The ground stability achieved serves to reduce noise. (Fig.1)
Metal fitting
Ground plate and metal fitting make contact
Fig.1
4. Metal Fittings for Added Strength
Metal fittings provide for greater adhesion to the board, which
protects the connector against sheaning forces. The unique
connector design provides a connection between the fitting and the
ground plate for a stronger ground.
Stacking Height Variation
5. Suited to High-Density Applications
The signal contact pitch of 0.5mm affords a compact connector,
and reduces mounting space on the board.
Note: 2.0mm type product cannot be used or interchanged
with the 2.5mm or 3.0mm type product.
Fig.2
6. Structure Prevents Solder Wicking
A solder gap has been designed into the contact SMT portion to
prevent solder wicking. (Fig.3)
Structure Prevent Solder Wicking
7. High Contact Reliability
Effective wipe length is 0.55mm (2mm height) and 1mm(2.5mm,
3mm height) for signal contacts.
8. Optional Ground Plate
An alternate style is also available without the ground plate. The
space provided by the absence of the ground plate is filled with
additional signal contacts.
Fig.3
■
Signal Integrity Features
●Insertion-Loss-to-Crosstalk
Ratio (ICR)
The insertion-loss-to-crosstalk
ratio (ICR) with five differential
FEXT aggressors meets the
extrapolated IEEE802.3ap
specification to 10
+
Gbps.
●Differential
Impedance
The differential impedance is
100 + /- 10ø for FX11 at 50 ps
rise time(20% to 80%).
ICR 3mm(Without GND)
60
50
40
30
20
10
0
ICR
IEEEspec
0
1
2
3
4
5
6
7
8
9
10
120
115
110
105
Impedance 3mm(Without GND)
ICR(dB)
Z(ø)
100
95
90
85
80
0.8
FX11- 3mm DifferentialTDR
0.9
1
1.1
1.2
1.3
1.4
1.5
Frequency(GHz)
Time(ns)
In cases where the application will demand a high level of reliability, such as automotive,
please contact a company representative for further information.
2017.11e
1
FX11 Series●0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm High-Speed Board-to-Board Connections
B
Stacking height variation
●
With ground plate
Receptacle
Header
FX11L#-*P / *-SV
2mm
FX11L#-*S / *-SV
Receptacle
Header
FX11#-*P / *-SV
2.5mm
FX11#-*P / *-SV0.5
3mm
FX11#-*S / *-SV
●
Without ground plate
Receptacle
Header
FX11L#-*P-SV
2mm
Dec.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
FX11L#-*S-SV
Receptacle
Header
FX11#-*P-SV
2.5mm
FX11#-*P-SV0.5
3mm
FX11#-*S-SV
Note 1: The thickness of the solder paste is not included in the stacking height.
Note 2: 2mm type and 2.5mm, 3mm type, with ground plate type and without ground type are not mated with each other.
B
Cross section of mating
●
Stacking height : 2mm
●
Stacking height : 2.5mm, 3mm
(Shown for stacking height 2.5mm type.)
2
FX11 Series●0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm High-Speed Board-to-Board Connections
Stacking height : 2mm
■Product
Specifications
Rating
Rated current 0.3A
Rated voltage 50V AC
Item
Operating temperature range
Operating humidity range
Requirements
-55 to +85ç
Relative humidity 95% or less
(No condensation)
Storage temperature range
Storage humidity range
Conditions
Measured at 100V DC
150V AC applied for 1 minute
Measured at 100mA
Frequency : 10 to 55Hz, amplitude of 0.75mm
in 3 directions, 10 cycles each
Acceleration of 490m/s
2
, 11ms duration, sine half-wave
waveform, for 3 cycles in the both directions of each of the 3 axes
-10 to +60ç (Note 1)
-40
to
-70%
(Note 1)
1. Insulation resistance 100Mø or greater
2. Withstanding voltage No flashover or breakdown
3. Contact resistance
60mø or less
No electrical discontinuity for 1μs or greater
No damaged, cracked or loose parts
No electrical discontinuity for 1μs or longer
No damaged, cracked or loose parts
Dec.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
4. Vibration resistance
5. Shock resistance
6. Humidity
resistance
7. Temperature cycle
8. Mating cycles
9. Solder heat
resistance
Contact resistance of 70mø or less, insulation resistance of Temperature of 40ç, humidity of 90 to 95%,
100Mø or greater, No damaged, cracked or loose parts
duration 96h
Contact resistance of 70mø or less, insulation resistance of Temperature : -55ç
→
15 to 35ç
→
85ç
→
15 to 35ç
Time : 30 min.
→
2 to 3 min.
→
30 min.
→
2 to 3 min. for 5 cycles
100Mø or greater, No damaged, cracked or loose parts
Contact resistance of 70mø or less
No damaged, cracked or loose parts
No melting of resin portion which affects performance
50 times
Reflow : At the recommended temperature profile
Soldering iron temperature : 360ç for 5 seconds
Note 1 : The term “storage” refers to the long-term-storage status of unused items before mounting on the PCB.
The operating temperature/humidity ranges apply to the unmated state after board mounting.
■Materials
/ Finish
Part
Insulator
Contacts
Ground plate
Metal fitting
Metal plate
LCP
Copper alloy
Phosphor bronze
Phosphor bronze
Phosphor bronze
Material
Beige
Header
Receptacle
Tin plating
Tin plating
Engagement Area : Gold plating of 0.1μm
Termination Area : Flash plating
Finish
Remarks
UL94V-0
----------
----------
----------
----------
■Product
Number Structure
Refer to the chart below when determining the product specifications from the product number.
Please select from the product numbers listed in this catalog when placing orders.
Type With Ground Plate
FX11L
#
-
*
P - /
*
- SV (
**
)
1
2
4
3
5
6
Type Without Ground Plate
1
2
3
FX11L
#
-
*
P - SV (
**
)
1
2
3
4
4
5
6
Connector type
P : Header
S : Receptacle
5
6
Contact form
SV : Straight SMT
Blank, (71) : Tray packaging (Without pick-and-place tape)
(21),(91) : Embossed tape packaging (Without pick-and-place tape)
(22),(92) : Embossed tape packaging (With pick-and-place tape)
Series name : FX11L
Form Symbol
A : With guide post
B : Without guide post
Number of contacts
Type with ground plate
Signal/Ground : 60/6, 80/8,
100/10, 120/12
Type without ground plate
Signal : 68, 92, 116, 140
3
FX11 Series●0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm High-Speed Board-to-Board Connections
■Header
with Ground Plate
●
2mm stacking height
Dec.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Unit : mm
Part No.
FX11LA-60P/6-SV(71)
FX11LA-80P/8-SV(71)
HRS No.
573-0002-7 71
573-0003-0 71
No. of Contacts
Signal
60
80
100
120
60
80
100
120
Ground
6
8
10
12
6
8
10
12
A
17.5
23.5
29.5
35.5
17.5
23.5
29.5
35.5
B
12
18
24
30
12
18
24
30
C
22.6
28.6
34.6
40.6
22.6
28.6
34.6
40.6
D
18
24
30
36
-----
-----
-----
-----
-----
-----
-----
-----
E
F
Remarks
RoHS
19.4 25.5
25.4 31.5
31.4 37.5
37.4 43.5
19.4 25.5
25.4 31.5
31.4 37.5
37.4 43.5
Without guideposts
With guideposts
Yes
FX11LA-100P/10-SV(71) 573-0004-2 71
FX11LA-120P/12-SV(71) 573-0005-5 71
FX11LB-60P/6-SV(71)
FX11LB-80P/8-SV(71)
573-0012-0 71
573-0013-3 71
FX11LB-100P/10-SV(71) 573-0014-6 71
FX11LB-120P/12-SV(71) 573-0015-9 71
[Specifications number] – **, (**)
(71) : Tray packaging
(91) : Embossed tape packaging (Without pick-and-place tape)
(92) : Embossed tape packaging (With pick-and-place tape)
Note 1 : There is no polarity in terms of board mounting for this product.
Note 2 : The coplanarity of this product's SMT leads is 0.1 mm or less.
Note 3 : Please order embossed tape packaged items by the reel. (1,000 pcs/reel)
B
Recommended Land Pattern Dimensions (Metal Mask Dimensions)
Recommended metal mask thickness: 0.15 mm
Note 1 Cross-hatched portions, totaling n places, indicate the ground circuits.
2 The cross-hatched area
inside the SMT land may come into contact with the connector contacts
and thus care should be taken that the pattern does not extend beyond the SMT land width.
3 Not required in products without guideposts.
4 Do not mount a part other than this product in the area of
. Doing so will prevent the engagement
of this and the mating connector.
4
FX11 Series●0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm High-Speed Board-to-Board Connections
■Receptacle
with Ground Plate
●
2mm stacking height
Dec.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Unit : mm
Part No.
FX11LA-60S/6-SV(71)
FX11LA-80S/8-SV(71)
HRS No.
573-0102-1 71
573-0103-4 71
No. of Contacts
Signal
60
80
100
120
60
80
100
120
Ground
6
8
10
12
6
8
10
12
A
17.5
23.5
29.5
35.5
17.5
23.5
29.5
35.5
B
12
18
24
30
12
18
24
30
C
25
31
37
43
25
31
37
43
D
E
F
Remarks
RoHS
20.8 25.4 22.2
26.8 31.4 28.2
32.8 37.4 34.2
38.8 43.4 40.2
-----
-----
-----
-----
-----
-----
-----
-----
25.4 22.2
31.4 28.2
37.4 34.2
43.4 40.2
Without guideposts
With guideposts
Yes
FX11LA-100S/10-SV(71) 573-0104-7 71
FX11LA-120S/12-SV(71) 573-0105-0 71
FX11LB-60S/6-SV(71)
FX11LB-80S/8-SV(71)
573-0112-5 71
573-0113-8 71
FX11LB-100S/10-SV(71) 573-0114-0 71
FX11LB-120S/12-SV(71) 573-0115-3 71
[Specifications number] – **, (**)
(71) : Tray packaging (Without pick-and-place tape)
(91) : Embossed tape packaging (Without pick-and-place tape)
(92) : Embossed tape packaging (With pick-and-place tape)
Note 1 : There is no polarity in terms of board mounting for this product.
Note 2 : The coplanarity of this product's SMT leads is 0.1 mm or less.
Note 3 : Please order embossed tape packaged items by the reel. (1,000 pcs/reel)
B
Recommended Land Pattern Dimensions (Metal Mask Dimensions)
Recommended metal mask thickness: 0.15 mm
Note 1 Cross-hatched portions, totaling n places, indicate the ground circuits.
2 Cross-hatched portions, 2 places on both sides, indicate the metal fittings.
3 The cross-hatched area
inside the SMT land may come into contact with the connector contacts
and thus care should be taken that the pattern does not extend beyond the SMT land width.
4 Not required in products without guideposts.
5
MCU
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