BR24T64-W datasheet, PDF - EEWORLD Datasheet

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BR24T64-W: DescriptionEEPROM; Categorystorage storage; File Size1MB，37 Pages; ManufacturerROHM Semiconductor; Websitehttps://www.rohm.com/; Environmental Compliance

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BR24T64-W Overview

EEPROM

BR24T64-W Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	ROHM Semiconductor
package instruction	DIP, DIP8,.3
Reach Compliance Code	compliant
Maximum clock frequency (fCLK)	0.4 MHz
Data retention time - minimum	40
Durability	1000000 Write/Erase Cycles
I2C control byte	1010DDDR
JESD-30 code	R-PDIP-T8
JESD-609 code	e3
length	9.3 mm
memory density	65536 bit
Memory IC Type	EEPROM
memory width	8
Humidity sensitivity level	1
Number of functions	1
Number of terminals	8
word count	8192 words
character code	8000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8KX8
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8/5 V
Certification status	Not Qualified
Maximum seat height	3.7 mm
Serial bus type	I2C
Maximum standby current	0.000002 A
Maximum slew rate	0.002 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.6 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Matte Tin (Sn)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm
Maximum write cycle time (tWC)	5 ms
write protect	HARDWARE

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Description	EEPROM	EEPROM Hi-Rel Serial EEPROM of I2C BUS	EEPROM I2C BUS(2-Wre) 64K TSSOP-B8J EEPROM	EEPROM Hi-Rel Serial EEPROM of I2C BUS	EEPROM I2C BUS(2-Wre) 64K VSON008X2030 EEPROM
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to
package instruction	DIP, DIP8,.3	LSSOP, SSOP8,.25	TSSOP-8	MSOP-8	VSON-8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
Maximum clock frequency (fCLK)	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz
Data retention time - minimum	40	40	40	40	40
Durability	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles
I2C control byte	1010DDDR	1010DDDR	1010DDDR	1010DDDR	1010DDDR
JESD-30 code	R-PDIP-T8	R-PDSO-G8	S-PDSO-G8	R-PDSO-G8	R-PDSO-N8
JESD-609 code	e3	e3	e3	e3	e3
length	9.3 mm	4.4 mm	3 mm	2.9 mm	3 mm
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8
Humidity sensitivity level	1	1	1	1	1
Number of functions	1	1	1	1	1
Number of terminals	8	8	8	8	8
word count	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	8KX8	8KX8	8KX8	8KX8	8KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	LSSOP	TSSOP	VSSOP	HVSON
Encapsulate equivalent code	DIP8,.3	SSOP8,.25	TSSOP8,.19	TSSOP8,.16	SOLCC8,.11,20
Package shape	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	SMALL OUTLINE, LOW PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	225	225	225
power supply	1.8/5 V	1.8/5 V	1.8/5 V	1.8/5 V	1.8/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.7 mm	1.35 mm	1.1 mm	0.9 mm	0.6 mm
Serial bus type	I2C	I2C	I2C	I2C	I2C
Maximum standby current	0.000002 A	0.000002 A	0.000002 A	0.000002 A	0.000002 A
Maximum slew rate	0.002 mA	0.002 mA	0.002 mA	0.002 mA	0.002 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.6 V	1.6 V	1.6 V	1.6 V	1.6 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	NO	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)	Matte Tin (Sn)
Terminal form	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	NO LEAD
Terminal pitch	2.54 mm	0.65 mm	0.65 mm	0.65 mm	0.5 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	3 mm	3 mm	2.8 mm	2 mm
Maximum write cycle time (tWC)	5 ms	5 ms	5 ms	5 ms	5 ms
write protect	HARDWARE	HARDWARE	HARDWARE	HARDWARE	HARDWARE
Factory Lead Time	-	11 weeks	11 weeks	11 weeks	11 weeks
Base Number Matches	-	-	1	1	1

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