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SZMM3Z10VST1G

Description
Zener Diodes SOD-323 COPPER
CategoryDiscrete semiconductor    diode   
File Size60KB,5 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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SZMM3Z10VST1G Overview

Zener Diodes SOD-323 COPPER

SZMM3Z10VST1G Parametric

Parameter NameAttribute value
Brand NameON Semiconductor
Is it lead-free?Lead free
MakerON Semiconductor
package instructionR-PDSO-G2
Contacts2
Manufacturer packaging code477-02
Reach Compliance Codecompliant
ECCN codeEAR99
Factory Lead Time8 weeks
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance15 Ω
JESD-30 codeR-PDSO-G2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
polarityUNIDIRECTIONAL
Maximum power dissipation0.3 W
GuidelineAEC-Q101
Nominal reference voltage10 V
surface mountYES
technologyZENER
Terminal surfaceTin (Sn)
Terminal formGULL WING
Terminal locationDUAL
Maximum voltage tolerance2%
Working test current5 mA
MM3ZxxxST1G Series,
SZMM3ZxxxST1G Series
Zener Voltage Regulators
300 mW SOD−323 Surface Mount
Tight Tolerance Portfolio
www.onsemi.com
This series of Zener diodes is packaged in a SOD−323 surface
mount package that has a power dissipation of 300 mW. They are
designed to provide voltage regulation protection and are especially
attractive in situations where space is at a premium. They are well
suited for applications such as cellular phones, hand−held portables,
and high density PC boards.
Specification Features
Standard Zener Breakdown Voltage Range − 3.3 V to 36 V
Steady State Power Rating of 300 mW
Small Body Outline Dimensions:
− 0.067″ x 0.049″ (1.7 mm x 1.25 mm)
Low Body Height: 0.035″ (0.9 mm)
Package Weight: 4.507 mg/unit
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Tight Tolerance V
Z
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
SOD−323
CASE 477
STYLE 1
1
Cathode
2
Anode
MARKING DIAGRAM
XXMG
G
Mechanical Characteristics:
CASE:
Void-free, transfer-molded plastic
FINISH:
All external surfaces are corrosion resistant
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
XX = Specific Device Code
M = Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary
depending upon manufacturing location.
260°C for 10 Seconds
LEADS:
Plated with Pb−Sn or Sn only (Pb−Free)
POLARITY:
Cathode indicated by polarity band
FLAMMABILITY RATING:
UL 94 V−0
MOUNTING POSITION:
Any
ORDERING INFORMATION
Device
MM3ZxxxST1G
SZMM3ZxxxST1G
Package
SOD−323
(Pb−Free)
SOD−323
(Pb−Free)
SOD−323
(Pb−Free)
Shipping
3,000 /
Tape & Reel
3,000 /
Tape & Reel
10,000 /
Tape & Reel
MM3ZxxxST3G
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2015
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
1
December, 2015 − Rev. 24
Publication Order Number:
MM3Z2V4ST1/D
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