Supervisory Circuits Voltage Detector in 4-Bump 2x2 Chip-Scale Package
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Maxim |
Parts packaging code | BGA |
package instruction | BUMP, UCSP-4 |
Contacts | 4 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Adjustable threshold | NO |
Analog Integrated Circuits - Other Types | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 code | S-PBGA-B4 |
length | 1.1 mm |
Humidity sensitivity level | 1 |
Number of channels | 1 |
Number of functions | 1 |
Number of terminals | 4 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Encapsulate equivalent code | BGA4,2X2,20 |
Package shape | SQUARE |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | 245 |
power supply | 1.2/5.5 V |
Certification status | Not Qualified |
Maximum seat height | 0.67 mm |
Maximum supply current (Isup) | 0.00175 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 1.2 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | BICMOS |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 0.5 mm |
Terminal location | BOTTOM |
Threshold voltage nominal | +2.4V |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 1.1 mm |