MC10H161
Binary to 1−8 Decoder
(Low)
Description
The MC10H161 provides parallel decoding of a three bit binary
word to one of eight lines. The MC10H161 is useful in high−speed
multiplexer/demultiplexer applications.
The MC10H161 is designed to decode a three bit input word to one
of eight output lines. The MC10H161 output will be low when
selected while all other output are high. The enable inputs, when either
or both are high, force all outputs high.
The MC10H161 is a true parallel decoder. This eliminates unequal
parallel path delay times found in other decoder designs. These
devices are ideally suited for multiplexer/demultiplexer applications.
Features
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MARKING DIAGRAMS*
16
MC10H161L
AWLYYWW
CDIP−16
L SUFFIX
CASE 620A
1
•
Propagation Delay, 1.0 ns Typical
•
Power Dissipation, 315 mW Typical (same as MECL 10K™)
•
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
•
Voltage Compensated
•
MECL 10K Compatible
•
Pb−Free Packages are Available*
DIP PIN ASSIGNMENT
V
CC1
E0
Q3
Q2
Q1
Q0
A
V
EE
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC2
E1
Pin assignment is for Dual−in−Line
C
Package. For PLCC pin assignment, see
Q4
the Pin Conversion Tables on page 18 of
Q5
16
16
1
PDIP−16
P SUFFIX
CASE 648
1
MC10H161P
AWLYYWWG
10H161
ALYWG
Q6
Q7
B
the ON Semiconductor MECL Data
Book (DL122/D).
SOEIAJ−16
CASE 966
1 20
LOGIC DIAGRAM
E0 2
E1 15
V
CC1
= Pin 1
V
CC2
= Pin 16
V
EE
= Pin 8
A 7
6 Q0
ENABLE
INPUTS
5 Q1
E1 E0
L
L
L
L
4 Q2
L
L
L
L
3 Q3
L
L
L
L
13 Q4
L
L
L
L
12 Q5
H X
X H
11 Q6
C 14
10 Q7
TRUTH TABLE
INPUTS
OUTPUTS
C B A Q0 Q1 Q2 Q3 Q4 Q5
L L L L H H H H H
L L H H L H H H H
L H L H H L H H H
L H H H H H L H H
H L L H H H H L H
H L H H H H H H L
H H L H H H H H H
H H H H H H H H H
X X X H H H H H H
X X X H H H H H H
20 1
PLLC−20
FN SUFFIX
CASE 775
A
WL, L
YY, Y
WW, W
G
10H161G
AWLYYWW
B 9
Q6
H
H
H
H
H
H
L
H
H
H
Q7
H
H
H
H
H
H
H
L
H
H
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*For additional marking information, refer to
Application Note AND8002/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
©
Semiconductor Components Industries, LLC, 2006
February, 2006
−
Rev. 7
1
Publication Order Number:
MC10H161/D
MC10H161
Table 1. MAXIMUM RATINGS
Symbol
V
EE
V
I
I
out
T
A
T
stg
Power Supply (V
CC
= 0)
Input Voltage (V
CC
= 0)
Output Current
−
Continuous
−
Surge
Characteristic
Rating
−8.0
to 0
0 to V
EE
50
100
0 to +75
−55
to +150
−55
to +165
Unit
Vdc
Vdc
mA
°C
°C
°C
Operating Temperature Range
Storage Temperature Range
−
Plastic
−
Ceramic
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
Table 2. ELECTRICAL CHARACTERISTICS
(V
EE
=
−5.2
V
±5%)
(Note 1)
0°
Symbol
I
E
I
inH
I
inL
V
OH
V
OL
V
IH
V
IL
Characteristic
Power Supply Current
Input Current High
Input Current Low
High Output Voltage
Low Output Voltage
High Input Voltage
Low Input Voltage
Min
−
−
0.5
−1.02
−1.95
−1.17
−1.95
Max
84
465
−
−0.84
−1.63
−0.84
−1.48
Min
−
−
0.5
−0.98
−1.95
−1.13
−1.95
25°
Max
76
275
−
−0.81
−1.63
−0.81
−1.48
Min
−
−
0.3
−0.92
−1.95
−1.07
−1.95
75°
Max
84
275
−
−0.735
−1.60
−0.735
−1.45
Unit
mA
mA
mA
Vdc
Vdc
Vdc
Vdc
1. Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 linear fpm is
maintained. Outputs are terminated through a 50
W
resistor to
−2.0
V.
Table 3. AC PARAMETERS
0°
Symbol
t
pd
Characteristic
Propagation Delay
Data
Enable
Rise Time
Fall Time
Min
0.6
0.8
0.55
0.55
Max
2.0
2.3
1.7
1.7
Min
0.65
0.8
0.65
0.65
25°
Max
2.1
2.4
1.8
1.8
Min
0.7
0.9
0.7
0.7
75°
Max
2.2
2.5
1.9
1.9
ns
ns
Unit
ns
t
r
t
f
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
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2
MC10H161
TYPICAL APPLICATIONS
HIGH SPEED 16−BIT MULTIPLEXER/DEMULTIPLEXER
Control Selection
S0
S1
C
R
A
MC10H136
B
C
D
15 14 13 12 11 10 9 8
7 6 5 4 3 2
1
0
E1
C
B
A
MC10H164
D0
E1
C
B
A
MC10H164
D0
S0
S0
S1
C
R
A
MC10H136
B
C
D
E1
C
B
A
E0
MC10H161
E1
C
B
A
E0
MC10H161
S1
C
R
Start/Stop
15 14
1312
11 10 9 8
7 6 5 4 3 2 1 0
1−OF−64 LINE MULTIPLEXER
E
A B C
MC10H164
A B C
MC10H164
A B C
MC10H164
14
MSB
Q7
Q6
Q5
Q4
Q3
Q2
Q1
Q0
A B C
MC10H164
A B C
MC10H164
A B C
MC10H164
A B C
MC10H164
A B C
MC10H164
D
out
D
out
D
out
D
out
D
out
D
out
D
out
D
out
E
E
E
9
MC10H161
7
LSB
E
E
E
The Bit chosen is dependent on six−bit
code present on inputs 7, 9, 14 of the
MC10H161 and the A, B, C inputs of the
MC10H164.
E
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MC10H161
ORDERING INFORMATION
Device
MC10H161FN
MC10H161FNG
MC10H161FNR2
MC10H161FNR2G
MC10H161L
MC10H161M
MC10H161MG
MC10H161MEL
MC10H161MELG
MC10H161P
MC10H161PG
Package
PLLC−20
PLLC−20
(Pb−Free)
PLLC−20
PLLC−20
(Pb−Free)
CDIP−16
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
SOEIAJ−16
SOEIAJ−16
(Pb−Free)
PDIP−16
PDIP−16
(Pb−Free)
Shipping
†
46 Units / Rail
46 Units / Rail
500 / Tape & Reel
500 / Tape & Reel
25 Unit / Rail
50 Unit / Rail
50 Unit / Rail
2000 / Tape & Reel
2000 / Tape & Reel
25 Unit / Rail
25 Unit / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
MC10H161
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE E
B
−N−
Y BRK
D
−L−
−M−
W
D
V
0.010 (0.250)
T L−M
N
Z
0.007 (0.180)
M
T L−M
U
S
N
S
S
0.007 (0.180)
M
T L−M
N
S
20
1
X
VIEW D−D
G1
S
S
S
A
Z
R
0.007 (0.180)
M
T L−M
0.007 (0.180)
M
T L−M
S
N
N
S
S
S
H
K1
0.007 (0.180)
M
T L−M
S
N
S
C
E
G
G1
0.010 (0.250)
S
T L−M
0.004 (0.100)
J
−T−
VIEW S
S
SEATING
PLANE
K
F
VIEW S
0.007 (0.180)
M
T L−M
S
N
S
N
S
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
2. DIMENSIONS IN INCHES.
3. DATUMS
−L−, −M−,
AND
−N−
DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM
−T−,
SEATING PLANE.
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.385
0.395
0.385
0.395
0.165
0.180
0.090
0.110
0.013
0.019
0.050 BSC
0.026
0.032
0.020
−−−
0.025
−−−
0.350
0.356
0.350
0.356
0.042
0.048
0.042
0.048
0.042
0.056
−−−
0.020
2
_
10
_
0.310
0.330
0.040
−−−
MILLIMETERS
MIN
MAX
9.78
10.03
9.78
10.03
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
−−−
0.64
−−−
8.89
9.04
8.89
9.04
1.07
1.21
1.07
1.21
1.07
1.42
−−−
0.50
2
_
10
_
7.88
8.38
1.02
−−−
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5