7035L20PFI8 datasheet, PDF - EEWORLD Datasheet

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7035L20PFI8: DescriptionSRAM 8K x 18 Dual-Port RAM; Categorystorage storage; File Size662KB，20 Pages; ManufacturerIDT (Integrated Device Technology)

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7035L20PFI8 Overview

SRAM 8K x 18 Dual-Port RAM

7035L20PFI8 Parametric

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	TQFP
package instruction	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
Contacts	100
Manufacturer packaging code	PN100
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	20 ns
Other features	SEMAPHORE; AUTOMATIC POWER-DOWN
I/O type	COMMON
JESD-30 code	S-PQFP-G100
JESD-609 code	e0
length	14 mm
memory density	65536 bit
Memory IC Type	DUAL-PORT SRAM
memory width	8
Humidity sensitivity level	3
Number of functions	1
Number of ports	2
Number of terminals	100
word count	8192 words
character code	8000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	8KX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP100,.63SQ,20
Package shape	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	240
power supply	5 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.01 A
Minimum standby current	4.5 V
Maximum slew rate	0.32 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	20
width	14 mm
Base Number Matches	1

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HIGH-SPEED

8K x 18 DUAL-PORT

STATIC RAM

◆

IDT7035S/L

Features

◆

True Dual-Ported memory cells which allow simultaneous

reads of the same memory location

High-speed access

– Commercial: 15/20ns (max.)

– Industrial: 20ns (max.)

Low-power operation

– IDT7035S

Active: 800mW (typ.)

Standby: 5mW (typ.)

– IDT7035L

Active: 800mW (typ.)

Standby: 1mW (typ.)

Separate upper-byte and lower-byte control for multiplexed

bus compatibility

IDT7035 easily expands data bus width to 36 bits or more

◆

using the Master/Slave select when cascading more than

one device

M/S = H for

BUSY

output flag on Master

M/S = L for

BUSY

input on Slave

Interrupt Flag

On-chip port arbitration logic

Full on-chip hardware support of semaphore signaling

between ports

Fully asynchronous operation from either port

Battery backup operation—2V data retention

TTL-compatible, single 5V (±10%) power supply

Available in 100-pin Thin Quad Flatpack

Industrial temperature range (–40°C to +85°C) is available

for selected speeds

Green parts available. See ordering information

Functional Block Diagram

I/O

-I/O

17L

I/O

-I/O

BUSY

(1,2)

I/O

-I/O

17R

I/O

Control

I/O

Control

I/O

-I/O

BUSY

(1,2)

12L

Address

Decoder

MEMORY

ARRAY

Address

Decoder

12R

SEM

(2)

INT

ARBITRATION

INTERRUPT

SEMAPHORE

LOGIC

SEM

INT

(2)

4088 drw 01

NOTES:

1. (MASTER):

BUSY

is output; (SLAVE):

BUSY

is input.

BUSY

outputs and

INT

outputs are non-tri-stated push-pull.

JUNE 2015

DSC 4088/10

7035L20PFI8 Related Products

	7035L20PFI8	7035L20PFI	7035S15PF	7035L20PF8	7035L15PFG	7035S20PF8
Description	SRAM 8K x 18 Dual-Port RAM	SRAM 8K x 18 Dual-Port RAM	SRAM 16K X 16 DUAL PORT	SRAM 16K X 16 DUAL PORT	SRAM 8k x 18 Dual-Port 5V RAM 9pF Cin	SRAM 16K X 16 DUAL PORT
Brand Name	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Lead free	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	conform to	incompatible
Parts packaging code	TQFP	TQFP	TQFP	TQFP	TQFP	TQFP
package instruction	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100	QFP,	14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
Contacts	100	100	100	100	100	100
Manufacturer packaging code	PN100	PN100	PN100	PN100	PNG100	PN100
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	20 ns	20 ns	15 ns	20 ns	15 ns	20 ns
JESD-30 code	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100	S-PQFP-G100
JESD-609 code	e0	e0	e0	e0	e3	e0
memory density	65536 bit	147456 bit	147456 bit	65536 bit	147456 bit	65536 bit
Memory IC Type	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
memory width	8	18	18	8	18	8
Humidity sensitivity level	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1
Number of terminals	100	100	100	100	100	100
word count	8192 words	8192 words	8192 words	8192 words	8192 words	8192 words
character code	8000	8000	8000	8000	8000	8000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	70 °C	70 °C	70 °C	70 °C
organize	8KX8	8KX18	8KX18	8KX8	8KX18	8KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFQFP	LFQFP	LFQFP	QFP	LFQFP
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK	FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	240	240	240	240	260	240
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin (Sn)	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	20	20	20	20	NOT SPECIFIED	20
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)
Other features	SEMAPHORE; AUTOMATIC POWER-DOWN	INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE	INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE	SEMAPHORE; AUTOMATIC POWER-DOWN	-	SEMAPHORE; AUTOMATIC POWER-DOWN
I/O type	COMMON	COMMON	COMMON	COMMON	-	COMMON
length	14 mm	14 mm	14 mm	14 mm	-	14 mm
Number of ports	2	2	2	2	-	2
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	-	3-STATE
Encapsulate equivalent code	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20	QFP100,.63SQ,20	-	QFP100,.63SQ,20
power supply	5 V	5 V	5 V	5 V	-	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.6 mm	-	1.6 mm
Maximum standby current	0.01 A	0.01 A	0.015 A	0.0015 A	-	0.015 A
Minimum standby current	4.5 V	4.5 V	4.5 V	2 V	-	4.5 V
Maximum slew rate	0.32 mA	0.32 mA	0.31 mA	0.24 mA	-	0.29 mA
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	-	0.5 mm
width	14 mm	14 mm	14 mm	14 mm	-	14 mm

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