|
MAX1123EGK+D |
MAX1123EGK+TD |
Description |
Analog to Digital Converters - ADC 1.8V, 10-Bit, 210Msps Analog-to-Digital Converter with LVDS Outputs for Wideband Applications |
Analog to Digital Converters - ADC 1.8V, 10-Bit, 210Msps Analog-to-Digital Converter with LVDS Outputs for Wideband Applications |
Is it lead-free? |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
Maker |
Maxim |
Maxim |
Parts packaging code |
QFN |
QFN |
package instruction |
HVQCCN, LCC68,.4SQ,20 |
HVQCCN, LCC68,.4SQ,20 |
Contacts |
68 |
68 |
Reach Compliance Code |
compliant |
compliant |
ECCN code |
3A991.C.1 |
3A991.C.1 |
Factory Lead Time |
6 weeks |
6 weeks |
Maximum analog input voltage |
1.375 V |
1.375 V |
Minimum analog input voltage |
1.1 V |
1.1 V |
Converter type |
ADC, PROPRIETARY METHOD |
ADC, PROPRIETARY METHOD |
JESD-30 code |
S-XQCC-N68 |
S-XQCC-N68 |
JESD-609 code |
e3 |
e3 |
length |
10 mm |
10 mm |
Maximum linear error (EL) |
0.1953% |
0.1953% |
Humidity sensitivity level |
3 |
3 |
Number of analog input channels |
1 |
1 |
Number of digits |
10 |
10 |
Number of functions |
1 |
1 |
Number of terminals |
68 |
68 |
Maximum operating temperature |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
Output bit code |
BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY |
BINARY, OFFSET BINARY, 2\'S COMPLEMENT BINARY |
Output format |
PARALLEL, WORD |
PARALLEL, WORD |
Package body material |
UNSPECIFIED |
UNSPECIFIED |
encapsulated code |
HVQCCN |
HVQCCN |
Encapsulate equivalent code |
LCC68,.4SQ,20 |
LCC68,.4SQ,20 |
Package shape |
SQUARE |
SQUARE |
Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
Peak Reflow Temperature (Celsius) |
260 |
260 |
power supply |
1.8 V |
1.8 V |
Certification status |
Not Qualified |
Not Qualified |
Sampling rate |
210 MHz |
210 MHz |
Sample and hold/Track and hold |
TRACK |
TRACK |
Maximum seat height |
0.9 mm |
0.9 mm |
Nominal supply voltage |
1.8 V |
1.8 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
MATTE TIN |
MATTE TIN |
Terminal form |
NO LEAD |
NO LEAD |
Terminal pitch |
0.5 mm |
0.5 mm |
Terminal location |
QUAD |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
width |
10 mm |
10 mm |