1-Gbit x16 DDR Mobile-RAM
| Parameter Name | Attribute value |
| Is it Rohs certified? | conform to |
| Maker | QIMONDA |
| Parts packaging code | DSBGA |
| package instruction | TFBGA, BGA60,9X10,32 |
| Contacts | 60 |
| Reach Compliance Code | unknow |
| ECCN code | EAR99 |
| access mode | FOUR BANK PAGE BURST |
| Maximum access time | 5.5 ns |
| Other features | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK) | 166 MHz |
| I/O type | COMMON |
| interleaved burst length | 2,4,8,16 |
| JESD-30 code | R-PBGA-B60 |
| length | 11 mm |
| memory density | 1073741824 bi |
| Memory IC Type | DDR DRAM |
| memory width | 16 |
| Humidity sensitivity level | 3 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 60 |
| word count | 67108864 words |
| character code | 64000000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -25 °C |
| organize | 64MX16 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TFBGA |
| Encapsulate equivalent code | BGA60,9X10,32 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 1.8 V |
| Certification status | Not Qualified |
| refresh cycle | 8192 |
| Maximum seat height | 1.07 mm |
| self refresh | YES |
| Continuous burst length | 2,4,8,16 |
| Maximum standby current | 0.0012 A |
| Maximum slew rate | 0.37 mA |
| Maximum supply voltage (Vsup) | 1.9 V |
| Minimum supply voltage (Vsup) | 1.7 V |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 40 |
| width | 10.5 mm |
| HYE18M1G161BF-6 | HYB18M1G16 | HYE18M1G16 | HYE18M1G161BF-7.5 | HYE18M1G160BF-7.5 | HYE18M1G160BF-6 | |
|---|---|---|---|---|---|---|
| Description | 1-Gbit x16 DDR Mobile-RAM | 1-Gbit x16 DDR Mobile-RAM | 1-Gbit x16 DDR Mobile-RAM | 1-Gbit x16 DDR Mobile-RAM | 1-Gbit x16 DDR Mobile-RAM | 1-Gbit x16 DDR Mobile-RAM |
| Is it Rohs certified? | conform to | - | - | conform to | conform to | conform to |
| Maker | QIMONDA | - | - | QIMONDA | QIMONDA | QIMONDA |
| Parts packaging code | DSBGA | - | - | DSBGA | DSBGA | DSBGA |
| package instruction | TFBGA, BGA60,9X10,32 | - | - | TFBGA, BGA60,9X10,32 | TFBGA, BGA60,9X10,32 | TFBGA, BGA60,9X10,32 |
| Contacts | 60 | - | - | 60 | 60 | 60 |
| Reach Compliance Code | unknow | - | - | unknow | unknow | unknow |
| ECCN code | EAR99 | - | - | EAR99 | EAR99 | EAR99 |
| access mode | FOUR BANK PAGE BURST | - | - | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
| Maximum access time | 5.5 ns | - | - | 6.5 ns | 6.5 ns | 5.5 ns |
| Other features | AUTO/SELF REFRESH | - | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| Maximum clock frequency (fCLK) | 166 MHz | - | - | 133 MHz | 133 MHz | 166 MHz |
| I/O type | COMMON | - | - | COMMON | COMMON | COMMON |
| interleaved burst length | 2,4,8,16 | - | - | 2,4,8,16 | 2,4,8,16 | 2,4,8,16 |
| JESD-30 code | R-PBGA-B60 | - | - | R-PBGA-B60 | R-PBGA-B60 | R-PBGA-B60 |
| length | 11 mm | - | - | 11 mm | 11 mm | 11 mm |
| memory density | 1073741824 bi | - | - | 1073741824 bi | 1073741824 bi | 1073741824 bi |
| Memory IC Type | DDR DRAM | - | - | DDR DRAM | DDR DRAM | DDR DRAM |
| memory width | 16 | - | - | 16 | 16 | 16 |
| Humidity sensitivity level | 3 | - | - | 3 | 3 | 3 |
| Number of functions | 1 | - | - | 1 | 1 | 1 |
| Number of ports | 1 | - | - | 1 | 1 | 1 |
| Number of terminals | 60 | - | - | 60 | 60 | 60 |
| word count | 67108864 words | - | - | 67108864 words | 67108864 words | 67108864 words |
| character code | 64000000 | - | - | 64000000 | 64000000 | 64000000 |
| Operating mode | SYNCHRONOUS | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | - | - | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -25 °C | - | - | -25 °C | -25 °C | -25 °C |
| organize | 64MX16 | - | - | 64MX16 | 64MX16 | 64MX16 |
| Output characteristics | 3-STATE | - | - | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TFBGA | - | - | TFBGA | TFBGA | TFBGA |
| Encapsulate equivalent code | BGA60,9X10,32 | - | - | BGA60,9X10,32 | BGA60,9X10,32 | BGA60,9X10,32 |
| Package shape | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | GRID ARRAY, THIN PROFILE, FINE PITCH | - | - | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Celsius) | 260 | - | - | 260 | 260 | 260 |
| power supply | 1.8 V | - | - | 1.8 V | 1.8 V | 1.8 V |
| Certification status | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| refresh cycle | 8192 | - | - | 8192 | 8192 | 8192 |
| Maximum seat height | 1.07 mm | - | - | 1.07 mm | 1.07 mm | 1.07 mm |
| self refresh | YES | - | - | YES | YES | YES |
| Continuous burst length | 2,4,8,16 | - | - | 2,4,8,16 | 2,4,8,16 | 2,4,8,16 |
| Maximum standby current | 0.0012 A | - | - | 0.0012 A | 0.0012 A | 0.0012 A |
| Maximum slew rate | 0.37 mA | - | - | 0.27 mA | 0.27 mA | 0.37 mA |
| Maximum supply voltage (Vsup) | 1.9 V | - | - | 1.9 V | 1.9 V | 1.9 V |
| Minimum supply voltage (Vsup) | 1.7 V | - | - | 1.7 V | 1.7 V | 1.7 V |
| Nominal supply voltage (Vsup) | 1.8 V | - | - | 1.8 V | 1.8 V | 1.8 V |
| surface mount | YES | - | - | YES | YES | YES |
| technology | CMOS | - | - | CMOS | CMOS | CMOS |
| Temperature level | OTHER | - | - | OTHER | OTHER | OTHER |
| Terminal form | BALL | - | - | BALL | BALL | BALL |
| Terminal pitch | 0.8 mm | - | - | 0.8 mm | 0.8 mm | 0.8 mm |
| Terminal location | BOTTOM | - | - | BOTTOM | BOTTOM | BOTTOM |
| Maximum time at peak reflow temperature | 40 | - | - | 40 | 40 | 40 |
| width | 10.5 mm | - | - | 10.5 mm | 10.5 mm | 10.5 mm |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD
