DS33R41 datasheet, PDF - EEWORLD Datasheet

DS33R41: DescriptionTelecom Interface ICs Inv-Mult Enet Mapper w/Quad T1/E1/J1 Trx; CategoryWireless rf/communication Telecom circuit; File Size2MB，335 Pages; ManufacturerMaxim; Websitehttps://www.maximintegrated.com/en.html

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Telecom Interface ICs Inv-Mult Enet Mapper w/Quad T1/E1/J1 Trx

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Maxim
Parts packaging code	BGA
package instruction	27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-400
Contacts	400
Reach Compliance Code	not_compliant
ECCN code	EAR99
Factory Lead Time	1 week
JESD-30 code	S-PBGA-B400
JESD-609 code	e0
length	27 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	400
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	240
Certification status	Not Qualified
Maximum seat height	2.54 mm
Nominal supply voltage	1.8 V
surface mount	YES
Telecom integrated circuit types	FRAMER
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
width	27 mm

	DS33R41	DS33R41+
Description	Telecom Interface ICs Inv-Mult Enet Mapper w/Quad T1/E1/J1 Trx	Telecom Interface ICs Inv-Mult Enet Mapper w/Quad T1/E1/J1 Trx
Is it lead-free?	Contains lead	Lead free
Is it Rohs certified?	incompatible	conform to
Maker	Maxim	Maxim
Parts packaging code	BGA	BGA
package instruction	27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-400	BGA,
Contacts	400	400
Reach Compliance Code	not_compliant	compliant
ECCN code	EAR99	EAR99
JESD-30 code	S-PBGA-B400	S-PBGA-B400
JESD-609 code	e0	e1
length	27 mm	27 mm
Humidity sensitivity level	3	3
Number of functions	1	1
Number of terminals	400	400
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	240	260
Certification status	Not Qualified	Not Qualified
Maximum seat height	2.54 mm	2.54 mm
Nominal supply voltage	1.8 V	1.8 V
surface mount	YES	YES
Telecom integrated circuit types	FRAMER	FRAMER
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	20	NOT SPECIFIED
width	27 mm	27 mm

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