|
72V3624L10PF8 |
72V3624L15PF8 |
72V3624L10PF |
Description |
FIFO 256X36X2 BIDIRECTIONAL/BU |
FIFO 3.3V 256X36 BIDIRECTIONAL |
FIFO 256X36X2 BIDIRECTIONAL/BU |
Brand Name |
Integrated Device Technology |
Integrated Device Technology |
Integrated Device Technology |
Is it lead-free? |
Contains lead |
Contains lead |
Contains lead |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
Maker |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
IDT (Integrated Device Technology) |
Parts packaging code |
TQFP |
TQFP |
TQFP |
package instruction |
TQFP-128 |
TQFP-128 |
TQFP-128 |
Contacts |
128 |
128 |
128 |
Manufacturer packaging code |
PK128 |
PK128 |
PK128 |
Reach Compliance Code |
not_compliant |
not_compliant |
not_compliant |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
Maximum access time |
6.5 ns |
10 ns |
6.5 ns |
Maximum clock frequency (fCLK) |
100 MHz |
66.7 MHz |
100 MHz |
period time |
10 ns |
15 ns |
10 ns |
JESD-30 code |
R-PQFP-G128 |
R-PQFP-G128 |
R-PQFP-G128 |
JESD-609 code |
e0 |
e0 |
e0 |
length |
20 mm |
20 mm |
20 mm |
memory density |
9216 bit |
9216 bit |
9216 bit |
Memory IC Type |
BI-DIRECTIONAL FIFO |
BI-DIRECTIONAL FIFO |
BI-DIRECTIONAL FIFO |
memory width |
36 |
36 |
36 |
Humidity sensitivity level |
3 |
3 |
3 |
Number of functions |
1 |
1 |
1 |
Number of terminals |
128 |
128 |
128 |
word count |
256 words |
256 words |
256 words |
character code |
256 |
256 |
256 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
70 °C |
70 °C |
70 °C |
organize |
256X36 |
256X36 |
256X36 |
Exportable |
YES |
YES |
YES |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
LFQFP |
LFQFP |
LFQFP |
Encapsulate equivalent code |
QFP128,.63X.87,20 |
QFP128,.63X.87,20 |
QFP128,.63X.87,20 |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
FLATPACK, LOW PROFILE, FINE PITCH |
Parallel/Serial |
PARALLEL |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
225 |
225 |
225 |
power supply |
3.3 V |
3.3 V |
3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1.6 mm |
1.6 mm |
1.6 mm |
Maximum standby current |
0.001 A |
0.001 A |
0.001 A |
Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
3.6 V |
Minimum supply voltage (Vsup) |
3 V |
3 V |
3 V |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
surface mount |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
Tin/Lead (Sn85Pb15) |
Terminal form |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.5 mm |
0.5 mm |
0.5 mm |
Terminal location |
QUAD |
QUAD |
QUAD |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
width |
14 mm |
14 mm |
14 mm |
Base Number Matches |
1 |
- |
1 |