723626L12PF datasheet, PDF - EEWORLD Datasheet

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723626L12PF: DescriptionFIFO 256 x 36 x 2 Triple-Bus FIFO, 5.0V; Categorystorage storage; File Size235KB，35 Pages; ManufacturerIDT (Integrated Device Technology)

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723626L12PF Overview

FIFO 256 x 36 x 2 Triple-Bus FIFO, 5.0V

723626L12PF Parametric

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	TQFP
package instruction	TQFP-128
Contacts	128
Manufacturer packaging code	PK128
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	8 ns
Other features	MAILBOX
Maximum clock frequency (fCLK)	83 MHz
period time	12 ns
JESD-30 code	R-PQFP-G128
JESD-609 code	e0
length	20 mm
memory density	9216 bit
Memory IC Type	BI-DIRECTIONAL FIFO
memory width	36
Humidity sensitivity level	3
Number of functions	1
Number of terminals	128
word count	256 words
character code	256
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	256X36
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LFQFP
Encapsulate equivalent code	QFP128,.63X.87,20
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	225
power supply	5 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.001 A
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm
Base Number Matches	1

723626L12PF Related Products

	723626L12PF	723646L12PF8	723626L15PF	723636L15PF8	723626L12PF8	723646L15PF
Description	FIFO 256 x 36 x 2 Triple-Bus FIFO, 5.0V	FIFO 1K x 36 x 2 Triple-Bus FIFO, 5.0V	FIFO 256 X 36 X 3 FIFO	FIFO 512 X 36 X 3 FIFO	FIFO 256 x 36 x 2 Triple-Bus FIFO, 5.0V	FIFO TRIPLE BUS FIFO
Brand Name	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	TQFP	TQFP	TQFP	TQFP	TQFP	TQFP
package instruction	TQFP-128	TQFP-128	TQFP-128	TQFP-128	TQFP-128	TQFP-128
Contacts	128	128	128	128	128	128
Manufacturer packaging code	PK128	PK128	PK128	PK128	PK128	PK128
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	8 ns	8 ns	10 ns	10 ns	8 ns	10 ns
Other features	MAILBOX	MAILBOX	MAILBOX	MAILBOX	MAILBOX	MAILBOX
Maximum clock frequency (fCLK)	83 MHz	83 MHz	66 MHz	66 MHz	83 MHz	66 MHz
period time	12 ns	12 ns	15 ns	15 ns	12 ns	15 ns
JESD-30 code	R-PQFP-G128	R-PQFP-G128	R-PQFP-G128	R-PQFP-G128	R-PQFP-G128	R-PQFP-G128
JESD-609 code	e0	e0	e0	e0	e0	e0
length	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm
memory density	9216 bit	36864 bit	9216 bit	18432 bit	9216 bit	36864 bit
Memory IC Type	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO	BI-DIRECTIONAL FIFO
memory width	36	36	36	36	36	36
Humidity sensitivity level	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1
Number of terminals	128	128	128	128	128	128
word count	256 words	1024 words	256 words	512 words	256 words	1024 words
character code	256	1000	256	512	256	1000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	256X36	1KX36	256X36	512X36	256X36	1KX36
Exportable	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP
Encapsulate equivalent code	QFP128,.63X.87,20	QFP128,.63X.87,20	QFP128,.63X.87,20	QFP128,.63X.87,20	QFP128,.63X.87,20	QFP128,.63X.87,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	225	225	225	225	225	225
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
Base Number Matches	1	1	1	1	1	-
Maker	-	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)

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