Logic Gates TinyLogic UHS 2Input NAND Gate Open Drain
| Parameter Name | Attribute value |
| Brand Name | ON Semiconductor |
| Is it lead-free? | Lead free |
| Maker | ON Semiconductor |
| package instruction | VSON, SOLCC6,.04,14 |
| Manufacturer packaging code | 517DP |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Factory Lead Time | 1 week |
| series | LVC/LCX/Z |
| JESD-30 code | S-PDSO-N6 |
| JESD-609 code | e4 |
| length | 1 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | NAND GATE |
| MaximumI(ol) | 0.024 A |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of entries | 2 |
| Number of terminals | 6 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Output characteristics | OPEN-DRAIN |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | VSON |
| Encapsulate equivalent code | SOLCC6,.04,14 |
| Package shape | SQUARE |
| Package form | SMALL OUTLINE, VERY THIN PROFILE |
| method of packing | TAPE AND REEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3 V |
| Prop。Delay @ Nom-Sup | 5.2 ns |
| propagation delay (tpd) | 13.2 ns |
| Certification status | Not Qualified |
| Maximum seat height | 0.55 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 1.65 V |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Nickel/Palladium (Ni/Pd) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.35 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 1 mm |
| Base Number Matches | 1 |
| NC7SZ38FHX | NC7SZ38L6X | NC7SZ38P5X | |
|---|---|---|---|
| Description | Logic Gates TinyLogic UHS 2Input NAND Gate Open Drain | Logic Gates 2-Input NAND Gate | Logic Gates UHS 2-Inp NAND Gate |
| Brand Name | ON Semiconductor | ON Semiconductor | ON Semiconductor |
| Is it lead-free? | Lead free | Lead free | Lead free |
| Maker | ON Semiconductor | ON Semiconductor | ON Semiconductor |
| package instruction | VSON, SOLCC6,.04,14 | VSON, SOLCC6,.04,20 | TSSOP, TSSOP5/6,.08 |
| Manufacturer packaging code | 517DP | 127EB | 419A-02 |
| Reach Compliance Code | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 1 week | 1 week | 1 week |
| series | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 code | S-PDSO-N6 | R-PDSO-N6 | R-PDSO-G5 |
| JESD-609 code | e4 | e4 | e3 |
| length | 1 mm | 1.45 mm | 2 mm |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | NAND GATE | NAND GATE | NAND GATE |
| MaximumI(ol) | 0.024 A | 0.024 A | 0.024 A |
| Humidity sensitivity level | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 |
| Number of entries | 2 | 2 | 2 |
| Number of terminals | 6 | 6 | 5 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C |
| Output characteristics | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | VSON | VSON | TSSOP |
| Encapsulate equivalent code | SOLCC6,.04,14 | SOLCC6,.04,20 | TSSOP5/6,.08 |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| method of packing | TAPE AND REEL | TAPE AND REEL | TAPE AND REEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Sup | 5.2 ns | 5.2 ns | 5.2 ns |
| propagation delay (tpd) | 13.2 ns | 13.2 ns | 13.2 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 0.55 mm | 0.55 mm | 1.1 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 1.65 V | 1.65 V | 1.65 V |
| Nominal supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Nickel/Palladium (Ni/Pd) | Gold/Nickel (Au/Ni) | Tin (Sn) |
| Terminal form | NO LEAD | NO LEAD | GULL WING |
| Terminal pitch | 0.35 mm | 0.5 mm | 0.65 mm |
| Terminal location | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 1 mm | 1 mm | 1.25 mm |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD
