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NCS2500SNEVB

Description
Power Management IC Development Tools EVAL BOARD
CategoryDevelopment board/suite/development tools   
File Size223KB,16 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
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Power Management IC Development Tools EVAL BOARD

NCS2500SNEVB Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerON Semiconductor
Product CategoryPower Management IC Development Tools
ProductEvaluation Boards
TypePower Management Specialized
Tool Is For Evaluation OfNCS2500
Input Voltage11 V
Output Current100 mA
Factory Pack Quantity1

NCS2500SNEVB Related Products

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Description Power Management IC Development Tools EVAL BOARD Operational Amplifiers - Op Amps 200MHz Current Feed- Back Ind. Temp Operational Amplifiers - Op Amps 200MHz Current Feed- Back Ind. Temp
Is it Rohs certified? - conform to conform to
Parts packaging code - SOIC TSOP
package instruction - TSSOP, TSSOP5/6,.08 LEAD FREE, SOT-23, TSOP-5
Contacts - 5 5
Reach Compliance Code - unknown unknown
ECCN code - EAR99 EAR99
Factory Lead Time - 1 week 1 week
Amplifier type - OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture - CURRENT-FEEDBACK CURRENT-FEEDBACK
Maximum average bias current (IIB) - 4 µA 4 µA
Maximum bias current (IIB) at 25C - 4 µA 4 µA
Nominal Common Mode Rejection Ratio - 55 dB 55 dB
frequency compensation - YES YES
Maximum input offset voltage - 4000 µV 4000 µV
JESD-30 code - R-PDSO-G5 R-PDSO-G5
JESD-609 code - e3 e3
length - 2 mm 3 mm
low-bias - NO NO
low-dissonance - NO NO
micropower - NO NO
Negative supply voltage upper limit - -5.5 V -5.5 V
Nominal Negative Supply Voltage (Vsup) - -2.5 V -2.5 V
Number of functions - 1 1
Number of terminals - 5 5
Maximum operating temperature - 85 °C 85 °C
Minimum operating temperature - -40 °C -40 °C
Package body material - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - TSSOP TSSOP
Encapsulate equivalent code - TSSOP5/6,.08 TSOP5/6,.11,37
Package shape - RECTANGULAR RECTANGULAR
Package form - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing - TAPE AND REEL TAPE AND REEL
Peak Reflow Temperature (Celsius) - 260 260
power - NO NO
power supply - +-2.5/+-5 V +-2.5/+-5 V
Programmable power - NO NO
Certification status - Not Qualified Not Qualified
Maximum seat height - 1.1 mm 1.1 mm
Nominal slew rate - 350 V/us 350 V/us
Maximum slew rate - 2 mA 2 mA
Supply voltage upper limit - 5.5 V 5.5 V
Nominal supply voltage (Vsup) - 2.5 V 2.5 V
surface mount - YES YES
technology - BIPOLAR BIPOLAR
Temperature level - INDUSTRIAL INDUSTRIAL
Terminal surface - Tin (Sn) Tin (Sn)
Terminal form - GULL WING GULL WING
Terminal pitch - 0.65 mm 0.95 mm
Terminal location - DUAL DUAL
Maximum time at peak reflow temperature - 40 40
broadband - YES YES
width - 1.25 mm 1.5 mm

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