EDM1-GOBLIN
Main Features
Develop your mobile embedded device quickly with the
Goblin EDM Carrier Board which features a variety of
sensors and interconnects.
HDMI, TTL and LVDS display interfaces.
Communication by dual PCI Express (with SIM cardslots).
Dual CAN Bus, Dual UART, USB and 8 GPIO’s for Industrial
control.
1
TTL
Power
12 VDC
LAN
LVDS
HDMI
PCIe
x2
2
nd
LAN
SATA
1
st
USB
OTG
I
2
S
2
nd
USB
Host
SPDIF
CANBus
x2
SD
I
2
S
1
st
SPI
x2
UART
x2
I
2
C
x2
RSVD
Buttons
+ GPIO
RTC
Specifications
Core System
System on Module EDM Type 1 compact form factor
Video
Connector
1x HDMI
1 channel LVDS 18/24 bit
RGB TTL 24 bit
Jumper selectable:
Freescale SGTL5000 (I
2
S),
TI TLV320AIC23B (I
2
S)
1x 3.5 mm jack Stereo Audio in
1x 3.5 mm jack Stereo Audio out
1x 3.5 mm jack Microphone
S/PDIF
2W amplified speaker connectors
Expansion
Expansion Slots
2x mini-PCIe + SIM cardslot
(for 3G communication)
Audio
Codec
I/O Interfaces
Connector
1x SATA
1x micro SD cardslot (SDIO)
2x Gigabit LAN
2x USB 3.0 Host
1x micro USB 3.0 / 2.0 OTG
1x UART (RS-232/422/485)
2x CAN Bus
1x UART (RS-232)
2x SPI
8x GPIO
2x I
2
C
GPMC Header
Manufacturing pins
Connector
Speaker
Header
Touch
Controller
Connector
TSC2046 (4 wire by SPI)
4 wire touch panel
Sensors
3-axis Movement
Light Sensor
Compass
Real Time Clock
ST Microelectronics LIS331DLH
Intersil ISL29023IROZ-T7
Freescale MAG3110FCR1
Maxim integrated DS1337+
Power Specifications
Input power
Battery
12 VDC
Smart battery connector
EDM Standard SOM’s and Carrier Boards
EDM1-GOBLIN
Block Diagram
HDMI
HDMI
USB
OTG 3.0
LVDS
LVDS
USB
TTL
Connector
USB HUB
3.0
Connector
Header
RJ45
LAN
PCle
mPCle
SIM
RJ45
LAN
PCle
SATA
mPCle
SIM
Header
I
2
C
SATA
SDIO
microSD
EEPROM
RTC
Connector
TI audio
OR
Line out
FS audio
I
2
S
SPDIF
314 pin
EDM
Connector
SPI
TSC2046
Touch
Mic
EEPROM
Header
Line in
2W
amplifier
UART
Speaker
3 axis
sensor
Smart
battery
module
12V
12 VDC
Input
eCompass
IC
2
RS-232
Header
UART
RS-232
RS-422
RS-485
Connector
Light
sensor
GPIO
1
CAN
Header
Header
CAN
Header
Environmental and Mechanical
Commercial : 0° to 60° C
Extended : -20° to 70° C
Industrial : -40° to 85° C
10 to 90%
Humidity
Module Connector 314 pins MXM3
3.5” Form Factor
Form Factor
147 x 102 mm
Dimensions
(5¾ x 4 inch)
>100,000 hours
MTBF
115 grams
Weight
50G / 25ms
Shock
20G / 0-600 Hz
Vibration
Temperature
Dimensions
(units in mm)
102
Ordering Information
EDM1-GOBLIN
3.5 inch form factor Goblin carrier board for
EDM type 1 system-on-modules
EDM1-GOBLIN-START
Goblin EDM type 1 evaluation board
including cablekit and adaptor
* Feel free to contact us for custom tailored Carrier Board request for
your projects.
138.50
147
EDM1-GOBLIN
95.24
2015-05. All specifications are subject to change without notice.
EDM Standard SOM’s and Carrier Boards
京公网安备 11010802033920号
EEWORLD
