TOTX177F,T datasheet, PDF - EEWORLD Datasheet

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TOTX177F,T: DescriptionFiber Optic Transmitters, Receivers, Transceivers Toslink Transmitter Panel mount 15Mbps; CategoryLED optoelectronic/LED; File Size305KB，5 Pages; ManufacturerToshiba Semiconductor; Websitehttp://toshiba-semicon-storage.com/; Environmental Compliance

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TOTX177F,T Overview

Fiber Optic Transmitters, Receivers, Transceivers Toslink Transmitter Panel mount 15Mbps

TOTX177F,T Parametric

Parameter Name	Attribute value
Product Attribute	Attribute Value
Manufacturer	Toshiba Semiconductor
Product Category	Fiber Optic Transmitters, Receivers, Transceivers
RoHS	Details
Product	Transmitters
Data Rate	0.1 MBd to 15 MBd
Fiber Type	Plastic Fiber
Operating Supply Voltage	5 V
Minimum Operating Temperature	- 20 C
Maximum Operating Temperature	+ 70 C
Packaging	Tube
Function	Fiber optic transmitter module for digital audio interface
Mounting Style	Snap In
Factory Pack Quantity	500
Transmission Distance	5 m

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TOTX177(F,T)

TENTATIVE

FIBER OPTIC TRANSMITTING MODULE

TOTX177(F,T)

FIBER OPTIC TRANSMITTING

MODULE FOR DIGITAL AUDIO

EQUIPMENT

Conforms to JEITA Standard CP- 1212

(Digital Audio Optical Interface

for Consumer Equipment).

TTL interface.

LED is driven by differential circuit.

A Self- tapping hole for easy attachment to

Audio Equipment panels.

Unit: mm

Pin Connection

1. GND

2. Vcc

3. Input

1. Maximum Ratings

(Ta = 25°C)

Characteristics

Storage Temperature

Operating Temperature

Supply Voltage

Input Voltage

Soldering Temperature

Symbol

stg

opr

sol

Rating

- 40 to 70

- 20 to 70

- 0.5 to 7

- 0.5 to V

+ 0.5

260 (Note 1)

Unit

°C

Note 1: Soldering time = 10 seconds (At a distance of 1 mm from the package).

2. Recommended Operating Conditions

Characteristics

Supply Voltage

High- Level Input Voltage

Low- Level Input Voltage

Symbol

Min

4.75

2.0

Typ.

5.0

---

Max

5.25

0.8

Unit

Handling precaution: The LED’s used in this product contain GaAs (Gallium Arsenide).

Care must be taken to protect the safety of people and the environment when scrapping or

terminal processing.

2004-02-02

TOTX177(F,T)

7. Board layout hole pattern

(Recommendation)

Unit: mm

Tolerance: ±0.05 mm

Recommended PCB thickness: 1.6 mm

8. Precautions during use

(1)

Maximum rating

The maximum ratings are the limit values which must not be exceeded during operation of device.

None of these rating value must not be exceeded. If the maximum rating value is exceeded, the

characteristics of devices may never be restored properly. In extreme cases, the device may be

permanently damages.

Lifetime of light emitters

If an optical module is used for a long period of time, degeneration in the characteristics will mostly

be due to a lowering of the fiber output power (Pf). This is caused by the degradation of the optical

output of the LEDs used as the light source. The cause of degradation of the optical output of the

LEDs may be defects in wafer crystallization or mold resin stress. The detailed causes are, however,

not clear.

The lifetime of light emitters is greatly influenced by the operating conditions and the environment in

which it is used as well as by the lifetime characteristics unique to the device type. Thus, when a light

emitting device and its operating conditions determined, Toshiba recommend that lifetime

characteristics be checked.

Depending on the environment conditions, Toshiba recommend that maintenance such as regular

checks of the amount of optical output in accordance with the condition of operating environment.

Soldering

Optical modules are comprised of internal semiconductor devices. However, in principle, optical

modules are optical components. During soldering, ensure that flux does not contact with the emitting

surface or the detecting surface. Also ensure that proper flux removal is conducted after soldering.

Some optical modules come with a protective cap. The protective cap is used to avoid malfunction

when the optical module is not in use. Note that it is not dust or waterproof.

As mentioned before, optical modules are optical components. Thus, in principle, soldering where

there may be flux residue and flux removal after soldering is not recommended. Toshiba recommend

that soldering be performed without the optical module mounted on the board. Then, after the board

has been cleaned, the optical module should be soldered on to the board manually.

If the optical module cannot be soldered manually, use non- halogen (chlorine- free) flux and make

sure, without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the

effects of flux. In such a cases, be sure to check the devices’reliability.

Vibration and shock

This module is plastic sealed and has its wire fixed by resin. This structure is relatively resistant to

vibration and shock. In actual equipment, there are sometimes cases in which vibration, shock, or

stress is applied to soldered parts or connected parts, resulting in lines cut. A care must be taken in

the design of equipment which will be subject to high levels of vibration.

Support pins

The optical transmission module TOTX177(F,T) has support pins in order to fix itself to the PCB

temporary. Please make the hole for these pins in the PCB under the condition described in board

layout hole pattern.

(2)

(3)

(4)

(5)

2004-02-02

TOTX177(F,T)

(6)

Panel attachment

TOTX177(F,T) has hole for panel attachment. Please be sure to attach it to panel with self- tapping

screw.

Solvent

When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to

pour solvent in to the optical connector ports. If solvent is inadvertently poured in to them, clean it off

using cotton tips.

Protective cap

When the TOTX177(F,T) is not in use, attach the protective cap.

Supply voltage

Use the supply voltage within the recommended operating condition (V

= 5 ± 0.25 V). Make sure

that supply voltage does not exceed the maximum rating value of 7 V, even for an instant.

Input voltage

If a voltage exceeding the maximum rating value (V

+ 0.5 V) is applied to the transmitters' input,

the internal IC may suffer damage. If there is a possibility that excessive voltage due to surges may

be added to the input terminal, insert a protective circuit.

Soldering condition

Solder at 260°C or less for no more than ten seconds.

Precautions when disposing of devices and packing materials.

When disposing devices and packing materials, follow the procedures stipulated by local regulations

in order to protect the environment against contamination.

Compound semiconductors such, as GaAs are used as LED materials in this module. When devices

are disposed of, worker safety and protection of the environment must be taken into account.

Precautions during use

Toshiba is continually working to improve the quality and reliability of their products. Nevertheless,

semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity

and their vulnerability to physical stress. It is the responsibility of the buyer, when utilizing Toshiba

products, to observe standards of safety, and to avoid situations in which the malfunction or failure of

a Toshiba product could cause loss of human life, bodily injury or damage to property.

When developing equipment, please ensure that Toshiba products are used within the specified

operating ranges set forth in the most recent product specifications. Also, please keep in mind the

precautions and conditions set forth in the Toshiba Semiconductor Reliability Handbook.

(7)

(8)

(9)

(10)

(11)

(12)

(13)

2004-02-02

TOTX177(F,T)

RESTRICTIONS ON PRODUCT USE

000707EAC

•

TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor

devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical

stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of

safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of

such TOSHIBA products could cause loss of human life, bodily injury or damage to property.

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as

set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and

conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability

Handbook” etc..

•

The TOSHIBA products listed in this document are intended for usage in general electronics applications

(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,

etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires

extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or

bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or

spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,

medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this

document shall be made at the customer’s own risk.

•

Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes

are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the

products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with

domestic garbage.

•

The information contained herein is presented only as a guide for the applications of our products. No

responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other

rights of the third parties which may result from its use. No license is granted by implication or otherwise under

any intellectual property or other rights of TOSHIBA CORPORATION or others.

•

The information contained herein is subject to change without notice.

2004-02-02

TOTX177F,T Related Products

	TOTX177F,T	TOTX177PLFT	TOTX177ALFT
Description	Fiber Optic Transmitters, Receivers, Transceivers Toslink Transmitter Panel mount 15Mbps	Fiber Optic Transmitters, Receivers, Transceivers Toslink Transmitter 15Mbps Vcc=5V	Fiber Optic Transmitters, Receivers, Transceivers 4.75 to 5.25V VCC Fiber Optic Module
Product Attribute	Attribute Value	Attribute Value	Attribute Value
Manufacturer	Toshiba Semiconductor	Toshiba Semiconductor	Toshiba Semiconductor
Product Category	Fiber Optic Transmitters, Receivers, Transceivers	Fiber Optic Transmitters, Receivers, Transceivers	Fiber Optic Transmitters, Receivers, Transceivers
RoHS	Details	Details	Details
Packaging	Tube	Tube	Tube
Factory Pack Quantity	500	1200	500
Product	Transmitters	Transmitters	-
Data Rate	0.1 MBd to 15 MBd	15 MBd	-
Fiber Type	Plastic Fiber	Plastic Fiber	-
Operating Supply Voltage	5 V	5 V	-
Function	Fiber optic transmitter module for digital audio interface	Fiber Optic Transmitting Module For Digital Audio Equipment	-

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