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93512572C339-T1A

Description
Silicon Capacitors 390pF 0202 BV:30Volt EXSC Xtreme Temp
CategoryPassive components   
File Size661KB,5 Pages
ManufacturerMurata
Websitehttps://www.murata.com
Environmental Compliance
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93512572C339-T1A Overview

Silicon Capacitors 390pF 0202 BV:30Volt EXSC Xtreme Temp

93512572C339-T1A Parametric

Parameter NameAttribute value
Product AttributeAttribute Value
ManufacturerMurata
Product CategorySilicon Capacitors
RoHSDetails
Capacitance390 pF
Tolerance15 %
Case Code - in0202
Case Code - mm0606
Operating Temperature Range- 55 C to + 250 C
Minimum Operating Temperature- 55 C
Maximum Operating Temperature+ 250 C
Length0.58 mm
Width0.58 mm
Height0.25 mm
PackagingCut Tape
PackagingMouseReel
PackagingReel
ProductSilicon Capacitors
Termination StyleSMD/SMT
TypeEmbeded and Wirebound Extreme Temperature Silicon Capacitor
Factory Pack Quantity100
Temperature Coefficient / Code1.5 %
EXSC
Embedded & Wirebond Extreme
Temperature Silicon Capacitor
Rev 3.6
Key features
n
Ultra High Operating temperature up to 250°C
n
Low profile (250µm)
n
High stability of capacitance value:
w
Temperature
<1,5%
(-55°C to +250°C)
w
Voltage <0.1%/Volts
w
Negligible capacitance loss through ageing
n
Low leakage current down to 100pA
n
High reliability
n
Aluminum Pad finishing
Thanks to the unique IPDiA Silicon capacitor
technology, most of the problems encountered in
demanding applications can be solved.
Embedded
EXtreme
Temperature
Silicon
Key applications
n
n
n
n
All applications up to 250°C, such as
downhole and defense industries
High reliability applications
Replacement of X8R and C0G dielectrics
Decoupling / Filtering / Charge pump
(i.e.: motor management, temperature
sensors)
Downsizing
n
EXSC provide the highest capacitor
stability
over
the full -55°C/+250°C temperature range in the
market with a
TC<1,5%.
The IPDiA technology offers industry leading
performances relative to
failure rate
with a
FIT<0,017.
This technology also offers
high reliability,
up to
10
times
better
than
alternative
capacitor
Capacitors
are dedicated to applications where
reliability
up to
250°C
is the main parameter.
EXSC are the most appropriate solution for Chip
On Board, Chip On Foil, Chip On Glass, Chip On
Ceramic, flip chip and embedded applications.
This technology features a capacitor integration
capability
(up
to
250nF/mm )
²
technologies, such as Tantalum or MLCC, and
eliminates cracking phenomena.
This Silicon based technology is ROHS compliant
and compatible with lead free reflow soldering
process.
which
offers
capacitance value similar to X8R dielectric, but
with better electrical performances than C0G/NP0
dielectrics, up
to 250°C.
Discussion on the practical ability of silicone pads
By the way, silicone pads can be purchased according to the device package, and the appearance and screw holes are ready. When we bought a whole roll of silicone pads, there was no problem in cutting ...
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