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42-6554-11

Description
IC & Component Sockets DIP TEST SCKT GOLD 42 PINS
CategoryThe connector    socket   
File Size448KB,1 Pages
ManufacturerAries Electronics
Environmental Compliance
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42-6554-11 Overview

IC & Component Sockets DIP TEST SCKT GOLD 42 PINS

42-6554-11 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerAries Electronics
package instructionROHS COMPLIANT
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresSTANDARD: UL 94V-0
body width0.9 inch
subject depth0.47 inch
body length2.69 inch
Contact to complete cooperationGOLD (10) OVER NICKEL (50)
Contact completed and terminatedGold (Au) - with Nickel (Ni) barrier
Contact materialBERYLLIUM COPPER
Contact styleBELLOWED TYPE
current rating1 A
Device slot typeIC SOCKET
Type of equipment usedDIP42
Dielectric withstand voltage1000VAC V
Shell materialPOLYPHENYLENE SULFIDE
Insulation resistance1000000000 Ω
JESD-609 codee4
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts42
Maximum operating temperature150 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.6 mm
Terminal pitch2.54 mm
Termination typeSOLDER
Base Number Matches1
Series 55 Universal Zero-Insertion-Force
DIP Test Socket
FEATURES
Accepts Devices on 0.300 to 0.600 [7.62 to 15.24] Centers
All Pin Count Sockets go into PCB with either 0.300 or 0.600 [7.62 or 15.24] Centers
Contacts Normally-closed to Eliminate Dependence on Plastic to Sustain Contact Integrity
Socket Handle Configured with Closed Contacts (on) when in the Up or Down Position, and
Mounted on the Right- or Left-hand Side
• Sockets may be Soldered into PCBs or Plugged into Any Socket or Receptacle
GENERAL SPECIFICATIONS
SOCKET BODY:
Black UL 94V-0 glass-filled Polyphenylene Sulfide (PPS)
ORDERING INFORMATION
HANDLE:
Stainless Steel
HANDLE KNOB:
Brass 360, 1/2-hard
XX-X55X-X X
CONTACTS:
BeCu 172 per QQ-C-533
–OR–
Spinodal Alloy
Plating
ALL BeCu CONTACTS:
50μ [1.27μ] min. Ni under plate per QQ-N-290, over plated with
0 = Sn over Ni
200μ [5.08μ] min. matte Sn per ASTM B545-97;
–OR–
200μ [5.08μ] min. 90/10 Sn/Pb per
0TL = Sn/Pb over Ni
MIL-T-10727-11 10μ [0.25μ] min. Au per MIL-G-45204
1 = Au over Ni
SPINODAL CONTACT PLATING:
50μ [1.27μ] min. NiB
6 = NiB (Spinodal only)
HIGH-TEMPERATURE BeNi CONTACT PLATING:
50μ [1.27μ] NiB
Termination
CONTACT CURRENT RATING:
1 amp
1 = Solder Pin Tail
INSULATION RESISTANCE:
1000 MΩ min.
Handle Options
DIELECTRIC WITHSTANDING VOLTAGE:
1000 VAC
1 = Left up is closed
LIFE CYCLE:
25,000 to 50,000 cycles
2 = Right up is closed
3 = Left down is closed
OPERATING TEMPERATURE:
-85°F to 221°F [-65°C to 105°C] Sn plating; 302°F [150°C]
4 = Right down is closed (std)
Au plating; 392°F [200°C] NiB plating
Row-to-Row Spacing
(btm)
RETENTION FORCE
(closed): 55g/pin based on a 0.020 [0.51] dia. test lead
3 = 0.300 [7.62]
ACCEPTS LEADS:
0.015-0.045 [0.38-1.14] wide, 0.110-0.280 [2.79-7.11] long
6 = 0.600 [15.24]
No. of Pins
24, 28, 32, 36, 40, 42, 44, 48
MOUNTING CONSIDERATIONS
• See Socket Footprint
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
FOR TEST SOCKET RECEPTACLES, SEE DATA SHEET 10003
DO NOT USE THIS SOCKET IN A BURN-IN OVEN WITH CONTACTS IN OPEN
POSITION, AS IT WILL DAMAGE THE SOCKET
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
CUSTOMIZATION: ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION.
SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE
FURNISHED, DEPENDING ON QUANTITY.
ARIES RESERVES THE RIGHT TO CHANGE PRODUCT GENERAL SPECIFICATIONS
WITHOUT NOTICE
PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE
CONSIDERED UNCONTROLLED
2609 Bartram Road
Bristol, PA 19007-6810 USA
TEL 215-781-9956
FAX 215-781-9845
WWW.ARIESELEC.COM
INFO@ARIESELEC.COM
10001
Rev. 2.0
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