71T75602S133BGGI8 datasheet, PDF

71T75602S133BGGI8: DescriptionSRAM 2.5V CORE ZBT X18 18M; Categorystorage storage; File Size252KB，27 Pages; ManufacturerIDT (Integrated Device Technology); Environmental Compliance

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SRAM 2.5V CORE ZBT X18 18M

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	IDT (Integrated Device Technology)
Parts packaging code	PBGA
package instruction	BGA, BGA119,7X17,50
Contacts	119
Manufacturer packaging code	BGG119
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	4.2 ns
Other features	PIPELINED ARCHITECTURE
Maximum clock frequency (fCLK)	133 MHz
I/O type	COMMON
JESD-30 code	R-PBGA-B119
JESD-609 code	e1
length	22 mm
memory density	18874368 bit
Memory IC Type	ZBT SRAM
memory width	36
Humidity sensitivity level	3
Number of functions	1
Number of terminals	119
word count	524288 words
character code	512000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512KX36
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA119,7X17,50
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	2.5 V
Certification status	Not Qualified
Maximum seat height	2.36 mm
Maximum standby current	0.06 A
Minimum standby current	2.38 V
Maximum slew rate	0.215 mA
Maximum supply voltage (Vsup)	2.625 V
Minimum supply voltage (Vsup)	2.375 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	14 mm
Base Number Matches	1

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