B60/C60 Series
Heat Sink System
Ohmite introduces the powerful B60/
C60 series heatsink with cam clip (Pat.
Pending) or custom mounting. This
series offers flexible, high performance
and compact heat sink with exchange-
able cam clip system for TO-247 and
TO-264 devices. The built in lip is pro-
vided for mounting ease. The optional B
series can be tapped for popular Ohmite
resistors or other devices. These power-
ful heat sinks can be thru-hole soldered
as a single or dual unit. The dual unit
can be mated to a 60mm fan for greater
thermal performance. It is the ideal type
of heat sink for high power density and
small size (3U or 4U) electronic packag-
ing with forced convection.
S e r i e S S P e C i F i C at i O N S
Heatsink
Part Number
C60-075-VE
C60-075-AE
B60-075-VE
B60-075-AE
Surface Area
(in
2
/ mm
2
)
177 / 114,300
177 / 114,300
Weight Length L
(oz / g)
(mm)
5.7 / 163
75
5.7 / 163
75
consult factory for
alternate lengths and
clip combinations
CharaCteriStiCS
Heat Sink
Spring Clip
Solder Foot
Aluminum Alloy 6063-T5 or Equivalent with either degreased or black
anodized finish.
Music Wire, Per ASTM A228 with bright nickel plating
Cold-rolled Steel, Per ASTM A-366 with pure tin over copper strike.
RoHS compliant.
Thermal Resistance from Case to
Ambient per Device ( C/watts)
Heat Dissipation
2
1.5
4 devices
Fan
60mm fan with 4 self-tapping M3.5 screws
Interface Thermal
For improvement, use thermal joint compound, 0.005 Grafoil (TGon
Resistance
800 by Laird), or phase change material (Hi-Flow by Bergquist)
Insulator (Optional) Sil-Pad 900-S, K6 800-S and K10 by Bergquist
1
2 devices
0.5
0
20
30
40
Fan Flow Rate (cfm)
50
(continued)
166
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