Gap Pad 5000S35
®
January 2015
PRODUCT DESCRIPTION
High thermal conductivity plus “S-Class”
softness and conformability
FEATURES AND BENEFITS
• High thermal conductivity: 5.0 W/m-K
• Highly conformable, “S-Class” softness
• Natural inherent tack reduces interfacial
thermal resistance
• Conforms to demanding contours and
maintains structural integrity with little
or no stress applied to fragile
component leads
• Fiberglass reinforced for puncture,
shear and tear resistance
• Excellent thermal performance at
low pressures
PROPERTY
Color
TYPICAL PROPERTIES OF GAP PAD 5000S35
IMPERIAL VALUE
Light Green
Fiberglass
0.020 to 0.125
2
3.6
1.0
35
17.5
-76 to 392
>5000
7.5
10
9
METRIC VALUE
Light Green
Fiberglass
0.508 to 3.175
2
3.6
1.0
35
121
-60 to 200
>5000
7.5
10
9
TEST METHOD
Visual
—
ASTM D374
—
ASTM D792
ASTM E1269
ASTM D2240
ASTM D575
—
ASTM D149
ASTM D150
ASTM D257
U.L. 94
ASTM D5470
Reinforcement Carrier
Thickness (inch) / (mm)
Inherent Surface Tack (1 side)
Density (Bulk Rubber) (g/cc)
Heat Capacity (J/g-K)
Hardness (Bulk Rubber) (Shore 00) (1)
Young's Modulus (psi) / (kPa) (2)
Continuous Use Temp (°F) / (°C)
ELECTRICAL
Dielectric Breakdown Voltage (Vac)
Dielectric Constant (1000 Hz)
Volume Resistivity (Ohm-meter)
Flame Rating
THERMAL
Thermal Conductivity (W/m-K)
THERMAL PERFORMANCE vs. STRAIN
V-O
5.0
V-O
5.0
10
0.32
Deflection (% strain)
Thermal Impedance (°C-in
2
/W) 0.040" (3)
20
0.29
30
0.25
1) Thirty second delay value Shore 00 hardness scale. 2)Young’s Modulus, calculated using 0.01 in/min. step rate of strain
with a sample size of 0.79 inch
2
. 3) The ASTM D5470 test fixture was used. The recorded value includes interfacial ther-
mal resistance. These values are provided for reference only. Actual application performance is directly related to the
surface roughness, flatness and pressure applied.
TYPICAL APPLICATIONS INCLUDE
• Voltage Regulator Modules (VRMs) and POLs
Gap Pad
®
5000S35 is a fiberglass-
reinforced filler and polymer featuring a
high thermal conductivity. The material
yields extremely soft characteristics while
maintaining elasticity and conformability.
The fiberglass reinforcement provides
easy handling and converting, added
electrical isolation and tear resistance. The
inherent natural tack on both sides assists
in application and allows the product to
effectively fill air gaps, enhancing the
overall thermal performance. The
top side has reduced tack for ease of
handling. Gap Pad
®
5000S35 is ideal
for high-performance applications at low
mounting pressures.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
• CD ROM/DVD ROM
• PC Board to chassis
• ASICs and DSPs
CONFIGURATIONS AVAILABLE
• Die-cut parts are available in any shape or size, separated or in sheet form
• Memory packages/modules
• Thermally-enhanced BGAs
PDS_GP_5000S35_0115
TDS Gap Pad
®
5000S35, January 2015
Disclaimer
Note:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. The product
can have a variety of different applications as well as differing application and
working conditions in your environment that are beyond our control. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In
case products are delivered by Henkel Belgium NV, Henkel Electronic
Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and
Henkel France SA please additionally note the following:
In case Henkel would be nevertheless held liable, on whatever legal ground,
Henkel’s liability will in no event exceed the amount of the concerned delivery.
In case products are delivered by Henkel Colombiana, S.A.S. the following
disclaimer is applicable:
The information provided in this Technical Data Sheet (TDS) including the
recommendations for use and application of the product are based on our
knowledge and experience of the product as at the date of this TDS. Henkel is,
therefore, not liable for the suitability of our product for the production processes
and conditions in respect of which you use them, as well as the intended
applications and results. We strongly recommend that you carry out your own
prior trials to confirm such suitability of our product.
Any liability in respect of the information in the Technical Data Sheet or any other
written or oral recommendation(s) regarding the concerned product is excluded,
except if otherwise explicitly agreed and except in relation to death or personal
injury caused by our negligence and any liability under any applicable mandatory
product liability law.
In case products are delivered by Henkel Corporation, Resin Technology
Group, Inc., or Henkel Canada Corporation, the following disclaimer is
applicable:
The data contained herein are furnished for information only and are believed to
be reliable. We cannot assume responsibility for the results obtained by others
over whose methods we have no control. It is the user’s responsibility to
determine suitability for the user’s purpose of any production methods mentioned
herein and to adopt such precautions as may be advisable for the protection of
property and of persons against any hazards that may be involved in the handling
and use thereof. In light of the foregoing,
Henkel Corporation specifically
disclaims all warranties expressed or implied, including warranties of
merchantability or fitness for a particular purpose, arising from sale or use
of Henkel Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental damages of any kind,
including lost profits.
The discussion herein of various processes or
compositions is not to be interpreted as representation that they are free from
domination of patents owned by others or as a license under any Henkel
Corporation patents that may cover such processes or compositions. We
recommend that each prospective user test his proposed application before
repetitive use, using this data as a guide. This product may be covered by one or
more United States or foreign patents or patent applications.
Trademark usage
Except as otherwise noted, all trademarks in this document are trademarks of
Henkel Corporation in the U.S. and elsewhere. ® denotes a trademark
registered in the U.S. Patent and Trademark Office
Reference 0.1
Americas
+1.800.347.4572
Europe
+31.35.5380684
For the most direct access to local sales and technical support visit: www.bergquistcompany.com
Asia
+852.2690.9296
Domestic Chip Exchange
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