Bus Driver, 2-Func, 4-Bit, True Output, TTL, PDIP20,
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Fairchild |
| Reach Compliance Code | compliant |
| Is Samacsys | N |
| Control type | ENABLE LOW |
| JESD-30 code | R-PDIP-T20 |
| JESD-609 code | e0 |
| Logic integrated circuit type | BUS DRIVER |
| MaximumI(ol) | 0.064 A |
| Humidity sensitivity level | 2A |
| Number of digits | 4 |
| Number of functions | 2 |
| Number of terminals | 20 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output characteristics | 3-STATE |
| Output polarity | TRUE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | 250 |
| power supply | 5 V |
| Maximum supply current (ICC) | 90 mA |
| Prop。Delay @ Nom-Sup | 6.5 ns |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 30 |
| Base Number Matches | 1 |
| 74F244PCQM | 5962-01-204-4547 | 74F244FCQM | 74F244FCQR | 74F244DCQM | |
|---|---|---|---|---|---|
| Description | Bus Driver, 2-Func, 4-Bit, True Output, TTL, PDIP20, | Bus Driver, 2-Func, 4-Bit, True Output, TTL, CDIP20, | Bus Driver, 2-Func, 4-Bit, True Output, TTL, CDFP20, | Bus Driver, 2-Func, 4-Bit, True Output, TTL, CDFP20, | Bus Driver, 2-Func, 4-Bit, True Output, TTL, CDIP20, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| Control type | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW | ENABLE LOW |
| JESD-30 code | R-PDIP-T20 | R-XDIP-T20 | R-XDFP-F20 | R-XDFP-F20 | R-XDIP-T20 |
| Logic integrated circuit type | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| MaximumI(ol) | 0.064 A | 0.064 A | 0.064 A | 0.064 A | 0.064 A |
| Number of digits | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Output polarity | TRUE | TRUE | TRUE | TRUE | TRUE |
| Package body material | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DFP | DFP | DIP |
| Encapsulate equivalent code | DIP20,.3 | DIP20,.3 | FL20,.3 | FL20,.3 | DIP20,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | FLATPACK | FLATPACK | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum supply current (ICC) | 90 mA | 90 mA | 90 mA | 90 mA | 90 mA |
| Prop。Delay @ Nom-Sup | 6.5 ns | 6.5 ns | 6.5 ns | 6.5 ns | 6.5 ns |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | YES | NO |
| technology | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | - | Contains lead |
| Maker | Fairchild | - | Fairchild | Fairchild | Fairchild |
| JESD-609 code | e0 | - | e0 | e0 | e0 |
| Humidity sensitivity level | 2A | 2A | 2A | - | 2A |
| Peak Reflow Temperature (Celsius) | 250 | 250 | 250 | - | 250 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | 30 | 30 | 30 | - | 30 |
| package instruction | - | DIP, DIP20,.3 | DFP, FL20,.3 | DFP, FL20,.3 | - |
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD