EEPROM 2kx8 - 1.8V Lead Free Package
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Parts packaging code | TSSOP |
| package instruction | TSSOP, TSSOP8,.19 |
| Contacts | 8 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Other features | 1 MILLION ERASE/WRITE CYCLES |
| Maximum clock frequency (fCLK) | 0.1 MHz |
| Data retention time - minimum | 200 |
| Durability | 1000000 Write/Erase Cycles |
| I2C control byte | 1010MMMR |
| JESD-30 code | S-PDSO-G8 |
| JESD-609 code | e3 |
| length | 3 mm |
| memory density | 16384 bit |
| Memory IC Type | EEPROM |
| memory width | 8 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 8 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 2KX8 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | TSSOP |
| Encapsulate equivalent code | TSSOP8,.19 |
| Package shape | SQUARE |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Parallel/Serial | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 2/5 V |
| Certification status | Not Qualified |
| Maximum seat height | 1.1 mm |
| Serial bus type | I2C |
| Maximum standby current | 0.000001 A |
| Maximum slew rate | 0.003 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 1.7 V |
| Nominal supply voltage (Vsup) | 2.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Matte Tin (Sn) |
| Terminal form | GULL WING |
| Terminal pitch | 0.65 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | 40 |
| width | 3 mm |
| Maximum write cycle time (tWC) | 5 ms |
| write protect | HARDWARE |
| Base Number Matches | 1 |
| 24AA16T-I/MSG | 24AA16-I-SNG | 24LC16BT-I-STG | 24AA16T-I/STG | 24LC16B-I/MSG | 24AA16T-I/OTG | 24AA16-I/STG | 24AA16T/SN | |
|---|---|---|---|---|---|---|---|---|
| Description | EEPROM 2kx8 - 1.8V Lead Free Package | EEPROM 2kx8 - 1.8V Lead Free Package | EEPROM 2kx8 - 2.5V Lead Free Package | EEPROM 2kx8 - 1.8V Lead Free Package | EEPROM 2kx8 - 2.5V Lead Free Package | EEPROM 2kx8 - 1.8V Lead Free Package | Electrically Erasable Programmable Read Only Memory 2kx8 - 1.8V Lead Free Package | Electrically Erasable Programmable Read Only Memory 2kx8 - 1.8V |
| Is it lead-free? | Lead free | - | - | Lead free | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | - | - | conform to | conform to | conform to | conform to | conform to |
| Parts packaging code | TSSOP | - | - | TSSOP | TSSOP | SOT-23 | TSSOP | SOIC |
| package instruction | TSSOP, TSSOP8,.19 | - | - | TSSOP, TSSOP8,.25 | ROHS COMPLIANT, PLASTIC, MO-187, MSOP-8 | LSSOP, TSOP5/6,.11,37 | TSSOP, TSSOP8,.25 | SOP, SOP8,.25 |
| Contacts | 8 | - | - | 8 | 8 | 5 | 8 | 8 |
| Reach Compliance Code | compliant | - | - | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | - | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Other features | 1 MILLION ERASE/WRITE CYCLES | - | - | 1 MILLION ERASE/WRITE CYCLES | 1 MILLION ERASE/WRITE CYCLES | 1 MILLION ERASE/WRITE CYCLES | 1 MILLION ERASE/WRITE CYCLES | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED |
| Maximum clock frequency (fCLK) | 0.1 MHz | - | - | 0.1 MHz | 0.4 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz |
| Data retention time - minimum | 200 | - | - | 200 | 200 | 200 | 200 | 200 |
| Durability | 1000000 Write/Erase Cycles | - | - | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles |
| I2C control byte | 1010MMMR | - | - | 1010MMMR | 1010MMMR | 1010MMMR | 1010MMMR | 1010MMMR |
| JESD-30 code | S-PDSO-G8 | - | - | R-PDSO-G8 | S-PDSO-G8 | R-PDSO-G5 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609 code | e3 | - | - | e3 | e3 | e3 | e3 | e3 |
| length | 3 mm | - | - | 4.4 mm | 3 mm | 2.95 mm | 4.4 mm | 4.9 mm |
| memory density | 16384 bit | - | - | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| Memory IC Type | EEPROM | - | - | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| memory width | 8 | - | - | 8 | 8 | 8 | 8 | 8 |
| Humidity sensitivity level | 1 | - | - | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | - | - | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | - | - | 8 | 8 | 5 | 8 | 8 |
| word count | 2048 words | - | - | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| character code | 2000 | - | - | 2000 | 2000 | 2000 | 2000 | 2000 |
| Operating mode | SYNCHRONOUS | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 85 °C | - | - | 85 °C | 85 °C | 85 °C | 85 °C | 70 °C |
| Minimum operating temperature | -40 °C | - | - | -40 °C | -40 °C | -40 °C | -40 °C | - |
| organize | 2KX8 | - | - | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| Package body material | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | TSSOP | - | - | TSSOP | TSSOP | LSSOP | TSSOP | SOP |
| Encapsulate equivalent code | TSSOP8,.19 | - | - | TSSOP8,.25 | TSSOP8,.19 | TSOP5/6,.11,37 | TSSOP8,.25 | SOP8,.25 |
| Package shape | SQUARE | - | - | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| Parallel/Serial | SERIAL | - | - | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| Peak Reflow Temperature (Celsius) | 260 | - | - | 260 | 260 | 260 | 260 | 260 |
| power supply | 2/5 V | - | - | 2/5 V | 2/5 V | 2/5 V | 2/5 V | 2/5 V |
| Certification status | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 1.1 mm | - | - | 1.1 mm | 1.1 mm | 1.45 mm | 1.1 mm | 1.75 mm |
| Serial bus type | I2C | - | - | I2C | I2C | I2C | I2C | I2C |
| Maximum standby current | 0.000001 A | - | - | 0.000001 A | 0.000001 A | 0.000001 A | 0.000001 A | 0.00003 A |
| Maximum slew rate | 0.003 mA | - | - | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
| Maximum supply voltage (Vsup) | 5.5 V | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 1.7 V | - | - | 1.7 V | 2.5 V | 1.7 V | 1.7 V | 1.8 V |
| Nominal supply voltage (Vsup) | 2.5 V | - | - | 2.5 V | 5 V | 2.5 V | 2.5 V | 3 V |
| surface mount | YES | - | - | YES | YES | YES | YES | YES |
| technology | CMOS | - | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Matte Tin (Sn) | - | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
| Terminal form | GULL WING | - | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 0.65 mm | - | - | 0.65 mm | 0.65 mm | 0.95 mm | 0.65 mm | 1.27 mm |
| Terminal location | DUAL | - | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | 40 | - | - | 40 | 40 | 40 | 40 | 40 |
| width | 3 mm | - | - | 3 mm | 3 mm | 1.63 mm | 3 mm | 3.9 mm |
| Maximum write cycle time (tWC) | 5 ms | - | - | 5 ms | 5 ms | 5 ms | 5 ms | 10 ms |
| write protect | HARDWARE | - | - | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
| Base Number Matches | 1 | - | - | 1 | 1 | 1 | 1 | 1 |
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