EEWORLDEEWORLDEEWORLD

Part Number

Search

S29AL032D90BAI030

Description
NOR Flash 32MB Flash 3.0V 90ns Parallel NOR Flash
Categorystorage    storage   
File Size1MB,67 Pages
ManufacturerCypress Semiconductor
Download Datasheet Parametric Compare View All

S29AL032D90BAI030 Online Shopping

Suppliers Part Number Price MOQ In stock  
S29AL032D90BAI030 - - View Buy Now

S29AL032D90BAI030 Overview

NOR Flash 32MB Flash 3.0V 90ns Parallel NOR Flash

S29AL032D90BAI030 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerCypress Semiconductor
package instruction10 X 6 MM, FBGA-48
Reach Compliance Codecompliant
Maximum access time90 ns
Other featuresTOP BOOT BLOCK
Spare memory width8
startup blockTOP
JESD-30 codeR-PBGA-B48
JESD-609 codee0
length10 mm
memory density33554432 bit
Memory IC TypeFLASH
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals48
word count2097152 words
character code2000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize2MX16
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Programming voltage3 V
Maximum seat height1 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.7 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
typeNOR TYPE
width6 mm
S29AL032D
32 Megabit CMOS 3.0 Volt-only Flash Memory
4 M x 8-Bit Uniform Sector
4 M x 8-Bit/2 M x 16-Bit Boot Sector
S29AL032D Cover Sheet
Data Sheet
Notice to Readers:
This document states the current technical specifications regarding the Spansion
product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume
such that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.
Publication Number
S29AL032D_00
Revision
A
Amendment
9
Issue Date
January 19, 2007

S29AL032D90BAI030 Related Products

S29AL032D90BAI030 S29AL032D70TFI040 S29AL032D90BFI040 S29AL032D70BFI030 S29AL032D90TAI030 S29AL032D90TAI000
Description NOR Flash 32MB Flash 3.0V 90ns Parallel NOR Flash Flash Memory 32MB Flash 3V 70ns Parallel NOR Flash NOR Flash 32MB Flash 3.0V 90ns Parallel NOR Flash NOR Flash 32MB Flash 3V 70ns Parallel NOR Flash NOR Flash 32MB Flash 3.0V 90ns Parallel NOR Flash NOR Flash 32MB Flash 3V 90ns Parallel NOR Flash
BrainPad Pulse and BrainPad Tick development boards with micropython support
BrainPad launches the new BrainPad Pulse and BrainPad Tick development boards, which have the same edge connector as microbit, helping students learn programming and EXCEL in robotics, games, circuits...
dcexpert MicroPython Open Source section
Embedded Qt - Write and run your first ARM-Qt program
The previous article: Building the Qt runtime environment for embedded Linux introduced how to build the Qt runtime environment in the Linux development board and tested the examples that come with Qt...
DDZZ669 ARM Technology
RJ45 selection for POE powered device PD
Can POE use a regular RJ45 connector (without a transformer)? Are there any current requirements? What should I pay attention to when selecting a model?...
xiaoxiao2211 Integrated technical exchanges
How are the results of CST PCB simulation displayed?
Where can I display the results of CST PCB simulation? It seems that the simulation is completed, but I don’t know where to open the simulation results...
lingking Integrated technical exchanges
Arrow Live: Focus on "TI FPD-Link III Automotive Chipset", the ideal solution for automotive video transmission
As cars become smarter, there will be more and more onboard cameras and information display screens in cars. All of these devices need to be connected to a processor. The TI FPD-Link III chipset provi...
EEWORLD社区 TI Technology Forum
Application of “C2000+TMS570” dual-chip solution in automotive electric drive functional safety
[align=left][color=rgb(85, 85, 85)][size=4] With the rapid development of new energy vehicles and the increasing complexity of automotive electronic systems, the functional safety of automobiles has r...
Jacktang DSP and ARM Processors

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号