89HPES6T6G2ZCALG datasheet, PDF

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89HPES6T6G2ZCALG: DescriptionPCI Interface IC PCI EXPRESS SWITCH; CategoryThe embedded processor and controller Microcontrollers and processors; File Size291KB，30 Pages; ManufacturerIDT (Integrated Device Technology); Environmental Compliance

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PCI Interface IC PCI EXPRESS SWITCH

89HPES6T6G2ZCALG Parametric

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	IDT (Integrated Device Technology)
Parts packaging code	FCBGA
package instruction	FCBGA-324
Contacts	324
Manufacturer packaging code	ALG324
Reach Compliance Code	compliant
ECCN code	EAR99
Samacsys Description	FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM
Other features	ALSO REQUIRES 3.3V SUPPLY
Address bus width
Bus compatibility	PCI
maximum clock frequency	100 MHz
External data bus width
JESD-30 code	S-PBGA-B324
JESD-609 code	e1
length	19 mm
Humidity sensitivity level	4
Number of terminals	324
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA324,18X18,40
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	260
power supply	1,3.3 V
Certification status	Not Qualified
Maximum seat height	3.42 mm
Maximum supply voltage	1.1 V
Minimum supply voltage	0.9 V
Nominal supply voltage	1 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	30
width	19 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, PCI
Base Number Matches	1

89HPES6T6G2ZCALG Related Products

	89HPES6T6G2ZCALG	89HPES6T6G2ZCALGI8	89HPES6T6G2ZCAL	89HPES6T6G2ZCAL8	89HPES6T6G2ZCALGI
Description	PCI Interface IC PCI EXPRESS SWITCH	PCI Interface IC PCI EXPRESS SWITCH	PCI Interface IC PCI EXPRESS SWITCH	PCI Interface IC PCI EXPRESS SWITCH	PCI Interface IC PCI EXPRESS SWITCH
Brand Name	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology
Is it lead-free?	Lead free	Lead free	Contains lead	Contains lead	Lead free
Is it Rohs certified?	conform to	conform to	incompatible	incompatible	conform to
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	FCBGA	FCBGA	FCBGA	FCBGA	FCBGA
package instruction	FCBGA-324	FCBGA-324	FCBGA-324	FCBGA-324	FCBGA-324
Contacts	324	324	324	324	324
Manufacturer packaging code	ALG324	ALG324	AL324	AL324	ALG324
Reach Compliance Code	compliant	compliant	not_compliant	not_compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Bus compatibility	PCI	PCI; SMBUS	PCI	PCI; SMBUS	PCI
maximum clock frequency	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
JESD-30 code	S-PBGA-B324	S-PBGA-B324	S-PBGA-B324	S-PBGA-B324	S-PBGA-B324
JESD-609 code	e1	e1	e0	e0	e1
length	19 mm	19 mm	19 mm	19 mm	19 mm
Humidity sensitivity level	4	4	4	4	4
Number of terminals	324	324	324	324	324
Maximum operating temperature	70 °C	85 °C	70 °C	70 °C	85 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA
Encapsulate equivalent code	BGA324,18X18,40	BGA324,18X18,40	BGA324,18X18,40	BGA324,18X18,40	BGA324,18X18,40
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	260	260	225	225	260
power supply	1,3.3 V	1,3.3 V	1,3.3 V	1,3.3 V	1,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.42 mm	3.42 mm	3.42 mm	3.42 mm	3.42 mm
Maximum supply voltage	1.1 V	1.1 V	1.1 V	1.1 V	1.1 V
Minimum supply voltage	0.9 V	0.9 V	0.9 V	0.9 V	0.9 V
Nominal supply voltage	1 V	1 V	1 V	1 V	1 V
surface mount	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Lead (Sn63Pb37)	Tin/Lead (Sn63Pb37)	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1 mm	1 mm	1 mm	1 mm	1 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	30	NOT SPECIFIED	30	NOT SPECIFIED	30
width	19 mm	19 mm	19 mm	19 mm	19 mm
uPs/uCs/peripheral integrated circuit type	BUS CONTROLLER, PCI	BUS CONTROLLER, PCI	BUS CONTROLLER, PCI	BUS CONTROLLER, PCI	BUS CONTROLLER, PCI
Base Number Matches	1	1	1	1	1
Samacsys Description	FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM	FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM	-	-	FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM

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